DK1393605T3 - Printplade med mindst én elektronisk komponent - Google Patents
Printplade med mindst én elektronisk komponentInfo
- Publication number
- DK1393605T3 DK1393605T3 DK02745301T DK02745301T DK1393605T3 DK 1393605 T3 DK1393605 T3 DK 1393605T3 DK 02745301 T DK02745301 T DK 02745301T DK 02745301 T DK02745301 T DK 02745301T DK 1393605 T3 DK1393605 T3 DK 1393605T3
- Authority
- DK
- Denmark
- Prior art keywords
- circuit board
- electronic component
- contact location
- conductor path
- contact
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Credit Cards Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10126655A DE10126655A1 (de) | 2001-06-01 | 2001-06-01 | Leiterplatte mit mindestens einem elektronischen Bauteil |
PCT/EP2002/005512 WO2002100140A2 (fr) | 2001-06-01 | 2002-05-18 | Carte de circuits imprimes pourvue d'au moins un composant electronique |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1393605T3 true DK1393605T3 (da) | 2007-05-21 |
Family
ID=7686844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK02745301T DK1393605T3 (da) | 2001-06-01 | 2002-05-18 | Printplade med mindst én elektronisk komponent |
Country Status (9)
Country | Link |
---|---|
US (1) | US7304247B2 (fr) |
EP (1) | EP1393605B1 (fr) |
JP (1) | JP3842267B2 (fr) |
CN (1) | CN100534268C (fr) |
AT (1) | ATE352977T1 (fr) |
AU (1) | AU2002316910A1 (fr) |
DE (2) | DE10126655A1 (fr) |
DK (1) | DK1393605T3 (fr) |
WO (1) | WO2002100140A2 (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005150263A (ja) * | 2003-11-13 | 2005-06-09 | Nitto Denko Corp | 両面配線回路基板 |
JP4091938B2 (ja) * | 2004-10-21 | 2008-05-28 | 日東電工株式会社 | 配線回路基板の製造方法 |
US20060226202A1 (en) * | 2005-04-11 | 2006-10-12 | Ho-Ching Yang | PCB solder masking process |
DE102005031181A1 (de) * | 2005-07-01 | 2007-01-04 | Endress + Hauser Gmbh + Co. Kg | Leiterplatte mit einer Oberfläche mit mehreren Kontaktflächen, Verfahren zur Beschichtung von Kontaktflächen einer Leiterplatte |
CN100530856C (zh) * | 2006-05-10 | 2009-08-19 | 日本航空电子工业株式会社 | 连接器 |
DE202006020419U1 (de) | 2006-09-29 | 2008-07-24 | Carl Freudenberg Kg | Leiterstruktur |
KR20120071400A (ko) * | 2009-09-23 | 2012-07-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기 접속부 및 이를 제조하기 위한 방법 |
TW201124007A (en) * | 2009-12-30 | 2011-07-01 | Au Optronics Corp | Substrate and substrate bonding device using the same |
JP2011199261A (ja) * | 2010-02-24 | 2011-10-06 | Panasonic Corp | 電子部品 |
JP5450885B2 (ja) * | 2010-04-02 | 2014-03-26 | インクテック カンパニー リミテッド | 両面プリント回路基板の製造方法 |
US8354595B2 (en) * | 2010-04-21 | 2013-01-15 | Raytheon Company | Adhesive reinforced open hole interconnect |
EP2463809A1 (fr) | 2010-12-07 | 2012-06-13 | NagraID S.A. | Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne |
EP2482353B1 (fr) | 2011-02-01 | 2014-04-02 | VEGA Grieshaber KG | Liaison adhésive |
EP2642544B1 (fr) * | 2012-03-23 | 2014-10-01 | VEGA Grieshaber KG | Agencement à partir d'un piézoactionneur et d'une plaquette flexible |
PL2850562T3 (pl) | 2012-05-16 | 2017-07-31 | Nagravision S.A. | Sposób wytwarzania karty elektronicznej ze złączem zewnętrznym |
JP5681824B1 (ja) * | 2013-10-01 | 2015-03-11 | 株式会社フジクラ | 配線板組立体及びその製造方法 |
JP6724434B2 (ja) * | 2016-03-10 | 2020-07-15 | オムロン株式会社 | 電子部品実装方法、基板、電子回路、面光源装置、表示装置、及び、電子機器 |
JP2018163714A (ja) | 2017-03-24 | 2018-10-18 | 株式会社東芝 | サスペンションアッセンブリ、ヘッドサスペンションアッセンブリ、およびこれを備えたディスク装置 |
IT201700073501A1 (it) * | 2017-06-30 | 2018-12-30 | St Microelectronics Srl | Prodotto a semiconduttore e corrispondente procedimento |
US20200343517A1 (en) * | 2019-04-23 | 2020-10-29 | Tiveni MergeCo Inc. | Multi-layer contact plate and method thereof |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2541828B1 (fr) | 1983-02-28 | 1985-09-13 | Inf Milit Spatiale Aeronaut | Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif |
GB2175149B (en) * | 1985-05-17 | 1988-09-01 | Crystalate Electronics | Flexible printed circuit board |
DE3636817A1 (de) * | 1986-10-29 | 1988-05-11 | Mettler Instrumente Ag | Mit bauteilen zum verloeten im loetbad bestueckte leiterplatte |
JPH02268488A (ja) | 1989-04-10 | 1990-11-02 | Toshiba Corp | フレキシブル基板 |
US5014162A (en) | 1989-06-27 | 1991-05-07 | At&T Bell Laboratories | Solder assembly of components |
JPH045844A (ja) * | 1990-04-23 | 1992-01-09 | Nippon Mektron Ltd | Ic搭載用多層回路基板及びその製造法 |
WO1994018701A1 (fr) * | 1993-02-05 | 1994-08-18 | W.L. Gore & Associates, Inc. | Interconnexion microplaquette a semi-conducteur/plaquette a circuits imprimes, resistante aux contraintes |
GB9401869D0 (en) * | 1994-02-01 | 1994-03-30 | Heinze Dyconex Patente | Improvements in and relating to printed circuit boards |
US5459287A (en) * | 1994-05-18 | 1995-10-17 | Dell Usa, L.P. | Socketed printed circuit board BGA connection apparatus and associated methods |
JP2595909B2 (ja) * | 1994-09-14 | 1997-04-02 | 日本電気株式会社 | 半導体装置 |
JPH08125317A (ja) | 1994-10-20 | 1996-05-17 | Japan Aviation Electron Ind Ltd | ソルダレス配線板 |
JP3610999B2 (ja) * | 1996-06-07 | 2005-01-19 | 松下電器産業株式会社 | 半導体素子の実装方法 |
JP3012814B2 (ja) * | 1996-10-30 | 2000-02-28 | いわき電子株式会社 | フレキシブルプリント基板 |
AU5238898A (en) * | 1996-11-08 | 1998-05-29 | W.L. Gore & Associates, Inc. | Method for reducing via inductance in an electronic assembly and device |
JP3038316U (ja) * | 1996-12-02 | 1997-06-20 | 船井電機株式会社 | フラットフレキシブルケーブル |
JP3610762B2 (ja) * | 1997-04-15 | 2005-01-19 | 株式会社村田製作所 | 圧電振動体の支持構造及びこの圧電振動体の支持構造を有する圧電トランス、ジャイロ並びに積層圧電体部品 |
BR9807963A (pt) * | 1997-04-30 | 2000-03-08 | Motorola Inc | Aparelho e método de soldagem de um flange metálico a uma placa de circuito impresso |
JP3296264B2 (ja) * | 1997-09-11 | 2002-06-24 | 株式会社村田製作所 | 圧電部品 |
JPH11248457A (ja) * | 1998-02-27 | 1999-09-17 | Alps Electric Co Ltd | 振動型ジャイロスコープ |
GB9828656D0 (en) * | 1998-12-23 | 1999-02-17 | Northern Telecom Ltd | High density printed wiring board having in-via surface mounting pads |
US6376051B1 (en) * | 1999-03-10 | 2002-04-23 | Matsushita Electric Industrial Co., Ltd. | Mounting structure for an electronic component and method for producing the same |
JP2000340923A (ja) | 1999-05-31 | 2000-12-08 | Ibiden Co Ltd | プリント配線板及びそのプリント配線板への部品実装方法 |
DE10023220C2 (de) * | 2000-05-08 | 2002-06-13 | Infineon Technologies Ag | Verbindungsanordnung |
US6782616B2 (en) * | 2001-01-12 | 2004-08-31 | Hewlett-Packard Development Company, L.P. | Connection arrangements for electrical devices |
-
2001
- 2001-06-01 DE DE10126655A patent/DE10126655A1/de not_active Withdrawn
-
2002
- 2002-05-18 CN CNB028111451A patent/CN100534268C/zh not_active Expired - Fee Related
- 2002-05-18 EP EP02745301A patent/EP1393605B1/fr not_active Expired - Lifetime
- 2002-05-18 DE DE50209353T patent/DE50209353D1/de not_active Expired - Lifetime
- 2002-05-18 AT AT02745301T patent/ATE352977T1/de not_active IP Right Cessation
- 2002-05-18 WO PCT/EP2002/005512 patent/WO2002100140A2/fr active IP Right Grant
- 2002-05-18 DK DK02745301T patent/DK1393605T3/da active
- 2002-05-18 US US10/478,295 patent/US7304247B2/en not_active Expired - Lifetime
- 2002-05-18 AU AU2002316910A patent/AU2002316910A1/en not_active Abandoned
- 2002-05-18 JP JP2003501977A patent/JP3842267B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1650680A (zh) | 2005-08-03 |
DE10126655A1 (de) | 2002-12-05 |
WO2002100140A3 (fr) | 2003-03-20 |
JP2004534394A (ja) | 2004-11-11 |
EP1393605B1 (fr) | 2007-01-24 |
AU2002316910A1 (en) | 2002-12-16 |
DE50209353D1 (de) | 2007-03-15 |
ATE352977T1 (de) | 2007-02-15 |
WO2002100140A2 (fr) | 2002-12-12 |
JP3842267B2 (ja) | 2006-11-08 |
EP1393605A2 (fr) | 2004-03-03 |
US20050006140A1 (en) | 2005-01-13 |
CN100534268C (zh) | 2009-08-26 |
US7304247B2 (en) | 2007-12-04 |
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