WO2007036610A8 - Attachment of conductor structure to object - Google Patents

Attachment of conductor structure to object

Info

Publication number
WO2007036610A8
WO2007036610A8 PCT/FI2006/050415 FI2006050415W WO2007036610A8 WO 2007036610 A8 WO2007036610 A8 WO 2007036610A8 FI 2006050415 W FI2006050415 W FI 2006050415W WO 2007036610 A8 WO2007036610 A8 WO 2007036610A8
Authority
WO
WIPO (PCT)
Prior art keywords
conductor structure
attachment
press
thermoplastic
temperature
Prior art date
Application number
PCT/FI2006/050415
Other languages
French (fr)
Other versions
WO2007036610A1 (en
Inventor
Juha Hagberg
Teija Kekonen
Original Assignee
Selmic Oy
Juha Hagberg
Teija Kekonen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selmic Oy, Juha Hagberg, Teija Kekonen filed Critical Selmic Oy
Publication of WO2007036610A1 publication Critical patent/WO2007036610A1/en
Publication of WO2007036610A8 publication Critical patent/WO2007036610A8/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A conductor structure (100) and an object (104) made of a thermoplastic material are pressed between a press (900) and a support substrate (910) into a mechanical contact with each other. The press (900) heats the conductor structure (100) to a temperature higher than the thermoplastic softening temperature, the heated conductor structure (100) producing in the object (104) a reversible temperature change that attaches the conductor structure (100) to the object (104) in such a way that the shape of the object (104) remains unchanged at least outside the point of attachment of the conductor structure (100).
PCT/FI2006/050415 2005-09-28 2006-09-28 Attachment of conductor structure to object WO2007036610A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20055515A FI20055515A (en) 2005-09-28 2005-09-28 Attaching a leader structure to an object
FI20055515 2005-09-28

Publications (2)

Publication Number Publication Date
WO2007036610A1 WO2007036610A1 (en) 2007-04-05
WO2007036610A8 true WO2007036610A8 (en) 2007-06-07

Family

ID=35151481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2006/050415 WO2007036610A1 (en) 2005-09-28 2006-09-28 Attachment of conductor structure to object

Country Status (2)

Country Link
FI (1) FI20055515A (en)
WO (1) WO2007036610A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120235879A1 (en) * 2009-04-21 2012-09-20 Molex Incorporated Three dimensional antenna
US8896488B2 (en) * 2011-03-01 2014-11-25 Apple Inc. Multi-element antenna structure with wrapped substrate
US9093745B2 (en) 2012-05-10 2015-07-28 Apple Inc. Antenna and proximity sensor structures having printed circuit and dielectric carrier layers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214315A (en) * 1962-03-28 1965-10-26 Burton Solomon Method for forming stamped electrical circuits
US3589224A (en) * 1968-10-14 1971-06-29 Buckee Mears Co Die punching printed circuit
DE3031751A1 (en) * 1980-08-22 1982-04-15 Wilhelm Ruf KG, 8000 München METHOD FOR PRODUCING ELECTROTECHNICAL COMPONENTS AND SLIDING OR TURNING RESISTANCE PRODUCED BY THIS METHOD
US4980016A (en) * 1985-08-07 1990-12-25 Canon Kabushiki Kaisha Process for producing electric circuit board
JP3168389B2 (en) * 1995-01-26 2001-05-21 矢崎総業株式会社 Circuit board manufacturing method
WO1998037740A1 (en) * 1997-02-21 1998-08-27 Koninklijke Philips Electronics N.V. A method of selectively metallizing a substrate using a hot foil embossing technique
GB2345196B (en) * 1998-12-23 2003-11-26 Nokia Mobile Phones Ltd An antenna and method of production
US6936336B2 (en) * 2002-03-15 2005-08-30 Kyocera Corporation Transfer sheet and production method of the same and wiring board and production method of the same
JP4142954B2 (en) * 2003-01-10 2008-09-03 京セラ株式会社 Printed wiring board manufacturing equipment
KR101008090B1 (en) * 2003-03-05 2011-01-13 인튠 써큐츠 오와이 Method for manufacturing an electrically conductive pattern
FI20045235A (en) * 2004-06-22 2005-12-23 Intune Circuits Oy Procedure for treating an electrically conductive pattern

Also Published As

Publication number Publication date
WO2007036610A1 (en) 2007-04-05
FI20055515A0 (en) 2005-09-28
FI20055515A (en) 2007-07-06

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Legal Events

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DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
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