DK0870337T3 - Fremstilling af termoelektriske moduler og loddemiddel til en sådan fremstilling - Google Patents

Fremstilling af termoelektriske moduler og loddemiddel til en sådan fremstilling

Info

Publication number
DK0870337T3
DK0870337T3 DK96936249T DK96936249T DK0870337T3 DK 0870337 T3 DK0870337 T3 DK 0870337T3 DK 96936249 T DK96936249 T DK 96936249T DK 96936249 T DK96936249 T DK 96936249T DK 0870337 T3 DK0870337 T3 DK 0870337T3
Authority
DK
Denmark
Prior art keywords
solder
thermoelectric
manufacture
preparation
thermoelectric modules
Prior art date
Application number
DK96936249T
Other languages
Danish (da)
English (en)
Inventor
Michael Yahatz
James Harper
Original Assignee
Melcor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melcor Corp filed Critical Melcor Corp
Application granted granted Critical
Publication of DK0870337T3 publication Critical patent/DK0870337T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Connection of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
DK96936249T 1995-10-03 1996-09-30 Fremstilling af termoelektriske moduler og loddemiddel til en sådan fremstilling DK0870337T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53844995A 1995-10-03 1995-10-03
PCT/US1996/016077 WO1997013283A1 (fr) 1995-10-03 1996-09-30 Fabrication de modules thermoelectriques et metal d'apport de brasage pour cette fabrication

Publications (1)

Publication Number Publication Date
DK0870337T3 true DK0870337T3 (da) 2003-03-03

Family

ID=24146982

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96936249T DK0870337T3 (da) 1995-10-03 1996-09-30 Fremstilling af termoelektriske moduler og loddemiddel til en sådan fremstilling

Country Status (22)

Country Link
US (1) US5817188A (fr)
EP (1) EP0870337B1 (fr)
JP (1) JP3862179B2 (fr)
KR (1) KR19990066931A (fr)
CN (1) CN1326256C (fr)
AT (1) ATE228270T1 (fr)
AU (1) AU702453B2 (fr)
BR (1) BR9610829A (fr)
CA (1) CA2233979C (fr)
CZ (1) CZ102898A3 (fr)
DE (1) DE69624936T2 (fr)
DK (1) DK0870337T3 (fr)
EA (1) EA000388B1 (fr)
ES (1) ES2183979T3 (fr)
HU (1) HUP9902023A3 (fr)
IL (1) IL123773A (fr)
MX (1) MX9802673A (fr)
NO (1) NO981507D0 (fr)
PT (1) PT870337E (fr)
TR (1) TR199800606T1 (fr)
UA (1) UA51672C2 (fr)
WO (1) WO1997013283A1 (fr)

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US20100024436A1 (en) * 2008-08-01 2010-02-04 Baker Hughes Incorporated Downhole tool with thin film thermoelectric cooling
WO2010125411A1 (fr) * 2009-04-27 2010-11-04 Szenergia Kft. Procédé de fabrication de dispositif contenant des pièces métallique et semi-conductrice intermétallique assemblées l'une à l'autre, avec connexion électriquement et thermiquement conductrice, en particulier une tige appropriée pour utilisation avec des modules thermoélectriques
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US8889454B2 (en) * 2011-11-08 2014-11-18 Ut-Battelle, Llc Manufacture of thermoelectric generator structures by fiber drawing
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US10367131B2 (en) 2013-12-06 2019-07-30 Sridhar Kasichainula Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device
US10290794B2 (en) 2016-12-05 2019-05-14 Sridhar Kasichainula Pin coupling based thermoelectric device
US11024789B2 (en) 2013-12-06 2021-06-01 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs
US10566515B2 (en) 2013-12-06 2020-02-18 Sridhar Kasichainula Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device
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Also Published As

Publication number Publication date
UA51672C2 (uk) 2002-12-16
HUP9902023A2 (hu) 1999-11-29
CA2233979C (fr) 2005-09-27
EP0870337A1 (fr) 1998-10-14
CZ102898A3 (cs) 1998-08-12
CN1326256C (zh) 2007-07-11
BR9610829A (pt) 1999-12-21
KR19990066931A (ko) 1999-08-16
IL123773A0 (en) 1999-11-30
JP3862179B2 (ja) 2006-12-27
DE69624936D1 (de) 2003-01-02
EP0870337B1 (fr) 2002-11-20
ES2183979T3 (es) 2003-04-01
HUP9902023A3 (en) 2002-11-28
WO1997013283A1 (fr) 1997-04-10
NO981507L (no) 1998-04-02
US5817188A (en) 1998-10-06
DE69624936T2 (de) 2003-03-27
TR199800606T1 (xx) 1998-06-22
NO981507D0 (no) 1998-04-02
EP0870337A4 (fr) 1999-02-17
AU702453B2 (en) 1999-02-18
AU7394796A (en) 1997-04-28
PT870337E (pt) 2003-03-31
IL123773A (en) 2001-03-19
JP2002507321A (ja) 2002-03-05
CN1211342A (zh) 1999-03-17
CA2233979A1 (fr) 1997-04-10
EA000388B1 (ru) 1999-06-24
ATE228270T1 (de) 2002-12-15
EA199800303A1 (ru) 1998-10-29
MX9802673A (es) 1998-11-30

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