DK1393605T3 - Printplade med mindst én elektronisk komponent - Google Patents

Printplade med mindst én elektronisk komponent

Info

Publication number
DK1393605T3
DK1393605T3 DK02745301T DK02745301T DK1393605T3 DK 1393605 T3 DK1393605 T3 DK 1393605T3 DK 02745301 T DK02745301 T DK 02745301T DK 02745301 T DK02745301 T DK 02745301T DK 1393605 T3 DK1393605 T3 DK 1393605T3
Authority
DK
Denmark
Prior art keywords
circuit board
electronic component
contact location
conductor path
contact
Prior art date
Application number
DK02745301T
Other languages
Danish (da)
English (en)
Inventor
Sergej Lopatin
Original Assignee
Birgel Dietmar
Endress Hauser Gmbh Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Birgel Dietmar, Endress Hauser Gmbh Co filed Critical Birgel Dietmar
Application granted granted Critical
Publication of DK1393605T3 publication Critical patent/DK1393605T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DK02745301T 2001-06-01 2002-05-18 Printplade med mindst én elektronisk komponent DK1393605T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10126655A DE10126655A1 (de) 2001-06-01 2001-06-01 Leiterplatte mit mindestens einem elektronischen Bauteil
PCT/EP2002/005512 WO2002100140A2 (fr) 2001-06-01 2002-05-18 Carte de circuits imprimes pourvue d'au moins un composant electronique

Publications (1)

Publication Number Publication Date
DK1393605T3 true DK1393605T3 (da) 2007-05-21

Family

ID=7686844

Family Applications (1)

Application Number Title Priority Date Filing Date
DK02745301T DK1393605T3 (da) 2001-06-01 2002-05-18 Printplade med mindst én elektronisk komponent

Country Status (9)

Country Link
US (1) US7304247B2 (fr)
EP (1) EP1393605B1 (fr)
JP (1) JP3842267B2 (fr)
CN (1) CN100534268C (fr)
AT (1) ATE352977T1 (fr)
AU (1) AU2002316910A1 (fr)
DE (2) DE10126655A1 (fr)
DK (1) DK1393605T3 (fr)
WO (1) WO2002100140A2 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150263A (ja) * 2003-11-13 2005-06-09 Nitto Denko Corp 両面配線回路基板
JP4091938B2 (ja) 2004-10-21 2008-05-28 日東電工株式会社 配線回路基板の製造方法
US20060226202A1 (en) * 2005-04-11 2006-10-12 Ho-Ching Yang PCB solder masking process
DE102005031181A1 (de) * 2005-07-01 2007-01-04 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit einer Oberfläche mit mehreren Kontaktflächen, Verfahren zur Beschichtung von Kontaktflächen einer Leiterplatte
CN100530856C (zh) * 2006-05-10 2009-08-19 日本航空电子工业株式会社 连接器
DE202006020419U1 (de) 2006-09-29 2008-07-24 Carl Freudenberg Kg Leiterstruktur
WO2011038090A1 (fr) * 2009-09-23 2011-03-31 3M Innovative Properties Company Connexion électrique et procédé de réalisation associé
TW201124007A (en) * 2009-12-30 2011-07-01 Au Optronics Corp Substrate and substrate bonding device using the same
JP2011199261A (ja) * 2010-02-24 2011-10-06 Panasonic Corp 電子部品
WO2011122723A1 (fr) * 2010-04-02 2011-10-06 주식회사 잉크테크 Procédé pour fabriquer une carte de circuit imprimé à deux côtés
US8354595B2 (en) * 2010-04-21 2013-01-15 Raytheon Company Adhesive reinforced open hole interconnect
EP2463809A1 (fr) 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
EP2482353B1 (fr) * 2011-02-01 2014-04-02 VEGA Grieshaber KG Liaison adhésive
PL2642544T3 (pl) * 2012-03-23 2015-03-31 Grieshaber Vega Kg Układ obejmujący aktuator piezoelektryczny i elastyczną płytkę z obwodem drukowanym
SG11201407290PA (en) 2012-05-16 2014-12-30 Nagravision Sa Method for producing an electronic card having an external connector and such an external connector
JP5681824B1 (ja) * 2013-10-01 2015-03-11 株式会社フジクラ 配線板組立体及びその製造方法
JP6724434B2 (ja) * 2016-03-10 2020-07-15 オムロン株式会社 電子部品実装方法、基板、電子回路、面光源装置、表示装置、及び、電子機器
JP2018163714A (ja) 2017-03-24 2018-10-18 株式会社東芝 サスペンションアッセンブリ、ヘッドサスペンションアッセンブリ、およびこれを備えたディスク装置
IT201700073501A1 (it) * 2017-06-30 2018-12-30 St Microelectronics Srl Prodotto a semiconduttore e corrispondente procedimento
US20200343517A1 (en) * 2019-04-23 2020-10-29 Tiveni MergeCo Inc. Multi-layer contact plate and method thereof

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2541828B1 (fr) * 1983-02-28 1985-09-13 Inf Milit Spatiale Aeronaut Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif
GB2175149B (en) * 1985-05-17 1988-09-01 Crystalate Electronics Flexible printed circuit board
DE3636817A1 (de) * 1986-10-29 1988-05-11 Mettler Instrumente Ag Mit bauteilen zum verloeten im loetbad bestueckte leiterplatte
JPH02268488A (ja) * 1989-04-10 1990-11-02 Toshiba Corp フレキシブル基板
US5014162A (en) * 1989-06-27 1991-05-07 At&T Bell Laboratories Solder assembly of components
JPH045844A (ja) * 1990-04-23 1992-01-09 Nippon Mektron Ltd Ｉｃ搭載用多層回路基板及びその製造法
WO1994018701A1 (fr) * 1993-02-05 1994-08-18 W.L. Gore & Associates, Inc. Interconnexion microplaquette a semi-conducteur/plaquette a circuits imprimes, resistante aux contraintes
GB9401869D0 (en) * 1994-02-01 1994-03-30 Heinze Dyconex Patente Improvements in and relating to printed circuit boards
US5459287A (en) * 1994-05-18 1995-10-17 Dell Usa, L.P. Socketed printed circuit board BGA connection apparatus and associated methods
JP2595909B2 (ja) 1994-09-14 1997-04-02 日本電気株式会社 半導体装置
JPH08125317A (ja) 1994-10-20 1996-05-17 Japan Aviation Electron Ind Ltd ソルダレス配線板
JP3610999B2 (ja) * 1996-06-07 2005-01-19 松下電器産業株式会社 半導体素子の実装方法
JP3012814B2 (ja) * 1996-10-30 2000-02-28 いわき電子株式会社 フレキシブルプリント基板
AU5238898A (en) * 1996-11-08 1998-05-29 W.L. Gore & Associates, Inc. Method for reducing via inductance in an electronic assembly and device
JP3038316U (ja) * 1996-12-02 1997-06-20 船井電機株式会社 フラットフレキシブルケーブル
JP3610762B2 (ja) * 1997-04-15 2005-01-19 株式会社村田製作所 圧電振動体の支持構造及びこの圧電振動体の支持構造を有する圧電トランス、ジャイロ並びに積層圧電体部品
WO1998049875A1 (fr) * 1997-04-30 1998-11-05 Motorola Inc. Procede de fixation d'objets metalliques sur une carte a circuits imprimes
JP3296264B2 (ja) * 1997-09-11 2002-06-24 株式会社村田製作所 圧電部品
JPH11248457A (ja) * 1998-02-27 1999-09-17 Alps Electric Co Ltd 振動型ジャイロスコープ
GB9828656D0 (en) * 1998-12-23 1999-02-17 Northern Telecom Ltd High density printed wiring board having in-via surface mounting pads
US6376051B1 (en) * 1999-03-10 2002-04-23 Matsushita Electric Industrial Co., Ltd. Mounting structure for an electronic component and method for producing the same
JP2000340923A (ja) 1999-05-31 2000-12-08 Ibiden Co Ltd プリント配線板及びそのプリント配線板への部品実装方法
DE10023220C2 (de) * 2000-05-08 2002-06-13 Infineon Technologies Ag Verbindungsanordnung
US6782616B2 (en) * 2001-01-12 2004-08-31 Hewlett-Packard Development Company, L.P. Connection arrangements for electrical devices

Also Published As

Publication number Publication date
JP3842267B2 (ja) 2006-11-08
WO2002100140A2 (fr) 2002-12-12
ATE352977T1 (de) 2007-02-15
AU2002316910A1 (en) 2002-12-16
CN100534268C (zh) 2009-08-26
DE50209353D1 (de) 2007-03-15
US7304247B2 (en) 2007-12-04
CN1650680A (zh) 2005-08-03
US20050006140A1 (en) 2005-01-13
JP2004534394A (ja) 2004-11-11
DE10126655A1 (de) 2002-12-05
EP1393605B1 (fr) 2007-01-24
EP1393605A2 (fr) 2004-03-03
WO2002100140A3 (fr) 2003-03-20

Similar Documents

Publication Publication Date Title
DK1393605T3 (da) Printplade med mindst én elektronisk komponent
TW342580B (en) Printed circuit assembly and method of manufacture therefor
ATE443932T1 (de) Elektrischer verbinder mit passiven schaltungselementen
IT1276178B1 (it) Componente elettronico pluripolare montabile sulla superficie
DK1956647T3 (da) Strömkredsarrangement med forbindelsesindretning og fremgangsmåde til fremstilling deraf
EP1458023A3 (fr) Dispositif électronique ayant une structure isolée électriquement conduisant la chaleur et méthode pour la fabrication de celui-ci
EP0996154A4 (fr) Dispositif a semi-conducteurs et son procede de fabrication, substrat a circuits et dispositif electronique
KR870008424A (ko) 박층 프린트 코일 구조
KR900017449A (ko) 전자 어셈블리 및 전자 어셈블리를 형성하는 공정
KR960705363A (ko) 집적회로장치(integrated circuit device)
TW200733022A (en) Emissive device and electronic apparatus
CY1110279T1 (el) Βυσματικος συνδετηρας καλωδιων για τυπωμενα κυκλωματα
SE9803392D0 (sv) Printed board assembly and method of its manufacture
TWI267173B (en) Circuit device and method for manufacturing thereof
SE9802157D0 (sv) Elektrisk komponent
AU2003224689A1 (en) Conductive polymer device and method of manufacturing same
DE50210352D1 (de) Träger für eine elektrische schaltung, insbesondere für einen elektrischen schalter
MX2021004887A (es) Circuito de alta corriente.
WO2001097285A3 (fr) Composant electronique constitue d'un boitier et d'un substrat
JP2002368453A5 (fr)
JP2007027472A5 (fr)
SE9800707D0 (sv) Motstånd
WO2001086718A3 (fr) Dispositif semiconducteur et procede de fabrication
GB2432977A (en) Electrical Circuit Package
DE10345202A1 (de) Befestigung von Leitern an Leiterplatten