DE69936493D1 - Verbindungsstruktur für Leiterplatte, elektro-optische Vorrichtung, damit versehenes elektronisches Gerät und Herstellungsverfahren für elektro-optische Vorrichtung - Google Patents

Verbindungsstruktur für Leiterplatte, elektro-optische Vorrichtung, damit versehenes elektronisches Gerät und Herstellungsverfahren für elektro-optische Vorrichtung

Info

Publication number
DE69936493D1
DE69936493D1 DE69936493T DE69936493T DE69936493D1 DE 69936493 D1 DE69936493 D1 DE 69936493D1 DE 69936493 T DE69936493 T DE 69936493T DE 69936493 T DE69936493 T DE 69936493T DE 69936493 D1 DE69936493 D1 DE 69936493D1
Authority
DE
Germany
Prior art keywords
electro
optical device
circuit board
connection structure
board connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69936493T
Other languages
English (en)
Other versions
DE69936493T2 (de
Inventor
Eiji Muramatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE69936493D1 publication Critical patent/DE69936493D1/de
Application granted granted Critical
Publication of DE69936493T2 publication Critical patent/DE69936493T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/46—Fixing elements
    • G02F2201/465—Snap -fit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69936493T 1998-08-18 1999-08-17 Verbindungsstruktur für Leiterplatte, elektro-optische Vorrichtung, damit versehenes elektronisches Gerät und Herstellungsverfahren für elektro-optische Vorrichtung Expired - Lifetime DE69936493T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP23212998 1998-08-18
JP23212998 1998-08-18
JP18558299 1999-06-30
JP18558299A JP4298068B2 (ja) 1998-08-18 1999-06-30 電気光学装置およびそれらを備えた電子機器並びに電気光学装置の製造方法

Publications (2)

Publication Number Publication Date
DE69936493D1 true DE69936493D1 (de) 2007-08-23
DE69936493T2 DE69936493T2 (de) 2008-03-20

Family

ID=26503196

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69936493T Expired - Lifetime DE69936493T2 (de) 1998-08-18 1999-08-17 Verbindungsstruktur für Leiterplatte, elektro-optische Vorrichtung, damit versehenes elektronisches Gerät und Herstellungsverfahren für elektro-optische Vorrichtung

Country Status (7)

Country Link
US (2) US6191838B1 (de)
EP (1) EP0981183B1 (de)
JP (1) JP4298068B2 (de)
KR (1) KR100505958B1 (de)
CN (1) CN1245325A (de)
DE (1) DE69936493T2 (de)
TW (1) TW454162B (de)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6781662B1 (en) * 1998-04-09 2004-08-24 Seiko Epson Corporation Compression-bond connection substrate, liquid crystal device, and electronic equipment
JP3594500B2 (ja) * 1998-11-12 2004-12-02 松下電器産業株式会社 液晶表示器取付接続装置
CN1273371C (zh) * 1999-03-31 2006-09-06 精工爱普生株式会社 窄间距用连接器、间距变换装置、微机械、压电传动器、静电传动器、喷墨头、喷墨打印机、液晶面板、电子装置
US6456353B1 (en) * 1999-11-04 2002-09-24 Chi Mei Opto Electronics Corp. Display driver integrated circuit module
JP3622665B2 (ja) * 1999-12-10 2005-02-23 セイコーエプソン株式会社 接続構造、電気光学装置および電子機器
JP2001249354A (ja) * 2000-03-06 2001-09-14 Hirose Electric Co Ltd 電気コネクタ
US6334784B1 (en) * 2000-08-07 2002-01-01 Teradyne, Inc. Z-axis pressure mount connector fixture
JP3630116B2 (ja) 2000-08-10 2005-03-16 セイコーエプソン株式会社 電気光学ユニットおよび電子機器
EP1207729A3 (de) * 2000-11-17 2004-03-10 Three-Five Systems, Inc. Gehäuse und Verfahren zum Verpacken und elektrische Verbindung eines Mikrodisplays
ATE426832T1 (de) * 2000-11-22 2009-04-15 Kim Si Han Klappbare anzeigevorrichtung
KR100396771B1 (ko) * 2001-01-13 2003-09-03 엘지전자 주식회사 액정 표시 장치 및 그를 이용한 이동 단말기
US6965375B1 (en) 2001-04-27 2005-11-15 Palm, Inc. Compact integrated touch panel display for a handheld device
US7692667B2 (en) * 2001-08-17 2010-04-06 Palm, Inc. Handheld computer having moveable segments that are interactive with an integrated display
DE10146593B4 (de) * 2001-09-21 2011-12-08 Robert Bosch Gmbh Anzeigevorrichtung
TWI240099B (en) * 2001-11-06 2005-09-21 Hannstar Display Corp Method for cutting tape carrier packages of LCD and LCD structure
JP2005516259A (ja) * 2002-01-29 2005-06-02 キム，シ，ハン 携帯用マルチディスプレイ装置
US7183582B2 (en) * 2002-05-29 2007-02-27 Seiko Epson Coporation Electro-optical device and method of manufacturing the same, element driving device and method of manufacturing the same, element substrate, and electronic apparatus
US6763156B2 (en) * 2002-06-12 2004-07-13 Mcnc Flexible optoelectronic circuit and associated method
US20040027526A1 (en) * 2002-08-08 2004-02-12 Hannstar Display Corporation Liquid crystal display device
US20040056989A1 (en) * 2002-09-24 2004-03-25 Betz Alexander C. Parameter floodlit LCD
EP1437683B1 (de) * 2002-12-27 2017-03-08 Semiconductor Energy Laboratory Co., Ltd. Chipkarte und Buchhaltungssystem unter Verwendung der Chipkarte
US7652359B2 (en) * 2002-12-27 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Article having display device
KR100451775B1 (ko) * 2002-12-31 2004-10-08 엘지.필립스 엘시디 주식회사 터치 패널
TW549474U (en) * 2003-01-21 2003-08-21 Coretronic Corp Fixing structure for light valve
US7436050B2 (en) 2003-01-22 2008-10-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a flexible printed circuit
JP4526771B2 (ja) 2003-03-14 2010-08-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4217090B2 (ja) * 2003-03-20 2009-01-28 株式会社 日立ディスプレイズ 表示装置
KR100908231B1 (ko) * 2003-04-15 2009-07-20 삼성모바일디스플레이주식회사 평판표시소자
TWI222548B (en) * 2003-05-09 2004-10-21 Benq Corp Projector and method for assembling the projector
EP1498769B1 (de) * 2003-07-15 2007-05-02 Siemens Aktiengesellschaft Metallgehäuse für eine Anzeigevorrichtung sowie Verfahren zu dessen Montage
US7566001B2 (en) * 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
JP2005091971A (ja) * 2003-09-19 2005-04-07 Hitachi Displays Ltd 表示装置
JP4543772B2 (ja) * 2003-09-19 2010-09-15 セイコーエプソン株式会社 電気光学装置および電子機器
TW594274B (en) * 2003-10-16 2004-06-21 Au Optronics Corp Display module
TW594323B (en) * 2003-10-21 2004-06-21 Hannstar Display Corp Liquid crystal system conductive line structure
JP3976019B2 (ja) * 2004-02-10 2007-09-12 セイコーエプソン株式会社 実装構造体、電気光学装置、および電子機器
JP4574288B2 (ja) * 2004-04-09 2010-11-04 大日本印刷株式会社 リジッド−フレキシブル基板の製造方法
US20050265650A1 (en) * 2004-05-27 2005-12-01 Sunil Priyadarshi Small profile, pluggable optical transceiver subassembly
KR100617116B1 (ko) * 2004-08-06 2006-08-31 엘지전자 주식회사 영상표시장치
DE102005018336A1 (de) 2005-02-28 2006-08-31 Osram Opto Semiconductors Gmbh Lichtleiter
KR100715437B1 (ko) * 2005-06-15 2007-05-09 삼성전자주식회사 인쇄회로기판
TWI264762B (en) * 2005-09-05 2006-10-21 Phoenix Prec Technology Corp Optical electronics integrated semiconductor package
JP4579136B2 (ja) * 2005-11-07 2010-11-10 理研計器株式会社 防爆型ガス検知器
KR100722096B1 (ko) * 2005-11-23 2007-05-25 삼성에스디아이 주식회사 휴대용 표시장치
KR100715316B1 (ko) 2006-02-13 2007-05-08 삼성전자주식회사 유연성 회로 기판을 이용하는 반도체 칩 패키지 실장 구조
CN100501809C (zh) * 2006-02-22 2009-06-17 朱建新 总线式供电显示屏
US8007704B2 (en) * 2006-07-20 2011-08-30 Honeywell International Inc. Insert molded actuator components
JP2008090193A (ja) * 2006-10-04 2008-04-17 Infovision Optoelectronics Holdings Ltd 液晶表示装置用カバーユニットおよび液晶表示装置
KR100800686B1 (ko) * 2006-11-24 2008-02-01 삼성전자주식회사 엘시디 모듈과 그를 이용한 액정 영상 수단
US7344383B1 (en) * 2006-12-27 2008-03-18 Intel Corporation Split socket optical interconnect
DE102006062485A1 (de) * 2006-12-28 2008-07-03 Robert Bosch Gmbh Elektrische Kontaktiervorrichtung, insbesondere für elektronische Schaltungen, und elektrische/elektronische Schaltung
JP4670855B2 (ja) * 2007-11-08 2011-04-13 セイコーエプソン株式会社 表示装置および時計
JP2009163672A (ja) * 2008-01-10 2009-07-23 Mitsubishi Electric Corp 表示装置
US7870665B2 (en) * 2008-03-28 2011-01-18 Ibiden Co., Ltd. Method of manufacturing a conductor circuit, and a coil sheet and laminated coil
TW201022765A (en) * 2008-12-04 2010-06-16 Hannspree Inc Panel holding device and method
EP2282304A4 (de) * 2008-04-22 2011-04-20 Sharp Kk Elektronisches gehäuse, anzeigevorrichtung und elektronische vorrichtung
CN102007522B (zh) * 2008-04-22 2013-06-12 夏普株式会社 电子封装件、显示装置以及电子设备
KR101345172B1 (ko) * 2008-07-18 2013-12-27 엘지디스플레이 주식회사 전기영동 표시소자
CN101770092A (zh) * 2008-12-31 2010-07-07 群康科技(深圳)有限公司 液晶显示器及其框架、以及该框架的制造方法
CN101842000B (zh) * 2009-03-19 2014-04-30 鸿富锦精密工业（深圳）有限公司 贴附装置及使用该贴附装置的贴附方法
JP5517239B2 (ja) * 2009-11-10 2014-06-11 日本航空電子工業株式会社 コネクタ
TWM381090U (en) * 2009-11-12 2010-05-21 Chunghwa Picture Tubes Ltd Display module
US8644025B2 (en) * 2009-12-22 2014-02-04 Mxtran Inc. Integrated circuit film for smart card
TWI473022B (zh) * 2009-12-22 2015-02-11 Mxtran Inc 用於貼附於智慧卡之積體電路貼片
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
JP2012088605A (ja) * 2010-10-21 2012-05-10 Hitachi Displays Ltd 表示装置
US9179560B2 (en) * 2010-10-25 2015-11-03 Korea Electric Terminal Co., Ltd. Board block for vehicles
KR20120049019A (ko) * 2010-11-08 2012-05-16 삼성모바일디스플레이주식회사 정전용량형 터치 패널
JP5754956B2 (ja) * 2011-01-27 2015-07-29 サトーホールディングス株式会社 プリンタの情報表示器
CN102645762A (zh) * 2011-02-18 2012-08-22 鸿富锦精密工业（深圳）有限公司 显示装置
CN102738609A (zh) * 2011-04-06 2012-10-17 鸿富锦精密工业（深圳）有限公司 电子元件固定装置
JP2012222577A (ja) * 2011-04-07 2012-11-12 Funai Electric Co Ltd 機器基板取付け構造
JP5518806B2 (ja) * 2011-08-04 2014-06-11 株式会社ソニー・コンピュータエンタテインメント 電子機器
KR101878179B1 (ko) * 2011-11-23 2018-07-16 엘지디스플레이 주식회사 구동회로기판 및 이를 포함하는 액정표시장치
US8870440B2 (en) * 2012-03-30 2014-10-28 Shenzhen China Star Optoelectronics Technology Co., Ltd. Back light module and liquid crystal display device having the same
US9418254B2 (en) * 2013-02-01 2016-08-16 Mxtran Inc. Integrated circuit film and method for manipulating the same
US9368427B2 (en) 2013-02-01 2016-06-14 Mxtran Inc. Integrated circuit film and method of manufacturing the same
US10852025B2 (en) * 2013-04-30 2020-12-01 Ademco Inc. HVAC controller with fixed segment display having fixed segment icons and animation
DE102013008433B4 (de) * 2013-05-17 2020-12-03 Lisa Dräxlmaier GmbH Flächige Vorrichtung zur Beleuchtung der Innenausstattung eines Fahrzeugs
EP3074812B1 (de) * 2013-11-28 2019-03-27 GIO Optoelectronics Corp. Matrixschaltungssubstrat, anzeigevorrichtung, und herstellungsverfahren für das matrixschaltungssubstrat
KR102107456B1 (ko) * 2013-12-10 2020-05-08 삼성디스플레이 주식회사 플렉시블 표시 장치 및 이의 제조 방법
KR102232424B1 (ko) * 2014-09-19 2021-03-29 삼성디스플레이 주식회사 표시모듈 조립용 압착패드 및 표시모듈 조립 방법
WO2017209315A1 (ko) * 2016-05-30 2017-12-07 주식회사 옵텔라 전기 인터페이스 결합구조
JP6781021B2 (ja) * 2016-11-29 2020-11-04 モレックス エルエルシー 電子部品
TWI692152B (zh) * 2017-02-07 2020-04-21 美商莫仕有限公司 電連接裝置及板對板電連接組合
ES2757810T3 (es) * 2017-05-24 2020-04-30 Guangdong Oppo Mobile Telecommunications Corp Ltd Soporte para componente electrónico, montaje de componentes electrónicos y terminal móvil
WO2019123647A1 (ja) * 2017-12-22 2019-06-27 堺ディスプレイプロダクト株式会社 表示装置および表示装置の製造方法
KR20210073805A (ko) * 2019-12-11 2021-06-21 삼성전기주식회사 인쇄회로기판, 이를 포함하는 디스플레이 장치, 및 인쇄회로기판의 제조방법
CN110910780A (zh) * 2019-12-23 2020-03-24 深圳市铭濠科技有限公司 一种led智能云屏驱动盒拼接的显示屏

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
FR2515401A1 (fr) * 1981-10-23 1983-04-29 Thomson Csf Dispositif de connexion et d'alignement d'un faisceau de fils en nappe avec les pistes conductrices correspondantes portees par un substrat et systeme d'affichage comprenant un tel dispositif
US4598960A (en) * 1985-04-29 1986-07-08 Copytele, Inc. Methods and apparatus for connecting closely spaced large conductor arrays employing multi-conductor carrier boards
US4695258A (en) * 1986-12-09 1987-09-22 Cherne Industries, Inc. Connector assembly for electrically connecting flexible and rigid printed circuits
US5164853A (en) * 1989-04-06 1992-11-17 Ricoh Company, Ltd. Liquid crystal display panel with plural substrates
JP2846751B2 (ja) * 1991-07-03 1999-01-13 ローム株式会社 回路基板に対するフレキシブルケーブルの接続装置
JP3205373B2 (ja) * 1992-03-12 2001-09-04 株式会社日立製作所 液晶表示装置
DE4236353C2 (de) * 1992-10-28 1995-03-23 Preh Elektro Feinmechanik Elektrische Baugruppe
US5358412A (en) * 1993-04-26 1994-10-25 Eastman Kodak Company Method and apparatus for assembling a flexible circuit to an LCD module
JP3184853B2 (ja) * 1993-06-24 2001-07-09 株式会社日立製作所 液晶表示装置
JP2980496B2 (ja) * 1993-11-10 1999-11-22 シャープ株式会社 フレキシブル配線板の端子構造
US5640216A (en) * 1994-04-13 1997-06-17 Hitachi, Ltd. Liquid crystal display device having video signal driving circuit mounted on one side and housing
JP2891875B2 (ja) * 1994-06-09 1999-05-17 日本電気株式会社 液晶表示装置
JPH08186336A (ja) * 1994-12-28 1996-07-16 Mitsubishi Electric Corp 回路基板、駆動回路モジュール及びそれを用いた液晶表示装置並びにそれらの製造方法
US5936850A (en) * 1995-03-03 1999-08-10 Canon Kabushiki Kaisha Circuit board connection structure and method, and liquid crystal device including the connection structure
JP3127774B2 (ja) * 1995-03-31 2001-01-29 セイコーエプソン株式会社 シールド材および液晶表示装置
CN1097255C (zh) 1995-06-29 2002-12-25 龙野机电技术股份公司 用于给油机显示装置
JPH09218394A (ja) * 1996-02-09 1997-08-19 Asahi Optical Co Ltd 液晶表示板固定具

Also Published As

Publication number Publication date
CN1245325A (zh) 2000-02-23
EP0981183A2 (de) 2000-02-23
US6191838B1 (en) 2001-02-20
US6675470B2 (en) 2004-01-13
US20010000763A1 (en) 2001-05-03
KR100505958B1 (ko) 2005-08-04
JP4298068B2 (ja) 2009-07-15
DE69936493T2 (de) 2008-03-20
JP2000133904A (ja) 2000-05-12
TW454162B (en) 2001-09-11
EP0981183B1 (de) 2007-07-11
EP0981183A3 (de) 2000-07-05
KR20000017323A (ko) 2000-03-25

Similar Documents

Publication Publication Date Title
DE69936493D1 (de) Verbindungsstruktur für Leiterplatte, elektro-optische Vorrichtung, damit versehenes elektronisches Gerät und Herstellungsverfahren für elektro-optische Vorrichtung
DE69942468D1 (de) Leiterplatte und Herstellungsverfahren dafür
DE60029524D1 (de) Flexible Leiterplatte, elektro-optische Vorrichtung und elektronisches Gerät
GB2372153B (en) High frequency circuit board unit, module and electronic apparatus, and method for manufacturing the unit
AU5495998A (en) Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
BR9909580B1 (pt) dispositivo de circuito integrado, processo para produzir um dispositivo eletrÈnico, e, dispositivo eletrÈnico.
DE60027342D1 (de) Flexible gedruckte Leiterplatte, elektrooptische Vorrichtung, und elektronisches Gerät
KR970706714A (ko) 프린트 배선판 및 그 제조방법과 전자기기(printed wiring board, method of producing the same and electronic devices)
DE69936483D1 (de) Laminierte Leiterplatte und Herstellungsverfahren
AU1926900A (en) Printed circuit boards with integrated passive components and method for making same
HK1029662A1 (en) Semiconductor device and method for manufacturing the same circuit substrate and electronic device.
AU6121598A (en) Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
DE69814322D1 (de) Verbinder für eine gedruckte Leiterplatte und Herstellungsverfahren dafür
DE69812570T2 (de) Gerät mit Leiterplatte und dessen Zusammenbauverfahren
HK1018719A1 (en) Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
DE69927725D1 (de) Electronische Postsystem mit Radiogerät und Server
DE60026331T8 (de) Leiterplatte, halbleiter und herstellung, test und gehäuse derselben und systemplatte und elektronikgerät
DE60039960D1 (de) Lcd, elektronische vorrichtung und substrat für lcd
DE60226563D1 (de) Energiequellenschaltung, elektronische Vorrichtung mit derselben Energiequellenschaltung und Steuerverfahren für Energiequellenschaltung
FR2780162B1 (fr) Structure de test de circuit, circuit integre et procede de test
DE69925880D1 (de) Verbindungsverfahren für Leiterplatte
DE69530922D1 (de) Vorrichtung mit elektronischem bauteil
DE69938924D1 (de) Elektronische vorrichtung, platteneinrichtung und tragschiene
DE69830982D1 (de) Schaltungsplatte für stromschienen und herstellungsverfahren
DE69402049D1 (de) Leiterplatte mit elektrischem Adaptorstift und dessen Herstellungsverfahren.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition