DE69935623D1 - Härtbare Harzzusammensetzung - Google Patents

Härtbare Harzzusammensetzung

Info

Publication number
DE69935623D1
DE69935623D1 DE69935623T DE69935623T DE69935623D1 DE 69935623 D1 DE69935623 D1 DE 69935623D1 DE 69935623 T DE69935623 T DE 69935623T DE 69935623 T DE69935623 T DE 69935623T DE 69935623 D1 DE69935623 D1 DE 69935623D1
Authority
DE
Germany
Prior art keywords
resin composition
curable resin
curable
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69935623T
Other languages
English (en)
Other versions
DE69935623T2 (de
Inventor
Junji Ohashi
Tetsuo Hinoma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25114198A external-priority patent/JP3918316B2/ja
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Application granted granted Critical
Publication of DE69935623D1 publication Critical patent/DE69935623D1/de
Publication of DE69935623T2 publication Critical patent/DE69935623T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69935623T 1998-04-17 1999-04-16 Härtbare Harzzusammensetzung Expired - Lifetime DE69935623T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10827498 1998-04-17
JP10827498 1998-04-17
JP25114198 1998-09-04
JP25114198A JP3918316B2 (ja) 1998-09-04 1998-09-04 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
DE69935623D1 true DE69935623D1 (de) 2007-05-03
DE69935623T2 DE69935623T2 (de) 2007-12-06

Family

ID=26448204

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69935623T Expired - Lifetime DE69935623T2 (de) 1998-04-17 1999-04-16 Härtbare Harzzusammensetzung
DE69927734T Expired - Lifetime DE69927734T2 (de) 1998-04-17 1999-04-16 Härtbare Harzzusammensetzung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69927734T Expired - Lifetime DE69927734T2 (de) 1998-04-17 1999-04-16 Härtbare Harzzusammensetzung

Country Status (6)

Country Link
US (1) US6482899B2 (de)
EP (2) EP1593701B1 (de)
CA (1) CA2269378C (de)
DE (2) DE69935623T2 (de)
SG (1) SG83123A1 (de)
TW (1) TW409139B (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4463345B2 (ja) * 1999-06-18 2010-05-19 関西ペイント株式会社 塗料組成物
JP3757771B2 (ja) * 2000-09-07 2006-03-22 株式会社村田製作所 導電性ペーストおよびそれを用いる積層セラミック電子部品の製造方法
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
JP4752131B2 (ja) 2001-05-16 2011-08-17 味の素株式会社 エポキシ樹脂用潜在性硬化剤及び硬化性エポキシ樹脂組成物
US6565772B2 (en) * 2001-09-25 2003-05-20 Midwest Thermal Spray Conductive resin composition
EP2546275B1 (de) 2002-09-05 2023-09-20 Daicel Corporation Härtbare Epoxidharzzusammensetzungen, Epoxidharzzusammensetzungen zur Verkapselung elektronischer Teile, Stabilisatoren für elektrisch isolierende Öle, und Gieß-Epoxidharzzusammensetzungen für elektrische Isolierung
KR20060021893A (ko) * 2003-06-13 2006-03-08 다우 글로벌 테크놀로지스 인크. 융합성 촉매 및 이로부터 제조한 폴리우레탄 생성물
JP4151573B2 (ja) * 2003-12-16 2008-09-17 東洋紡績株式会社 硬化型組成物
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
WO2008085144A1 (en) * 2006-03-06 2008-07-17 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US8288447B2 (en) 2006-06-07 2012-10-16 Henkel Ag & Co. Kgaa Foamable compositions based on epoxy resins and polyesters
US8431655B2 (en) 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
US7868113B2 (en) * 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
WO2008130894A1 (en) 2007-04-16 2008-10-30 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
KR101582881B1 (ko) * 2008-04-14 2016-01-15 블루 큐브 아이피 엘엘씨 분말 피복 분야에 유용한 에폭시-이미다졸 촉매
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
TWI491601B (zh) 2008-09-25 2015-07-11 Sekisui Chemical Co Ltd A sulfide compound, a mixture containing a cyclic sulfide, a process for producing a mixture containing a cyclic sulfide, a hardened composition and a connecting structure
US8288591B2 (en) 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
JP5762140B2 (ja) * 2010-07-23 2015-08-12 ダンロップスポーツ株式会社 ゴルフボール
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US8796361B2 (en) * 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
JP5900602B2 (ja) * 2012-02-24 2016-04-06 日立化成株式会社 半導体用接着剤、フラックス剤、半導体装置の製造方法及び半導体装置
EP2700683B1 (de) 2012-08-23 2016-06-08 3M Innovative Properties Company Haftstrukturfolie
JP6534189B2 (ja) 2014-03-17 2019-06-26 ナミックス株式会社 樹脂組成物
JP6782224B2 (ja) 2015-03-12 2020-11-11 ナミックス株式会社 半導体装置、およびイメージセンサーモジュール
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
KR102312045B1 (ko) * 2016-08-10 2021-10-12 가부시끼가이샤 쓰리본드 에폭시 수지 조성물 및 이를 포함하는 도전성 접착제
WO2018111637A1 (en) * 2016-12-13 2018-06-21 3M Innovative Properties Company Epoxy stabilization using acid-coated nitrogen-containing catalysts, particles, and methods
US20220259423A1 (en) * 2019-07-19 2022-08-18 Blue Cube Ip Llc Phenolic hardener for epoxy powder coatings

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE620967A (de) * 1961-08-02
US3963666A (en) * 1971-06-15 1976-06-15 Ciba-Geigy Corporation Storage-stable, quick-curing epoxide resin moulding materials
US3862260A (en) * 1973-05-07 1975-01-21 Union Carbide Corp Epoxy curing system
US4111909A (en) * 1977-04-11 1978-09-05 Celanese Polymer Specialties Company Controlled reactivity epoxy resin compositions
US4348505A (en) * 1980-07-23 1982-09-07 Ciba-Geigy Corporation Adducts from amines and di- and polyepoxides
DE3382819T2 (de) 1982-09-21 1998-08-27 Ajinomoto Kk Latente Härter für Epoxyharze
JPS6072917A (ja) 1983-09-30 1985-04-25 Ajinomoto Co Inc エポキシ樹脂用潜在性硬化剤
US4534882A (en) * 1984-09-04 1985-08-13 Hughes Aircraft Company Method of making an epoxy prepolymer curing agent
US4689388A (en) 1985-01-24 1987-08-25 Ajinomoto Co., Inc. One pack type alicyclic epoxy resin compositions
JPS6375044A (ja) * 1986-09-17 1988-04-05 Toto Ltd 連続気孔多孔体の製造方法
DE3750166T2 (de) 1987-08-26 1995-02-23 Asahi Chemical Ind Härtemittel für ein härtbares Eintopfepoxidharzsystem.
US5219956A (en) * 1989-02-13 1993-06-15 Asahi Kasei Kogyo Kabushiki Kaisha Method for hardening a one-package epoxy formulation including partial curing
JPH02227470A (ja) * 1989-02-28 1990-09-10 Somar Corp エポキシ樹脂紛体塗料組成物
US5155182A (en) * 1989-09-14 1992-10-13 Schering Ag Imidazolyl derivatives, their use as curing agents in epoxy-resin compositions, and curable epoxy-resin compositions and molded epoxy-resin articles incorporating said imidazolyl derivatives
US5057557A (en) * 1990-05-11 1991-10-15 The Dow Chemical Company Modified epoxy resin compositions
US5567748A (en) * 1991-12-17 1996-10-22 The Dow Chemical Company Water compatible amine terminated resin useful for curing epoxy resins
DE69318369T2 (de) 1992-10-22 1999-01-28 Ajinomoto Kk Polythiol-Epoxidharz-Mischung mit längerer Verarbeitungszeit
US5591814A (en) * 1993-02-18 1997-01-07 W. R. Grace & Co.-Conn. Curing agent masterbatch for epoxy resin and their preparation
EP0622488B1 (de) 1993-04-28 1997-07-02 Akzo Nobel N.V. Wasserdichte, atmungsfähige Regenkleidung und wasserdichte Gegenstände aus Schaumkunststoff
JP3391074B2 (ja) * 1994-01-07 2003-03-31 味の素株式会社 エポキシ樹脂組成物
US5717011A (en) 1995-12-14 1998-02-10 Minnesota Mining And Manufacturing Company Curing agent compositions and a method of making

Also Published As

Publication number Publication date
US6482899B2 (en) 2002-11-19
DE69935623T2 (de) 2007-12-06
US20020010287A1 (en) 2002-01-24
SG83123A1 (en) 2001-09-18
EP0950677B1 (de) 2005-10-19
TW409139B (en) 2000-10-21
CA2269378C (en) 2008-04-01
EP0950677A2 (de) 1999-10-20
CA2269378A1 (en) 1999-10-17
DE69927734D1 (de) 2006-03-02
EP1593701B1 (de) 2007-03-21
DE69927734T2 (de) 2006-07-20
EP0950677A3 (de) 2002-06-26
EP1593701A1 (de) 2005-11-09

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: OHASHI, JUNJI, KAWASAKI, KANAGAWA, JP

Inventor name: HINOMA, TETSUO, KAWASAKI, KANAGAWA, JP

8364 No opposition during term of opposition