EA200501238A1 - Способ изготовления электропроводящего рисунка - Google Patents

Способ изготовления электропроводящего рисунка

Info

Publication number
EA200501238A1
EA200501238A1 EA200501238A EA200501238A EA200501238A1 EA 200501238 A1 EA200501238 A1 EA 200501238A1 EA 200501238 A EA200501238 A EA 200501238A EA 200501238 A EA200501238 A EA 200501238A EA 200501238 A1 EA200501238 A1 EA 200501238A1
Authority
EA
Eurasian Patent Office
Prior art keywords
manufacturing
electrical conducting
conducting pattern
relates
present
Prior art date
Application number
EA200501238A
Other languages
English (en)
Other versions
EA008748B1 (ru
Inventor
Лаури Хухтасало
Самули Стрёмберг
Марко Ханхикорпи
Олли Хювяринен
Пекка Таскинен
Туйя Суортти
Original Assignee
Интьюн Сёркуитс Ой
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Интьюн Сёркуитс Ой filed Critical Интьюн Сёркуитс Ой
Publication of EA200501238A1 publication Critical patent/EA200501238A1/ru
Publication of EA008748B1 publication Critical patent/EA008748B1/ru

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Details Of Aerials (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

Настоящее изобретение относится к способу изготовления электропроводящего рисунка путем печатания на подложке-носителе (2) слоя, включающего оксид металла, и восстановления оксида металла до металла. Восстановленный слой переносят на функциональную подложку. Настоящее изобретение также относится к использованию способа.
EA200501238A 2003-03-05 2003-08-29 Способ изготовления электропроводящего рисунка EA008748B1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI0300168 2003-03-05
PCT/FI2003/000633 WO2004080139A1 (en) 2003-03-05 2003-08-29 Method for manufacturing an electrically conductive pattern

Publications (2)

Publication Number Publication Date
EA200501238A1 true EA200501238A1 (ru) 2006-04-28
EA008748B1 EA008748B1 (ru) 2007-08-31

Family

ID=32947022

Family Applications (1)

Application Number Title Priority Date Filing Date
EA200501238A EA008748B1 (ru) 2003-03-05 2003-08-29 Способ изготовления электропроводящего рисунка

Country Status (13)

Country Link
US (1) US7386936B2 (ru)
EP (1) EP1639871B1 (ru)
JP (1) JP2006514487A (ru)
KR (1) KR101008090B1 (ru)
CN (1) CN1751546A (ru)
AT (1) ATE474441T1 (ru)
AU (2) AU2003258742A1 (ru)
BR (1) BR0318165A (ru)
DE (1) DE60333401D1 (ru)
EA (1) EA008748B1 (ru)
MY (1) MY133628A (ru)
TW (1) TWI318753B (ru)
WO (2) WO2004080137A1 (ru)

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US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
FI20045235A (fi) * 2004-06-22 2005-12-23 Intune Circuits Oy Menetelmä sähköisesti johtavan kuvion käsittelemiseksi
FI20055515A (sv) * 2005-09-28 2007-07-06 Selmic Oy Fastsättning av en ledarkonstruktion på ett objekt
FI20060673A0 (fi) * 2006-07-11 2006-07-11 Keskuslaboratorio Painomenetelmä ja -laitteet ja painettu tuote
JP2009252685A (ja) * 2008-04-10 2009-10-29 Seiko Epson Corp 導電膜の形成方法
TW200949710A (en) * 2008-05-16 2009-12-01 Unibase Technology Co Ltd UHF Radio-frequency label
US8720052B2 (en) * 2008-05-20 2014-05-13 3M Innovative Properties Company Method for continuous sintering on indefinite length webs
US9006625B2 (en) * 2010-01-29 2015-04-14 Lg Chem, Ltd. Method for forming conductive patterns using microwave
DE102010015659A1 (de) 2010-04-20 2011-10-20 Giesecke & Devrient Gmbh Transferverfahren zur Herstellung von Leiterstrukturen mittels Nanotinten
KR101021280B1 (ko) * 2010-11-11 2011-03-11 한국기계연구원 습식공정을 이용한 알루미늄 전극의 제조방법 및 이에 의하여 제조되는 알루미늄 전극
KR101118838B1 (ko) * 2010-12-29 2012-03-14 삼성전기주식회사 나노 금속 페이스트를 이용한 배선 및 전극의 형성 방법
MY166125A (en) * 2011-09-14 2018-05-24 Microconnections Sas Rfid antenna
FI126151B (en) * 2012-01-30 2016-07-15 Stora Enso Oyj Method and apparatus for producing an electrically conductive figure on a surface
FI125906B (en) * 2012-01-30 2016-03-31 Stora Enso Oyj Method and apparatus for transferring an electrically conductive material in liquid form onto a substrate to be printed
US9107308B2 (en) 2012-02-27 2015-08-11 Pen Inc. Graphitic substrates with ceramic dielectric layers
CN104412451A (zh) * 2012-05-11 2015-03-11 尤尼皮克塞尔显示器有限公司 用于制造高分辨率导电图案的墨合成物
JP5275498B1 (ja) 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
JP5897437B2 (ja) * 2012-09-14 2016-03-30 富士フイルム株式会社 導電層の製造方法、プリント配線基板
KR101582637B1 (ko) * 2013-07-29 2016-01-07 전북대학교산학협력단 CuO 나노입자와 그의 잉크 및 마이크로파 조사를 통한 CuO 박막으로부터 Cu박막으로 환원시키는 이들의 제조방법
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GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
US20180151265A1 (en) * 2016-11-29 2018-05-31 Eastman Kodak Company ARTICLES HAVING SILVER ION a-OXY CARBOXYLATE OXIME COMPLEXES
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Also Published As

Publication number Publication date
DE60333401D1 (de) 2010-08-26
TWI318753B (en) 2009-12-21
AU2003258742A1 (en) 2004-09-28
EP1639871A1 (en) 2006-03-29
EP1639871B1 (en) 2010-07-14
KR20050109530A (ko) 2005-11-21
WO2004080137A1 (en) 2004-09-16
ATE474441T1 (de) 2010-07-15
JP2006514487A (ja) 2006-04-27
AU2003258741A1 (en) 2004-09-28
EA008748B1 (ru) 2007-08-31
US7386936B2 (en) 2008-06-17
US20060057827A1 (en) 2006-03-16
BR0318165A (pt) 2006-02-21
WO2004080139A1 (en) 2004-09-16
CN1751546A (zh) 2006-03-22
MY133628A (en) 2007-11-30
KR101008090B1 (ko) 2011-01-13
TW200417933A (en) 2004-09-16

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Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM AZ BY KZ KG MD TJ TM RU