FI20055515A0 - Attachment of a leader structure to an object - Google Patents
Attachment of a leader structure to an objectInfo
- Publication number
- FI20055515A0 FI20055515A0 FI20055515A FI20055515A FI20055515A0 FI 20055515 A0 FI20055515 A0 FI 20055515A0 FI 20055515 A FI20055515 A FI 20055515A FI 20055515 A FI20055515 A FI 20055515A FI 20055515 A0 FI20055515 A0 FI 20055515A0
- Authority
- FI
- Finland
- Prior art keywords
- attachment
- leader structure
- leader
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20055515A FI20055515A (en) | 2005-09-28 | 2005-09-28 | Attaching a leader structure to an object |
PCT/FI2006/050415 WO2007036610A1 (en) | 2005-09-28 | 2006-09-28 | Attachment of conductor structure to object |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20055515A FI20055515A (en) | 2005-09-28 | 2005-09-28 | Attaching a leader structure to an object |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20055515A0 true FI20055515A0 (en) | 2005-09-28 |
FI20055515A FI20055515A (en) | 2007-07-06 |
Family
ID=35151481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20055515A FI20055515A (en) | 2005-09-28 | 2005-09-28 | Attaching a leader structure to an object |
Country Status (2)
Country | Link |
---|---|
FI (1) | FI20055515A (en) |
WO (1) | WO2007036610A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012525065A (en) * | 2009-04-21 | 2012-10-18 | モレックス インコーポレイテド | 3D antenna |
US8896488B2 (en) | 2011-03-01 | 2014-11-25 | Apple Inc. | Multi-element antenna structure with wrapped substrate |
US9093745B2 (en) | 2012-05-10 | 2015-07-28 | Apple Inc. | Antenna and proximity sensor structures having printed circuit and dielectric carrier layers |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3214315A (en) * | 1962-03-28 | 1965-10-26 | Burton Solomon | Method for forming stamped electrical circuits |
US3589224A (en) * | 1968-10-14 | 1971-06-29 | Buckee Mears Co | Die punching printed circuit |
DE3031751A1 (en) * | 1980-08-22 | 1982-04-15 | Wilhelm Ruf KG, 8000 München | METHOD FOR PRODUCING ELECTROTECHNICAL COMPONENTS AND SLIDING OR TURNING RESISTANCE PRODUCED BY THIS METHOD |
US4980016A (en) * | 1985-08-07 | 1990-12-25 | Canon Kabushiki Kaisha | Process for producing electric circuit board |
JP3168389B2 (en) * | 1995-01-26 | 2001-05-21 | 矢崎総業株式会社 | Circuit board manufacturing method |
JP2000509909A (en) * | 1997-02-21 | 2000-08-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Method for selectively metallizing substrates using thermal foil embossing technology |
GB2345196B (en) * | 1998-12-23 | 2003-11-26 | Nokia Mobile Phones Ltd | An antenna and method of production |
US6936336B2 (en) * | 2002-03-15 | 2005-08-30 | Kyocera Corporation | Transfer sheet and production method of the same and wiring board and production method of the same |
JP4142954B2 (en) * | 2003-01-10 | 2008-09-03 | 京セラ株式会社 | Printed wiring board manufacturing equipment |
AU2003258741A1 (en) * | 2003-03-05 | 2004-09-28 | Outokumpu Oyj | Method and system for manufacturing an electrically conductive metal foil structure |
FI20045235A (en) * | 2004-06-22 | 2005-12-23 | Intune Circuits Oy | Procedure for treating an electrically conductive pattern |
-
2005
- 2005-09-28 FI FI20055515A patent/FI20055515A/en not_active IP Right Cessation
-
2006
- 2006-09-28 WO PCT/FI2006/050415 patent/WO2007036610A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FI20055515A (en) | 2007-07-06 |
WO2007036610A1 (en) | 2007-04-05 |
WO2007036610A8 (en) | 2007-06-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Transfer of assignment of patent |
Owner name: SELMIC OY Free format text: SELMIC OY |
|
PC | Transfer of assignment of patent |
Owner name: ASPACT OY Free format text: ASPACT OY |
|
MA | Patent expired |