DK0507168T3 - Fremgangsmåde til test af integrerede halvlederkredsløb,som er indloddede på kredsløbskort,og anvendelse af transistortester til denne fremgangsmåde. - Google Patents

Fremgangsmåde til test af integrerede halvlederkredsløb,som er indloddede på kredsløbskort,og anvendelse af transistortester til denne fremgangsmåde.

Info

Publication number
DK0507168T3
DK0507168T3 DK92104967.2T DK92104967T DK0507168T3 DK 0507168 T3 DK0507168 T3 DK 0507168T3 DK 92104967 T DK92104967 T DK 92104967T DK 0507168 T3 DK0507168 T3 DK 0507168T3
Authority
DK
Denmark
Prior art keywords
integrated circuit
transistor
loaded
circuit boards
integrated semiconductor
Prior art date
Application number
DK92104967.2T
Other languages
Danish (da)
English (en)
Inventor
Manfred Buks
Original Assignee
Ita Ingenieurb Ro F R Testaufg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ita Ingenieurb Ro F R Testaufg filed Critical Ita Ingenieurb Ro F R Testaufg
Application granted granted Critical
Publication of DK0507168T3 publication Critical patent/DK0507168T3/da

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DK92104967.2T 1991-03-30 1992-03-23 Fremgangsmåde til test af integrerede halvlederkredsløb,som er indloddede på kredsløbskort,og anvendelse af transistortester til denne fremgangsmåde. DK0507168T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4110551A DE4110551C1 (pl) 1991-03-30 1991-03-30

Publications (1)

Publication Number Publication Date
DK0507168T3 true DK0507168T3 (da) 1997-06-23

Family

ID=6428601

Family Applications (1)

Application Number Title Priority Date Filing Date
DK92104967.2T DK0507168T3 (da) 1991-03-30 1992-03-23 Fremgangsmåde til test af integrerede halvlederkredsløb,som er indloddede på kredsløbskort,og anvendelse af transistortester til denne fremgangsmåde.

Country Status (6)

Country Link
US (1) US5280237A (pl)
EP (1) EP0507168B1 (pl)
AT (1) ATE147863T1 (pl)
DE (2) DE4110551C1 (pl)
DK (1) DK0507168T3 (pl)
ES (1) ES2098385T3 (pl)

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US5565767A (en) * 1992-04-16 1996-10-15 Mega Chips Corporation Base substrate of multichip module and method for inspecting the same
IT1259395B (it) * 1992-05-29 1996-03-13 Luciano Bonaria Metodo di rilevamento di connesioni erronee in schede elettroniche
DE4309842C1 (de) * 1993-03-26 1994-06-16 Arnold Edv Gmbh Verfahren zum Testen von Platinen und Vorrichtung zur Durchführung des Verfahrens
DE4319710C1 (de) * 1993-06-15 1994-09-29 Ita Ingb Testaufgaben Gmbh Testverfahren für einen auf einer Platine eingelöteten IC und Testvorrichtung zum Durchführen des Testverfahrens
DE4400101C1 (de) * 1994-01-04 1995-04-20 Ita Ingb Testaufgaben Gmbh I¶D¶¶D¶-Testvorrichtung für CMOS-ICs
DE4400102C1 (de) * 1994-01-04 1995-04-20 Ita Ingb Testaufgaben Gmbh I¶D¶¶D¶-Meßvorrichtung für CMOS-ICs
DE4402230C1 (de) * 1994-01-26 1995-01-19 Gfp Ges Fuer Prueftechnik Mbh Verfahren zum Testen, ob Anschlußstifte einer integrierten Schaltung in eine gedruckte Schaltung elektrisch leitend eingelötet sind und Schaltungsanordnung zur Durchführung des Verfahrens
US5521513A (en) * 1994-10-25 1996-05-28 Teradyne Inc Manufacturing defect analyzer
US5654788A (en) * 1995-02-10 1997-08-05 Eastman Kodak Company Cartridge sensing device
DE19506720C1 (de) * 1995-02-27 1996-09-05 Digitaltest Ges Fuer Elektroni Verfahren zum Prüfen des Kontaktes zwischen Anschlußstiften und Leiterbahnen sowie Vorrichtung zum Durchführen des Verfahrens
US5786700A (en) * 1996-05-20 1998-07-28 International Business Machines Corporation Method for determining interconnection resistance of wire leads in electronic packages
US5818251A (en) * 1996-06-11 1998-10-06 National Semiconductor Corporation Apparatus and method for testing the connections between an integrated circuit and a printed circuit board
US5905915A (en) * 1997-05-22 1999-05-18 Eastman Kodak Company Frangible portion of one-time-use camera must be broken to open camera, which leaves hold to discourage unauthorized recycling
US5895125A (en) * 1997-05-22 1999-04-20 Eastman Kodak Company One-time-use camera can only be used with modified film cartridge, to prevent unauthorized reuse with standard film cartridge
US5802401A (en) * 1997-05-22 1998-09-01 Eastman Kodak Company Method of remanufacturing one-time-use camera
US5956280A (en) * 1998-03-02 1999-09-21 Tanisys Technology, Inc. Contact test method and system for memory testers
DE10135805A1 (de) * 2001-07-23 2003-02-13 Infineon Technologies Ag Vorrichtung und Verfahren zur Erfassung einer Zuverlässigkeit von integrierten Halbleiterbauelementen bei hohen Temperaturen
GB2394780B (en) * 2002-10-29 2006-06-14 Ifr Ltd A method of and apparatus for testing for integrated circuit contact defects
DE10313264A1 (de) * 2003-03-24 2004-10-28 Scorpion Technologies Ag Verfahren zum Testen von Bauelementen einer Schaltungsplatine
JP4062301B2 (ja) * 2004-11-19 2008-03-19 株式会社デンソー 車両用電源装置
US7279907B2 (en) * 2006-02-28 2007-10-09 Freescale Semiconductor, Inc. Method of testing for power and ground continuity of a semiconductor device
DE102006028414B4 (de) 2006-06-21 2022-03-24 Robert Bosch Gmbh Testverfahren und Testvorrichtung für eine integrierte Schaltung
US7983880B1 (en) * 2008-02-20 2011-07-19 Altera Corporation Simultaneous switching noise analysis using superposition techniques
US8694946B1 (en) 2008-02-20 2014-04-08 Altera Corporation Simultaneous switching noise optimization
US11777334B2 (en) * 2021-11-11 2023-10-03 Beta Air, Llc System for charging multiple power sources and monitoring diode currents for faults

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Publication number Priority date Publication date Assignee Title
GB1558502A (en) * 1975-07-18 1980-01-03 Tokyo Shibaura Electric Co Semiconductor integrated circuit device
DE2534502C3 (de) * 1975-08-01 1981-01-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Individuell prüfbarer, integrierter Baustein
US4035826A (en) * 1976-02-23 1977-07-12 Rca Corporation Reduction of parasitic bipolar effects in integrated circuits employing insulated gate field effect transistors via the use of low resistance substrate contacts extending through source region
IT1215273B (it) * 1985-05-09 1990-01-31 Ates Componenti Elettron Procedimento e dispositivo per identificare transistori parassiti in una struttura integrata.
US4779041A (en) * 1987-05-20 1988-10-18 Hewlett-Packard Company Integrated circuit transfer test device system
US4779043A (en) * 1987-08-26 1988-10-18 Hewlett-Packard Company Reversed IC test device and method
US4853628A (en) * 1987-09-10 1989-08-01 Gazelle Microcircuits, Inc. Apparatus for measuring circuit parameters of a packaged semiconductor device
US4998250A (en) * 1988-09-08 1991-03-05 Data I/O Corporation Method and apparatus for determining an internal state of an electronic component
US4963824A (en) * 1988-11-04 1990-10-16 International Business Machines Corporation Diagnostics of a board containing a plurality of hybrid electronic components
US5101152A (en) * 1990-01-31 1992-03-31 Hewlett-Packard Company Integrated circuit transfer test device system utilizing lateral transistors

Also Published As

Publication number Publication date
DE59207872D1 (de) 1997-02-27
DE4110551C1 (pl) 1992-07-23
ATE147863T1 (de) 1997-02-15
ES2098385T3 (es) 1997-05-01
EP0507168A1 (de) 1992-10-07
EP0507168B1 (de) 1997-01-15
US5280237A (en) 1994-01-18

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