EP0101704A1 - Procede et dispositif d'application d'un revetement sur un substrat - Google Patents

Procede et dispositif d'application d'un revetement sur un substrat

Info

Publication number
EP0101704A1
EP0101704A1 EP83900739A EP83900739A EP0101704A1 EP 0101704 A1 EP0101704 A1 EP 0101704A1 EP 83900739 A EP83900739 A EP 83900739A EP 83900739 A EP83900739 A EP 83900739A EP 0101704 A1 EP0101704 A1 EP 0101704A1
Authority
EP
European Patent Office
Prior art keywords
coating
passage
substrate
supply
cabin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP83900739A
Other languages
German (de)
English (en)
Inventor
Edward Bok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0101704A1 publication Critical patent/EP0101704A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet

Definitions

  • the invention relates to a method and apparatus to apply a coating on a flat surface.
  • the substrates or tape in that way provided u/ith a coating, can be used in the micr ⁇ -electro ⁇ ica.
  • the apparatus for coating appliance according to the invention whereby use is made of this "floating" processing of the substrates or tapes in the cabin passage, now is characterized by having means, included therein, to enable that after the passing of the coating apply section the surface of such substrates or tape is free of excessive coating.
  • a following positive characteristic of the apparatus is, that as seen in the direction of movement of the substrate or tape, immediately behind the coating apply channel a segmentwall section is included therein, ⁇ hich for at least part thereof is at least near parallel to the substrate or tape, with the creation of a first coating passage.
  • a segmentwall section is included therein, which for at least part thereof is at least near parallel to the substrate or tape, with the creation of a second coating passage, and under the influence of the media in the passage, acting on the substrate or tape, in this coating passage such a coating lock is created and maintained, that coating is prevented to displace therein with a higher speed as that of the substrate in the direction of substrate movement.
  • the first passage can also be constructed in that way, that therein a coating lock is created and maintained, which prevents the leakage of coating in a direction, which is opposite to the direction of movement of the substrates or tape. Consequently, by metering the volume of the supplied coating per second in combination with both coating locks a wanted thickness of the applied coating can be obtained.
  • Such a metered coating supply apparatus can in particular be used with square substrates and tapes.
  • substrates not completely filling the total cabin passage, such as with amost circular substrates (wafers), inevitably at least periodically a leakage of coating occurs.
  • a vacumized discharge channel is located, such a channel can also function for the discharge of excessive coating.
  • the flow resistance of the coating passage between the coating supply channel and such a vacuum channel, positioned behind it is considerably smaller than that of the coating passage between the coating supply channel and the supply channel in front of it, which functions for the urging of additional media towards the substrate.
  • the coating applied in the second coating passage, functions as a coating lock far excessive coating, and displacing together with the substrate, via the first coating passage coating is urged towards the vacuum channel, in combination with the metered supply of coating per second, the passage width of both passages is determined and consequently the thickness of the coating layer, applied on the substrate.
  • a following very positive characteristic of the apparatus is there by, that in a segment separate branched channels for the supply of coating are positioned aside each other. These channels are an one end thereof connected with a common supply channel and on the other end thereof connected with at least one mouth and whereby in each of such branched channels the same flow restriction is incorporated, being such, that the total thereof is at least as large as the flow restriction of the first coating passage.
  • the setting of the height of at least the medium cushions behind the coating supply section is such, that in case of no supply of coating, the substrate makes a mechanic contact with these coa ting passage-walls.
  • the coating supplied under pressure, then establishes a coating gap against the reaction force of the substrate and the thrusts of the media.
  • Each local narrowing of the passage width of the coating passage im mediately establishes in that area an increased and correcting thrust of the coating supply and the same occurs oppositely.
  • the gap width and consequently the thickness of the applied coating layer remains practically the same.
  • Figure 1 is a vertical longitudinal sectional view of a cabin, in which the coating apply apparatus according to the invention is incorporated.
  • Figure 2 shows the coating supply apparatus in an enlarged sectional view.
  • Figure 3 shows in a heavily enlarged sectional view the outlet of the coating supply channel into the cabin passage.
  • Figure 4 is a heavily enlarged sectional view of the coating apparatus at the outlet of the supply channel of gaseous process medium, in front of the coating supply channel.
  • Figure 5 is a cross-sectional view of the cabin at the segment, in which the parallel positioned branched channels for the supply of coating are situated.
  • Figure 6 is a cabin section, whereby square substrates are passing through its passage.
  • Figure 7 is the cabin section according to Figure 6, whereby a tape is fed through the passage.
  • Figure 8 is a longitudinal sectional view of a coating apply section, which is applicable in the cabin according to Figure 6 or 7.
  • Figure 9 shows in a longitudinal sectional view a coating apply apparatus, whereby a channel for the supply of coating thinner debouches into the high vacuum channel.
  • Figure 10 is a longitudinal sectional view of a coating apply apparatus, in which a high temperature is maintained and whereby by means of a supply of evaporated thinner the drying of the coating, which is applied on the substrate, and gatherings of coating in the passage are prevented.
  • Figure 11 shows a substrate section with a stepped surface and on which a layer of fluid coating has been applied.
  • Figure 11 B shows the substrate section according to Figure 11 A after oven drying thereof.
  • FFiigguurree 12 A shows a polished substrate section with a coating, applied thereon
  • Figure 12 B shows the section according to Figure 12 A after oven drying thereof.
  • FIG 1 a part of process cabin 10 is shown, with in the central section thereof the passage 12 for substrates or tape 14. On both sides of this passage segments 16 and 18 are positioned.
  • the appliance of coating takes place on the substrates, passing through and such in station 20, see also Figure 2.
  • coating 24 is urged towards coating passages 26 and 28, see also Figure 3,and applied on the substrate.
  • Such appliance of coating takes place after the vacumizing of the apply section through high vacuum channel 30.
  • the length of passage 26 is restricted, for instance only 30 micrometer, with consequently, even with a small passage height of 0.5 micrometer,still a relatively low flow restriction thereof for the coating.
  • the length of passage 28 however is in comparison very large, for instance 1 mm, causing the flow restriction therein for the coating to be that high, that therein a coating lock 34 is established and maintained, which lock is taken along with the substrate and is continuously supplemented with newly applied coating.
  • gaseous medium is supplied.
  • the coating which, adhering to the substrate, leaves the passage 28, cannot stick to the back side 38 of the coating segment, because of: 1. the over pressure of the gaseous medium, as present in channel 36;
  • the passage wall 42 of the coating segment is ultra polished, with a roughness, which preferably is smaller than 0.1 micrometer. Consequently, the coating layer 44, as it is free, is extremely smooth and so almost instantly an oven drying of this applied coating layer can take place.
  • the passage wall 46 of the following segment is situated on a relatively great distance from the substrate 14, with the creation of the passage 48, having a relatively great height. Consequently, a contact of this wall with the coating layer 44, applied on the substrate, is prevented. As by means of a narrow discharge channel for the media, passing through the passage, is extremely small, such media cannot negatively effect the coating 44.
  • FIG. 5 the cabin 10 is shown in a cross-section of the coating supply section 20.
  • the main coating channel 50 located in segment 16, is connected with the supply channel 52, which is positioned in the sidewall 54 of the cabin.
  • a great number of branched channels 65 are in open connection with this channel 50.
  • these channels 50 are by means of their outlets 58 connected with an extremely small coating supply channel 22, of which the sections A through X correspond with those of passage 26. Thereby the com munication of the channel sections is kept very restricted.
  • the channel sections 60 are located.
  • the passage dimensions thereof are extremely small, for instance 30 micrometer times 30 micrometer, whereas also the length of these sections is relatively very large. Consequently, the flow restriction of such a channel section 60 is very large and considerably larger than that of each of the passage sections 26 A through 26 X .
  • each passage section 26 A through 26 X approximately the same amount of coating is urged towards the main vacuum channel 32, whereby every local smallest reduction in height instantly results in an increase in urging pressure in the corresponding channel secti ⁇ ns22 through 22 X to still urge the volume of coating through these passage sections.
  • each local increase in height of a passage section immediately results in a decrease in urging pressure in a corresponding chan nel section 22 A through 22 X and a resulting decreased force on the corresponding section of the substrate in upward direction.
  • this passage section 70 is extremely small, as for instance 0.3 micrometer. Because the length of it, as seen in longitudinal direction of the passage way, is also very limited, for instance 20 micrometer, the flow restriction in this passae section is not large.
  • the supply channel 32 has the same configuration of a great number of branched channels as is shown in Figure 5, causing the flow restriction therethrough to be considerably greater than that of the corresponding sections of this passage section 70. In that way the volume of medium, per second urged through the supply channel 32, is almost independent of the local presence of a substrate section, as is shown in Figure 10, with the passing through of almost circular substrates.
  • passage 164 also near the high vacuum channel 66 a passage narrowing 72 is positioned, whereby during the processing almost the same 0.3 micrometer gap height as with passage 70 can be valid.
  • a guide area for the substrates has been created, which even with extremely thin substrates, having a thickness of only 0.15 mm, ensures an even thickness of the applied coating layer.
  • the discharge of medium towards the discharge channel 30 is very small and amounts for instance only approximately 20 mm 3 per second for a sub strate with a diameter of 125 mm.
  • Very thick coating can now be urged towards the substrate and whereby the superfluous coating, discharged through passage 26, can be thinned in the vacuum channel 30 by means of the thinner 78, supplied through channel 76, see Figure 9.
  • At least the coating section of the cabin can be maintained on a high temperature, up to for instance 80o C. Such to enable the percentage of solids in the applied coating to be as high as possible.
  • the thickness of the coating 44' applied on a polished surface of the substrate 14', can still have approximately the same height, with a completely smooth top of the coating, as is shown in Figures 12 A and 12 B .
  • a number of media channels 84 and 86, supplying the media cushions above the substrates, can also supply at least thinner 88 for the coating in whether or not vapor phase, see Figure 10.
  • substrates 14 such a media are periodically urged into the open passage sections and move towards channel 30 under the taking along with them of the coating, urged from channel 22. In that way a gathering of coating in the passage 12 is prevented.
  • the through channel 32 supplied medium can be a medium in vapor phase to prevent a sealing off of the high vacuum channel 30.
  • the apparatus embodies all installation components, as required for the correct supply and discharge of the media, whereby sensors can be installed in the supply channels of the various process media to command regulating systems.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

Procédé et dispositif améliorés d'application d'un revêtement (24) sur le côté d'un substrat (14), se déplaçant entre des milieux faisant coussin au travers du passage (12) d'une section de cabine (10), en établissant et en maintenant une écluse de revêtement (34) dans la direction de déplacement du substrat (14) au travers du passage (12) au moins dans la section du passage (28) en face du canal d'alimentation en revêtement (22), ce qui empêche le revêtement en excès de s'échapper de cette section de passage (28) dans le sens de déplacement du substrat (14).
EP83900739A 1982-02-24 1983-02-21 Procede et dispositif d'application d'un revetement sur un substrat Ceased EP0101704A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8200753A NL8200753A (nl) 1982-02-24 1982-02-24 Methode en inrichting voor het aanbrengen van een coating op een substraat of tape.
NL8200753 1982-02-24

Publications (1)

Publication Number Publication Date
EP0101704A1 true EP0101704A1 (fr) 1984-03-07

Family

ID=19839315

Family Applications (1)

Application Number Title Priority Date Filing Date
EP83900739A Ceased EP0101704A1 (fr) 1982-02-24 1983-02-21 Procede et dispositif d'application d'un revetement sur un substrat

Country Status (5)

Country Link
US (1) US4560590A (fr)
EP (1) EP0101704A1 (fr)
JP (1) JPS59500459A (fr)
NL (1) NL8200753A (fr)
WO (1) WO1983002910A1 (fr)

Families Citing this family (234)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8300649A (nl) * 1983-02-21 1984-09-17 Integrated Automation Methode en inrichting voor het aanbrengen van een coating op een substraat of tape.
NL8402410A (nl) * 1984-08-01 1986-03-03 Bok Edward Verbeterde proces installatie met double-floating transport en processing van wafers en tape.
EP0261145A1 (fr) * 1986-02-03 1988-03-30 BOK, Edward Installation permettant le traitement de tranches et leur transport par flottage
JPS62186966A (ja) * 1986-02-12 1987-08-15 Fuji Photo Film Co Ltd 塗布方法及び装置
US5194406A (en) * 1988-12-01 1993-03-16 Edward Bok Installation for transport and processing under a pulsating double-floating condition
US5516545A (en) * 1991-03-26 1996-05-14 Sandock; Leonard R. Coating processes and apparatus
NL1003538C2 (nl) * 1996-07-08 1998-01-12 Advanced Semiconductor Mat Werkwijze en inrichting voor het contactloos behandelen van een schijfvormig halfgeleidersubstraat.
US6183565B1 (en) 1997-07-08 2001-02-06 Asm International N.V Method and apparatus for supporting a semiconductor wafer during processing
NL1011856C2 (nl) * 1999-04-21 2000-10-24 Asm Internat B V Floating wafer reactor alsmede werkwijze voor het regelen van de temperatuur daarvan.
US20020132113A1 (en) * 2000-01-14 2002-09-19 Ball Semiconductor, Inc. Method and system for making a micromachine device with a gas permeable enclosure
US6592942B1 (en) 2000-07-07 2003-07-15 Asm International N.V. Method for vapour deposition of a film onto a substrate
NL1018086C2 (nl) 2001-05-16 2002-11-26 Asm Int Werkwijze en inrichting voor het thermisch behandelen van substraten.
US6818517B1 (en) 2003-08-29 2004-11-16 Asm International N.V. Methods of depositing two or more layers on a substrate in situ
US7410355B2 (en) * 2003-10-31 2008-08-12 Asm International N.V. Method for the heat treatment of substrates
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US4560590A (en) 1985-12-24

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