FI20055515A - Fastsättning av en ledarkonstruktion på ett objekt - Google Patents

Fastsättning av en ledarkonstruktion på ett objekt Download PDF

Info

Publication number
FI20055515A
FI20055515A FI20055515A FI20055515A FI20055515A FI 20055515 A FI20055515 A FI 20055515A FI 20055515 A FI20055515 A FI 20055515A FI 20055515 A FI20055515 A FI 20055515A FI 20055515 A FI20055515 A FI 20055515A
Authority
FI
Finland
Prior art keywords
attaching
leader structure
leader
Prior art date
Application number
FI20055515A
Other languages
English (en)
Finnish (fi)
Other versions
FI20055515A0 (sv
Inventor
Juha Hagberg
Teija Kekonen
Original Assignee
Selmic Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selmic Oy filed Critical Selmic Oy
Priority to FI20055515A priority Critical patent/FI20055515A/sv
Publication of FI20055515A0 publication Critical patent/FI20055515A0/sv
Priority to PCT/FI2006/050415 priority patent/WO2007036610A1/en
Publication of FI20055515A publication Critical patent/FI20055515A/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FI20055515A 2005-09-28 2005-09-28 Fastsättning av en ledarkonstruktion på ett objekt FI20055515A (sv)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20055515A FI20055515A (sv) 2005-09-28 2005-09-28 Fastsättning av en ledarkonstruktion på ett objekt
PCT/FI2006/050415 WO2007036610A1 (en) 2005-09-28 2006-09-28 Attachment of conductor structure to object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20055515A FI20055515A (sv) 2005-09-28 2005-09-28 Fastsättning av en ledarkonstruktion på ett objekt

Publications (2)

Publication Number Publication Date
FI20055515A0 FI20055515A0 (sv) 2005-09-28
FI20055515A true FI20055515A (sv) 2007-07-06

Family

ID=35151481

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20055515A FI20055515A (sv) 2005-09-28 2005-09-28 Fastsättning av en ledarkonstruktion på ett objekt

Country Status (2)

Country Link
FI (1) FI20055515A (sv)
WO (1) WO2007036610A1 (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102484308A (zh) * 2009-04-21 2012-05-30 莫列斯公司 三维天线
US8896488B2 (en) * 2011-03-01 2014-11-25 Apple Inc. Multi-element antenna structure with wrapped substrate
US9093745B2 (en) 2012-05-10 2015-07-28 Apple Inc. Antenna and proximity sensor structures having printed circuit and dielectric carrier layers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214315A (en) * 1962-03-28 1965-10-26 Burton Solomon Method for forming stamped electrical circuits
US3589224A (en) * 1968-10-14 1971-06-29 Buckee Mears Co Die punching printed circuit
DE3031751A1 (de) * 1980-08-22 1982-04-15 Wilhelm Ruf KG, 8000 München Verfahren zur herstellung elektrotechnischer bauteile und nach diesem verfahren hergestellter schiebe- oder drehwiderstand
US4980016A (en) * 1985-08-07 1990-12-25 Canon Kabushiki Kaisha Process for producing electric circuit board
JP3168389B2 (ja) * 1995-01-26 2001-05-21 矢崎総業株式会社 回路基板の製造方法
JP2000509909A (ja) * 1997-02-21 2000-08-02 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 熱フォイルエンボス技術を用いた基板を選択的にメタライズする方法
GB2345196B (en) * 1998-12-23 2003-11-26 Nokia Mobile Phones Ltd An antenna and method of production
US6936336B2 (en) * 2002-03-15 2005-08-30 Kyocera Corporation Transfer sheet and production method of the same and wiring board and production method of the same
JP4142954B2 (ja) * 2003-01-10 2008-09-03 京セラ株式会社 プリント配線板の製造装置
DE60333401D1 (de) * 2003-03-05 2010-08-26 Intune Circuits Oy Verfahren zur herstellung einer elektrisch leitfähigen struktur
FI20045235A (sv) * 2004-06-22 2005-12-23 Intune Circuits Oy Förfarande för att behandla ett elektriskt ledande mönster

Also Published As

Publication number Publication date
WO2007036610A8 (en) 2007-06-07
WO2007036610A1 (en) 2007-04-05
FI20055515A0 (sv) 2005-09-28

Similar Documents

Publication Publication Date Title
FIC20210018I1 (sv) Cenobamat eller ett farmaceutiskt salt därav
LTC2004635I2 (lt) Pakeistieji enaminokarbonilo junginiai
DK1919907T5 (da) Heterocyklisk forbindelse
BRPI0821831A2 (pt) Compostos inseticidas
ATE502948T1 (de) Substituierte bicyclolactamverbindungen
ATE544742T1 (de) Insektizide arylpyrrolidine
ATE510823T1 (de) Fungizide pyridinyloxysubstituierte phenylamidinderivate
FI20050022A0 (sv) Kontroll av tillträdet till ett nät
ATE443056T1 (de) Substituierte n-sulfonylaminophenylethyl-2- phenoxyacetamidverbindungen
DK2016067T3 (da) Insecticidforbindelser
ATE532773T1 (de) Insektizide pyrimidinyl-aryl-hydrazone
FI20055515A (sv) Fastsättning av en ledarkonstruktion på ett objekt
ATE492536T1 (de) Fluorsubstituierte 2-oxo-azepan-derivate
FI20055672A (sv) Stavtass
DE602007002752D1 (de) Abbildungsband
ITMI20060530A1 (it) Antinfiammatori a struttura monosaccaridica
FR2881395B1 (fr) Triporteur a balancier
DE112007000481A5 (de) Angelhilfsmittel
BRPI0820430A2 (pt) Composto
FR2935516B1 (fr) Modelisation d'un assemblage visse
SE0600698L (sv) Vinda
FR2914531B1 (fr) Boitier a circuit imprime etanche
FIU20040309U0 (sv) Tekniskt utrymme till ett småhus
SE0500141L (sv) Sätt att manövrera ett lås
TH111710B (th) สารประกอบสำหรับฆ่าแมลง

Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: SELMIC OY

Free format text: SELMIC OY

PC Transfer of assignment of patent

Owner name: ASPACT OY

Free format text: ASPACT OY

MA Patent expired