EP0430039A2 - Tête thermique - Google Patents

Tête thermique Download PDF

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Publication number
EP0430039A2
EP0430039A2 EP90122191A EP90122191A EP0430039A2 EP 0430039 A2 EP0430039 A2 EP 0430039A2 EP 90122191 A EP90122191 A EP 90122191A EP 90122191 A EP90122191 A EP 90122191A EP 0430039 A2 EP0430039 A2 EP 0430039A2
Authority
EP
European Patent Office
Prior art keywords
heat generating
lead patterns
generating resistors
common
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP90122191A
Other languages
German (de)
English (en)
Other versions
EP0430039B1 (fr
EP0430039A3 (en
Inventor
Masatoshi Nakanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of EP0430039A2 publication Critical patent/EP0430039A2/fr
Publication of EP0430039A3 publication Critical patent/EP0430039A3/en
Application granted granted Critical
Publication of EP0430039B1 publication Critical patent/EP0430039B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Definitions

  • the present invention generally relates to a thermal head construction, and more particularly, to a thermal head to be used in a heat transfer printer or the like.
  • a conventional thermal head of a so-called line type which includes a substrate B, for example, of alumina ceramic material (insulative substrate), a plurality of pairs of heat generating resistors R provided by forming a heat generating resistant film over an upper surface of said substrate B, a common lead pattern (or common electrode) Ce and individual lead patterns (or separate electrodes) Se respectively formed on the substrate B at the sides along opposite side edges Ra and Rb of the respective heat generating resistors R in a state confronting each other, and a protective film (not particularly shown) further formed over surfaces of said heat generating resistors R, and the lead patterns Ce and Se.
  • the known thermal head as described above is so arranged that, by causing the heat generating resistors R to selectively generate heat through impression of a pulse voltage across the lead patterns Ce and Se (i.e. the common electrode and separate electrodes), information is to be printed on a recording paper fed in a state overlapped under pressure with a thermo-sensitive paper (thermo-­ sensitive ribbon) with respect to said heat generating resistors R.
  • the lead patterns Ce and Se are respectively formed at the opposite side edges Ra and Rb of the heat generating resistors R as shown in Fig. 4.
  • the separate lead patterns Se are provided along the side edge Rb of each of the heat generating resistors R, while the common lead pattern Ce is disposed at the side of the other edge Ra thereof, respectively.
  • the common lead pattern Ce of the predetermined width is located, and thus, there has been such a disadvantage that in the line type thermal head, a so-called real edge type thermal head in which the heat generating resistors are disposed to be aligned at one side edge of the insulative substrate (i.e. to be closely disposed thereat) can not be constituted.
  • serial type thermal heads there is one type which adopts an edge type thermal head as shown in Fig. 2, which includes an insulative substrate B′, a plurality of pairs of meander type heat generating resistors R′ aligned at side edges Ra′ thereof with respect to one side edge Ba′ of the substrate B′ in a parallel relation thereto, and individual lead patterns (separate electrodes) Se′ provided at opposite side edge Rb′ of each pair of the resistors R′, with a common lead pattern Ce′ being disposed between said individual lead patterns Se′ as shown.
  • the common lead pattern Ce′ and the individual lead pattern Se′ are arranged in a so-called return-pattern shape.
  • the short common lead pattern Ce′ is drawn out from the central portion at the side edge Rb′ of each meander type heat generating resistor R′ in a direction away from said resistor, while the individual lead patterns Se′ longer in lengths than said common lead pattern Ce′ are also extended in a parallel relation with said individual lead patterns Se′ from the side edge Rb′ of said resistor R′.
  • Fig. 3 which is of the serial type thermal head, and adopts the edge type head construction as explained above with reference to Fig. 2, and in which lead patterns (individual lead patterns and common lead patterns) are connected through a flexible circuit board B ⁇ .
  • conductor patterns i.e. a common conductor Cc and separate conductors Sc respectively corresponding to the common lead patterns Ce" and the individual lead patterns Se" are formed on a flexible circuit board B ⁇ , and the respective patterns are connected by overlapping said patterns each other.
  • an essential object of the present invention is to provide a thermal head of a line head type which is capable of realizing a real edge type, and facilitated in the connection of common lead patterns thereof.
  • Another object of the present invention is to provide a thermal head of the above described type which is simple in construction and stable in functioning, and can be readily manufactured on a large scale at low cost.
  • a thermal head of a real edge type which includes an insulative substrate, a plurality of heat generating resistors provided at one edge on an upper surface of said insulative substrate in a parallel relation to said one edge, and individual lead patterns and a common lead pattern provided at an edge of each of said heat generating resistors to extend in a direction at right angles with an aligning direction of said heat generating resistors, wherein the extended length of the respective common lead patterns is made longer than those of the individual lead patterns so as to project beyond bonding pad portions of said individual lead patterns, with a common collective pattern directed in a parallel relation with the aligning direction of said heat generating resistors being provided at the extended projecting end portions of said common lead patterns.
  • a plurality of paris of meander type heat generating resistors (two heat generating resistors are formed into one pair) are aligned in a parallel relation with respect to one side edge of the insulative substrate.
  • the common lead pattern and the individual lead patterns are disposed.
  • the common lead pattern and the individual lead pattern are led out in a so-called return pattern.
  • the common lead pattern is led out from the central portion of the heat generating resistor pair, while the individual lead patterns are respectively led out from opposite sides (heat generating resistor portions) of said heat generating resistor pair in a parallel relation with said common lead pattern, with said common lead pattern being extended beyond the ends of the individual lead patterns located at its opposite sides.
  • each common lead pattern is extended in a direction opposite to the heat generating resistor and towards the other side edge of the insulative substrate so as to further extend or project beyond bonding pad portions at the forward ends of the individual lead patterns.
  • a common collective pattern or a unified common lead
  • connection of the respective common lead patterns may be effected in an etching manufacturing stage. Furthermore, since it is not required to connect the respective common lead patterns to the common collective pattern through bonding by wires or to effect the connection under pressure through employment of a flexible substrate, a line type thermal head capable of realizing the real edge type may be provided at low cost.
  • a thermal head which generally includes an insulative substrate 5, for example, of an alumina ceramic material, a plurality of pairs of heat generating resistors 1, for example, of a meander type each corresponding to two dots, and formed on the upper surface of the substrate 5 along its one side edge 5a, and a common lead pattern 2 (common electrode) and individual lead patterns 3 (separate electrodes) formed on each pair of the heat generating resistors 1, and a protective film (not particularly shown) formed over the surfaces of the substrate 5, the heat generating resistors 1 and the lead patterns 2 and 3.
  • the embodiment in Fig. 1 shows a so-­called thin film type line head (i.e. a head in which many heat generating dots are aligned in parallel along one side edge of the substrate).
  • the thermal head according to the present invention as shown in Fig. 1 is characterized in that the plurality of pairs of the meander type heat generating resistors 1 are aligned each in its one edge 1a in a parallel relation along the corresponding one side edge 5a of the insulative substrate 5, while the individual lead patterns 3 and the common lead pattern 2 are led out from the other side edge 1b of each of the resistors 1, with the length of the common lead pattern 2 being set to be longer than those of the individual lead patterns 3.
  • Each pair of the meander type heat generating resistors 1 is formed by providing a notch 11 at a central portion of a resistive plate so as to form heat resistor portions 1R at opposite sides, and open sides of these notches 11 are aligned to be directed towards the one side edge 5a of the substrate 5 to form an edge type head.
  • the common lead pattern 2 and the individual lead patterns 3 are disposed in a so-called return pattern form. More specifically, the common lead pattern 2 is led out from the other edge lb of the resistor pair 1 (i.e. the edge lb thereof remote from the corresponding side edge 5a of the insulative substrate 5), at a position corresponding to the central notch portion 11 in a direction away from said resistor pair 1.
  • the individual lead patterns 3 are led out from the opposite sides of the resistor pair 1, i.e. from the respective heat generating resistor portions IR in a direction parallel to the common lead pattern 2.
  • the above common lead pattern 2 is set to be longer in length than the individual lead patterns 3.
  • the common lead pattern 3 is extended towards the other side edge of the substrate 5 so that the forward end of the common lead pattern 3 extends longer beyond bonding pad portions 31 and 31′ at the forward ends of the individual lead patterns 3. Furthermore, at extended end portions 21 of said common lead patterns 2, a common collective pattern 4 (or a unified common lead) is formed in a direction parallel to the aligning direction of the meander type heat generating resistor pairs 1. On the above common collective pattern 4, for example, a drive IC 6 is mounted, with pads 61 provided on the drive IC 6 and the bonding pad portions 31 of the individual lead patterns 3 being bonded to each other by bonding wires W as shown.
  • the thermal head i.e. line type head
  • many meander type heat generating resistor pairs 1 are aligned along the one side edge 5a of the insulative substrate 5, while the common lead pattern 2 in each resistor pair 1 is extended longer than the individual lead patterns 3, with the common collective pattern 4 being formed at the extended end portions 21 of the common lead patterns 2 as explained above. Therefore, the connection of the respective common lead patterns 3 with the common collective pattern 4 can be effected at the etching manufacturing stage. Moreover, it is not required to bond the respective common lead patterns 3 by bonding wires, or to connect them by the flexible substrate and the like. Accordingly, the line type thermal head capable of realizing the real edge type head may be provided through simple processing.
  • the thermal head is constituted by the insulative substrate, the plurality of heat generating resistors provided at one edge on the upper surface of the insulative substrate in a parallel relation to said one edge, and the individual lead patterns and common lead pattern provided at the edge of each of said heat generating resistors to extend in a direction at right angles with the aligning direction of said heat generating resistors, wherein the extended length of the respective common lead patterns is made longer than those of the individual lead patterns so as to project beyond the bonding pad portions of said individual lead patterns, with the common collective pattern directed in a parallel relation with the aligning direction of said heat generating resistor being provided at the extended projecting end portions of said common lead patterns.
  • the common lead patterns are made longer to extend beyond the bonding pad portions of the individual lead patterns, the common collective pattern for connection with respective common lead patterns may be disposed at the other side edge portion of the insulative substrate. Accordinglyl the connection of the respective common lead patterns may be effected at the etching manufacturing stage, and thus, not only the complicated work for wire-bonding the respective common lead patterns as conventionally required is eliminated, but the disadvantage for connection under pressure through employment of the expensive flexible circuit board, etc. may also be eliminated to achieve the object of the present invention.

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EP19900122191 1989-11-21 1990-11-20 Tête thermique Expired - Lifetime EP0430039B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP302890/89 1989-11-21
JP1302890A JP2633701B2 (ja) 1989-11-21 1989-11-21 サーマルヘッド

Publications (3)

Publication Number Publication Date
EP0430039A2 true EP0430039A2 (fr) 1991-06-05
EP0430039A3 EP0430039A3 (en) 1991-12-04
EP0430039B1 EP0430039B1 (fr) 1997-03-05

Family

ID=17914336

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900122191 Expired - Lifetime EP0430039B1 (fr) 1989-11-21 1990-11-20 Tête thermique

Country Status (3)

Country Link
EP (1) EP0430039B1 (fr)
JP (1) JP2633701B2 (fr)
DE (1) DE69030054T2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6405357B1 (en) * 2000-05-02 2002-06-11 Advanced Semiconductor Engineering, Inc. Method for positioning bond pads in a semiconductor die

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0147671B1 (ko) * 1995-11-02 1998-08-17 김광호 감열 기록 소자

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5590381A (en) * 1979-11-19 1980-07-08 Rohm Co Ltd Thermal type head
JPS61141572A (ja) * 1984-12-14 1986-06-28 Mitsubishi Electric Corp サ−マルヘツド
JPS61148072A (ja) * 1984-12-21 1986-07-05 Mitsubishi Electric Corp サ−マルヘツド
JPS6221559A (ja) * 1985-07-20 1987-01-29 Ricoh Co Ltd サ−マルヘツド
EP0241282A2 (fr) * 1986-04-08 1987-10-14 Oki Electric Industry Company, Limited Tête thermique

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6297864A (ja) * 1985-10-24 1987-05-07 Sony Corp サ−マルヘツド
JPS63106644U (fr) * 1986-12-27 1988-07-09
JPH01116643U (fr) * 1988-02-03 1989-08-07

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5590381A (en) * 1979-11-19 1980-07-08 Rohm Co Ltd Thermal type head
JPS61141572A (ja) * 1984-12-14 1986-06-28 Mitsubishi Electric Corp サ−マルヘツド
JPS61148072A (ja) * 1984-12-21 1986-07-05 Mitsubishi Electric Corp サ−マルヘツド
JPS6221559A (ja) * 1985-07-20 1987-01-29 Ricoh Co Ltd サ−マルヘツド
EP0241282A2 (fr) * 1986-04-08 1987-10-14 Oki Electric Industry Company, Limited Tête thermique

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 10, no. 336 (M-535)(2392) November 14, 1986 & JP-A-61 141 572 (MITSUBISHI ELECTRIC CORP ) June 28, 1986 *
PATENT ABSTRACTS OF JAPAN vol. 10, no. 349 (M-538)(2405) November 26, 1986 & JP-A-61 148 072 (MITSUBISHI ELECTRIC CORP ) July 5, 1986 *
PATENT ABSTRACTS OF JAPAN vol. 11, no. 199 (M-602)(2646) June 26, 1987 & JP-A-62 021 559 (RICOH CO LTD ) January 29, 1987 *
PATENT ABSTRACTS OF JAPAN vol. 4, no. 132 (M-32)(614) September 17, 1980 & JP-A-55 090 381 (TOYO DENGU SEISAKUSHO K.K. ) July 8, 1980 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6405357B1 (en) * 2000-05-02 2002-06-11 Advanced Semiconductor Engineering, Inc. Method for positioning bond pads in a semiconductor die

Also Published As

Publication number Publication date
DE69030054T2 (de) 1997-07-17
DE69030054D1 (de) 1997-04-10
JP2633701B2 (ja) 1997-07-23
EP0430039B1 (fr) 1997-03-05
EP0430039A3 (en) 1991-12-04
JPH03161361A (ja) 1991-07-11

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