EP0186945B1 - A transfer machine for a surface inspection apparatus - Google Patents

A transfer machine for a surface inspection apparatus Download PDF

Info

Publication number
EP0186945B1
EP0186945B1 EP85307455A EP85307455A EP0186945B1 EP 0186945 B1 EP0186945 B1 EP 0186945B1 EP 85307455 A EP85307455 A EP 85307455A EP 85307455 A EP85307455 A EP 85307455A EP 0186945 B1 EP0186945 B1 EP 0186945B1
Authority
EP
European Patent Office
Prior art keywords
receiver
inspected
storage housing
transfer
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP85307455A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0186945A1 (en
Inventor
Kazuyoshi C/O Patent Division Sone
Katsuya C/O Patent Division Okumura
Tomio C/O Patent Division Nakajima
Kanji C/O Patent Division Ikegaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of EP0186945A1 publication Critical patent/EP0186945A1/en
Application granted granted Critical
Publication of EP0186945B1 publication Critical patent/EP0186945B1/en
Expired legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138Wafers positioned vertically within cassette

Definitions

  • the control means 13 is designed in such a manner that the surface inspection apparatus can operate only when the first and second storage housings 20, 23 match the first and second receivers 29, 42 in shape.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Sorting Of Articles (AREA)
EP85307455A 1984-10-19 1985-10-16 A transfer machine for a surface inspection apparatus Expired EP0186945B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59218297A JPH0620922B2 (ja) 1984-10-19 1984-10-19 被検物の搬送装置
JP218297/84 1984-10-19

Publications (2)

Publication Number Publication Date
EP0186945A1 EP0186945A1 (en) 1986-07-09
EP0186945B1 true EP0186945B1 (en) 1989-05-31

Family

ID=16717624

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85307455A Expired EP0186945B1 (en) 1984-10-19 1985-10-16 A transfer machine for a surface inspection apparatus

Country Status (5)

Country Link
US (1) US4787800A (ja)
EP (1) EP0186945B1 (ja)
JP (1) JPH0620922B2 (ja)
KR (1) KR900000654B1 (ja)
DE (1) DE3570754D1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD409166S (en) 1998-04-17 1999-05-04 Advanced Digital Information Corp. Data storage-media library
USD425878S (en) 1999-09-17 2000-05-30 Advanced Digital Information Corporation Data-storage library front door
USD432541S (en) 1999-11-01 2000-10-24 Advanced Digital Information Corporation Data-storage library front door

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3731120A1 (de) * 1987-09-16 1989-03-30 Leitz Ernst Gmbh Universeller objekthalter fuer mikroskope
US5022619A (en) * 1988-12-09 1991-06-11 Tokyo Aircraft Instrument Co., Ltd. Positioning device of table for semiconductor wafers
JPH0734116B2 (ja) * 1991-05-29 1995-04-12 株式会社オーク製作所 自動露光装置におけるワークの位置決め方法
US6473157B2 (en) * 1992-02-07 2002-10-29 Nikon Corporation Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate
US5498118A (en) * 1992-02-07 1996-03-12 Nikon Corporation Apparatus for and method of carrying a substrate
JPH06300697A (ja) * 1992-04-28 1994-10-28 Texas Instr Inc <Ti> 非改質性検査プラテン
NL9201825A (nl) * 1992-10-21 1994-05-16 Od & Me Bv Inrichting voor het vervaardigen van een matrijs voor een schijfvormige registratiedrager.
KR100291110B1 (ko) * 1993-06-19 2001-06-01 히가시 데쓰로 프로우브장치 및 그것을 사용한 피검사체의 검사방법
US5684654A (en) * 1994-09-21 1997-11-04 Advanced Digital Information System Device and method for storing and retrieving data
US5781367A (en) * 1995-11-13 1998-07-14 Advanced Digital Information Corporation Library for storing data-storage media
JPH09321102A (ja) * 1996-05-31 1997-12-12 Tokyo Electron Ltd 検査装置
US6202482B1 (en) * 1998-03-23 2001-03-20 Lehighton Electronics, Inc. Method and apparatus for testing of sheet material
US6198984B1 (en) 1998-04-17 2001-03-06 Advanced Digital Information Corporation Library for storing data-storage media and having an improved media transporter
US6266574B1 (en) 1998-04-17 2001-07-24 Advanced Digital Information Corporation Library for storing data-storage media and having a removable interface module
US6163431A (en) * 1998-04-17 2000-12-19 Advanced Digital Information Corporation Door hinge
JP4818767B2 (ja) * 2006-03-22 2011-11-16 株式会社メガトレード 外観検査装置
CN113751335B (zh) * 2021-08-30 2023-10-03 绵阳伟成科技有限公司 一种单片机pin绕脚检测设备及检测方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3272350A (en) * 1964-09-25 1966-09-13 Westinghouse Electric Corp Method and apparatus for semiconductor wafer handling
US3543035A (en) * 1966-03-09 1970-11-24 American Kitchen Foods Inc Apparatus for removing defective areas from materials including scanning materials with photocell having two sections
US3521074A (en) * 1968-04-19 1970-07-21 Mandrel Industries Defect detector with rotating scanner
GB1338663A (en) * 1971-08-25 1973-11-28 Andreev J N Apparatus for checking the surface of resistor bases
US3902615A (en) * 1973-03-12 1975-09-02 Computervision Corp Automatic wafer loading and pre-alignment system
US3823836A (en) * 1973-05-22 1974-07-16 Plat General Inc Vacuum apparatus for handling sheets
CA1044379A (en) * 1974-12-28 1978-12-12 Sony Corporation Wafer transfer device
US4402613A (en) * 1979-03-29 1983-09-06 Advanced Semiconductor Materials America Surface inspection system
JPS5681533U (ja) * 1979-11-27 1981-07-01
JPS576307A (en) * 1980-06-13 1982-01-13 Toyota Central Res & Dev Lab Inc Method and apparatus of surface failure inspection of circular member
JPS5739430U (ja) * 1980-08-14 1982-03-03
US4550239A (en) * 1981-10-05 1985-10-29 Tokyo Denshi Kagaku Kabushiki Kaisha Automatic plasma processing device and heat treatment device
DE3219502C2 (de) * 1982-05-25 1990-04-19 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Vorrichtung zum automatischen Transport scheibenförmiger Objekte
JPS6041045U (ja) * 1983-08-26 1985-03-23 東京エレクトロン株式会社 半導体ウエハプロ−バ
US4558984A (en) * 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
US4597708A (en) * 1984-06-04 1986-07-01 Tencor Instruments Wafer handling apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD409166S (en) 1998-04-17 1999-05-04 Advanced Digital Information Corp. Data storage-media library
USD425878S (en) 1999-09-17 2000-05-30 Advanced Digital Information Corporation Data-storage library front door
USD432541S (en) 1999-11-01 2000-10-24 Advanced Digital Information Corporation Data-storage library front door

Also Published As

Publication number Publication date
US4787800A (en) 1988-11-29
EP0186945A1 (en) 1986-07-09
KR900000654B1 (ko) 1990-02-02
KR860003495A (ko) 1986-05-26
JPH0620922B2 (ja) 1994-03-23
DE3570754D1 (en) 1989-07-06
JPS6197086A (ja) 1986-05-15

Similar Documents

Publication Publication Date Title
EP0186945B1 (en) A transfer machine for a surface inspection apparatus
US4789294A (en) Wafer handling apparatus and method
US5605428A (en) Device for indexing magazine compartments and wafer-shaped objects in the compartments
US4501527A (en) Device for automatically transporting disk shaped objects
US6053983A (en) Wafer for carrying semiconductor wafers and method detecting wafers on carrier
US6449585B1 (en) Wafer sidewall inspection system and method
KR100361962B1 (ko) 웨이퍼 테두리 결함 검사장치 및 검사방법
US4716299A (en) Apparatus for conveying and inspecting a substrate
JP2004214462A (ja) 基板検出方法及び装置並びに基板処理装置
EP0095371B1 (en) Missing or broken wafer sensor
US4200393A (en) Method of positioning a semiconductor member by examining it and a die bonding apparatus using the same
US20030079583A1 (en) Substrate cutting method and substrate cutting apparatus
US6419439B2 (en) Indexer for magazine shelves of a magazine and wafer-shaped objects contained therein
US6184970B1 (en) Master plate transporting system
JP2000283924A (ja) ワーク検査方法および装置
US4859993A (en) Wafer accounting and processing system
US5853532A (en) Wafer ring supply and return device
JP3744179B2 (ja) 電子部品実装方法
US7109509B2 (en) Device for the detection of substrates stacked with a specific spacing
JPH0756273Y2 (ja) ウエハ検出器
KR20200047492A (ko) 이송 유도 수단 연결 구조의 엑스레이 검사 장치
US20020075478A1 (en) Inspection device having wafer exchange stage
JP3915159B2 (ja) ウエハ用カセット検査装置
JPH01203088A (ja) 搬送物の位置指示装置
JP2903579B2 (ja) リード検査装置とリード検査方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19851025

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE IT

17Q First examination report despatched

Effective date: 19880705

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE IT

ITF It: translation for a ep patent filed
REF Corresponds to:

Ref document number: 3570754

Country of ref document: DE

Date of ref document: 19890706

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
ITTA It: last paid annual fee
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20041014

Year of fee payment: 20