Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/073—Multiple probes
  • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
  • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
  • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Definitions

• the purpose of the present invention was to find a solution for how to test objects, such as. B. circuit boards, can establish an electrical connection with several test points lying very close to one another in order to be able to test all measuring sections to be tested at the same time. It was therefore necessary to build a contacting device, or more precisely, a multiple contact module for such measuring and testing purposes, in which the contact pins are only a very minimal distance from one another, so that the control of a test specimen is just as close together Measuring points is made possible.
• each individual contact module has already existed up to now. In these, however, only a number of individual contact modules were combined to form a multiple contact module, each individual contact module having a connecting pin or a soldering tab at the rear end and a wire tip at the front end, which represented the actual contact pin.
• a pressure or coil spring was installed between the contact pin and the soldering lug in order to ensure the necessary contact pressure of each individual contact pin on the corresponding measuring point. This was particularly important when several individual single contact modules were used to form a multiple contact module were assembled. This assembly was realized by inserting the upper and lower ends of the individual contact modules into a plate with several through holes (the so-called spacer plate).
• the through holes in the spacer plate for the rear end of the individual contact module should be much larger than the through holes for the front side of the individual contact module with the contact pin, since the rear end of the individual contact module has a coil spring, as mentioned, which is also in one Space consuming sleeve was.
• FIG. 1 shows a multiple contact module which consists of such a multiple guide block and in which the sleeves for the coil springs have been replaced by an entire spring support block 4.
• the contact pins for their part were analogously embedded in a contact pin guide block 1, so that here too one could do without the jacket tubes. This made it possible to save space and to bring the contact pins closer together.
• FIG. 2 shows two variants for the electrical contact transfer from the contact mandrel 2 to the coil spring 3.
• 2 a) we see the 1st Variant of how the contact pin is welded directly to the spring, while in the second variant in FIG. 2 b) a connection between the contact pin and spring was achieved by brazing.
• This problem was additionally solved in the present invention by building the entire spring support block 4 on two levels. In this way it was possible to move every 2nd coil spring to the upper floor and thereby gain additional space.
• FIG. 3 a shows the outline of such a spring support block. Here you can see how the holes are alternated line by line. While we have the wide through-bores for receiving the coil springs in the top row, we see the small through-bores in the second row, offset laterally by half the spring center distance, which only have to accommodate the wires. Here, the large through-bores are indicated by the dashed circles, which are located one floor below and where the coil springs of these contact elements are also more likely to find space.
• Fig. 3 b) shows a section through the Federlagerungs ⁇ block, where it is clearly shown once again how everything is in this line wide holes for the coil springs are located above.
• the contact pin protection plate 9 (FIG. 1), which ensures that the various contact pins that protrude from the cover plate 11 are bent and bent laterally by unskillful manipulations.
• This contact pin protection plate 9 can be pressed against the cover plate 11 when a test piece 10 (for example a printed circuit board) is placed, because it is mounted on the left and right on screw springs 12 which can be pressed together.
• This pressing of the protective plate 9 allows the contact pins to emerge from the protective plate 9 and the necessary connection of the contact pins to the measuring points on the printed circuit board 10 can thereby be established.
• the contact pin protection plate 9 was additionally provided with two cams 8, so that an exact positioning of the contact pins 2 on the corresponding measuring points is possible. Another possibility for the positioning is an automatic handling system, in which the circuit to be tested can be inserted into the test head and adjusted using optoelectronic sensors.
• a protective plate was provided to protect the soldering or wiring connections 5 (FIG. 1), namely the connecting protective plate 6.
• test head consisting mainly of the two spring support blocks 4 and the contact mandrel guide block 1, is now inserted into the test head receptacle 17, which in principle consists of a thick-walled housing that is open on one side for wiring and on the bottom for contacting.
• the test head can now be easily inserted into the test head receptacle 17 and fastened to it with the cast-in steel plate 18.
• This steel plate 18 thus forms the mechanical connecting part of the test head with the test head receptacle 17.
• This steel plate 18 it is also possible to bring the test head into the test head receiving pan 17 in a hanging manner.
• the test head by precisely fitting the test head into the receiving socket 17, both in width and in depth, that the lateral forces can also be absorbed.
• This guide block consists essentially of the spring support block 4 and the contact mandrel guide block. .
• This guide block consists essentially of the spring support block 4 and the contact mandrel guide block. .
• the spring mounting block 4 can be produced in series using insulating material as a casting. Series production is possible because a certain grid (eg 1/40 ") can always be maintained.
• the contact connection of the springs in the spring bearing block can therefore also be connected directly via an electrical basic evaluation grid (test electronics)
• Contact mandrel guide block 1 which essentially consists of filler 14, solves the problem in such a way that wires with a diameter of approximately 0.12 mm are cast with epoxy resin, and these wires are then approximately 0.12 mm thick
• the desired contact mandrel guide block 1, which can accommodate the contact mandrels which are thinner by 0.02 mm, is pulled out again and left behind ⁇ guide block for the current-conducting elements provided here, namely for the contact pins 2 and the coil springs 3:

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Measuring Leads Or Probes (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=4252697

Family Applications (1)

Country Status (4)

Families Citing this family (7)

Family Cites Families (3)

• 1988
  • 1988-09-02 CH CH328688A patent/CH676898A5/de not_active IP Right Cessation
• 1989
  • 1989-06-12 JP JP1506088A patent/JPH03501056A/ja active Pending
  • 1989-06-12 EP EP19890906694 patent/EP0387311A1/de not_active Withdrawn
  • 1989-06-12 WO PCT/CH1989/000112 patent/WO1990002954A1/de not_active Application Discontinuation

Non-Patent Citations (1)

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