JP4151573B2 - 硬化型組成物 - Google Patents
硬化型組成物 Download PDFInfo
- Publication number
- JP4151573B2 JP4151573B2 JP2003418789A JP2003418789A JP4151573B2 JP 4151573 B2 JP4151573 B2 JP 4151573B2 JP 2003418789 A JP2003418789 A JP 2003418789A JP 2003418789 A JP2003418789 A JP 2003418789A JP 4151573 B2 JP4151573 B2 JP 4151573B2
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- JP
- Japan
- Prior art keywords
- curable composition
- compound
- bis
- epoxy
- aminophenoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims abstract description 56
- 150000001875 compounds Chemical class 0.000 claims abstract description 64
- -1 aromatic amine compound Chemical class 0.000 claims abstract description 50
- 239000002245 particle Substances 0.000 claims abstract description 36
- 239000007787 solid Substances 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 9
- 125000003277 amino group Chemical group 0.000 claims abstract description 8
- 238000009835 boiling Methods 0.000 claims description 9
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 abstract description 58
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical group C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 abstract description 2
- 238000004321 preservation Methods 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 52
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 27
- 239000003795 chemical substances by application Substances 0.000 description 27
- 239000012071 phase Substances 0.000 description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 150000001412 amines Chemical class 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 14
- 238000002156 mixing Methods 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- 239000002904 solvent Substances 0.000 description 13
- 238000003860 storage Methods 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 12
- 238000003756 stirring Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 239000002775 capsule Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 3
- UMGYJGHIMRFYSP-UHFFFAOYSA-N 2-(4-aminophenyl)-1,3-benzoxazol-5-amine Chemical compound C1=CC(N)=CC=C1C1=NC2=CC(N)=CC=C2O1 UMGYJGHIMRFYSP-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 229940018564 m-phenylenediamine Drugs 0.000 description 3
- 239000003094 microcapsule Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 150000003462 sulfoxides Chemical class 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 238000000944 Soxhlet extraction Methods 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- SONDVQSYBUQGDH-UHFFFAOYSA-N bis(3-amino-4-phenoxyphenyl)methanone Chemical compound NC1=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=CC=C1OC1=CC=CC=C1 SONDVQSYBUQGDH-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- KYLUAQBYONVMCP-UHFFFAOYSA-N (2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P KYLUAQBYONVMCP-UHFFFAOYSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- STIUJDCDGZSXGO-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=C1 STIUJDCDGZSXGO-UHFFFAOYSA-N 0.000 description 1
- GSHMRKDZYYLPNZ-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)C=C1OC1=CC=CC=C1 GSHMRKDZYYLPNZ-UHFFFAOYSA-N 0.000 description 1
- PHPTWVBSQRENOR-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C(C=C1N)=CC=C1OC1=CC=CC=C1 PHPTWVBSQRENOR-UHFFFAOYSA-N 0.000 description 1
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
- HFAMSBMTCKNPRG-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)=C1 HFAMSBMTCKNPRG-UHFFFAOYSA-N 0.000 description 1
- NILYJZJYFZUPPO-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C(OC=2C=CC=CC=2)=C1 NILYJZJYFZUPPO-UHFFFAOYSA-N 0.000 description 1
- XGCDBGRZEKYHNV-UHFFFAOYSA-N 1,1-bis(diphenylphosphino)methane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 XGCDBGRZEKYHNV-UHFFFAOYSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
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- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- MLPBASQNOQYIGL-UHFFFAOYSA-N 2-(2-propan-2-yl-1h-imidazol-5-yl)propanenitrile Chemical compound CC(C)C1=NC=C(C(C)C#N)N1 MLPBASQNOQYIGL-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
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- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
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- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
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- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
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- UQHPRIRSWZEGEK-UHFFFAOYSA-N 3-[4-[1-[4-(3-aminophenoxy)phenyl]ethyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 UQHPRIRSWZEGEK-UHFFFAOYSA-N 0.000 description 1
- PHVQYQDTIMAIKY-UHFFFAOYSA-N 3-[4-[1-[4-(3-aminophenoxy)phenyl]propyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(CC)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 PHVQYQDTIMAIKY-UHFFFAOYSA-N 0.000 description 1
- MFTFTIALAXXIMU-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MFTFTIALAXXIMU-UHFFFAOYSA-N 0.000 description 1
- BDROEGDWWLIVJF-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]ethyl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(CCC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 BDROEGDWWLIVJF-UHFFFAOYSA-N 0.000 description 1
- NYRFBMFAUFUULG-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 NYRFBMFAUFUULG-UHFFFAOYSA-N 0.000 description 1
- TZFAMRKTHYOODK-UHFFFAOYSA-N 3-[4-[3-[4-(3-aminophenoxy)phenyl]propyl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(CCCC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 TZFAMRKTHYOODK-UHFFFAOYSA-N 0.000 description 1
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- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- QLAGHGSFXJZWKY-UHFFFAOYSA-N triphenylborane;triphenylphosphane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QLAGHGSFXJZWKY-UHFFFAOYSA-N 0.000 description 1
- CMLWFCUAXGSMBB-UHFFFAOYSA-N tris(2,6-dimethoxyphenyl)phosphane Chemical compound COC1=CC=CC(OC)=C1P(C=1C(=CC=CC=1OC)OC)C1=C(OC)C=CC=C1OC CMLWFCUAXGSMBB-UHFFFAOYSA-N 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Description
(1)常温において連続相と分散質を形成する硬化型組成物において、
連続相が、常温で液状であり、かつ(a)分子内に2個以上のエポキシ基を有する化合物を含み、
分散質が、(b)常温で連続相に固体粒子として存在し、かつ分子内に2個以上のアミノ基を有する化合物を含むことを特徴とする硬化型組成物。
(2)前記分子内に2個以上のアミノ基を有する化合物が、ベンゾオキサゾール構造を有する芳香族アミン化合物であることを特徴とする、上記(1)記載の硬化型組成物。
(3)前記分子内に2個以上のエポキシ基を有する化合物が常温で液状であることを特徴とする、上記(1)または(2)記載の硬化型組成物。
(4)前記連続相が、沸点が200℃以下の有機溶剤を含むことを特徴とする上記(1)〜(3)のいずれかに記載の硬化型組成物。
(5)前記固体粒子の体積平均粒子径が、0.05〜50μmであることを特徴とする上記(1)〜(4)のいずれかに記載の硬化型組成物。
本発明では分子内に2個以上のエポキシ基を有するエポキシ化合物(a)を用いることが必須であるが、これらの他に、必要に応じて単官能のエポキシ化合物を併用しても良い。
具体的には、本発明の硬化型組成物をトルエンにて、100倍(v/v)に希釈し、レーザー散乱式粒度分布計(例えば、堀場製作所製、LB−500など)を用いて粒度分布を測定し、媒体の屈折率(nm)を用いたトルエンの屈折率(1.496)とし、分散質の屈折率(np)を1.55として、算出されるものである。
硬化型組成物をトルエンにて100倍に希釈し、石英セルに入れ、堀場製作所製レーザー散乱式粒度分布計LB−500により測定した。なお媒体の物性値、屈折率はトルエンの数値を用い、分散質の屈折率は1.55として、算出した。
硬化型組成物を50℃、1000時間放置後のゲル分率を測定し、保存安定性を評価した。判断基準は以下のとおりである。
○: ゲル分率≦5%、
△: 5%<ゲル分率≦10%、
×:10%<ゲル分率、
ゲル分率はN−メチルピロリドンを溶媒とし、硬化物から可溶物を24時間、ソクスレー抽出し、次式に従い求めた。
ゲル分率(%)=(抽出と乾燥を行った試料の重量)/(抽出前の試料の重量)×100
硬化型組成物を150℃、1時間放置後のゲル分率を測定し、硬化性を決定した。判定基準は以下の通りである。
○:90%≦ゲル分率、
△:80%≦ゲル分率<90%、
×: ゲル分率<80%、
ゲル分率はN−メチルピロリドンを溶媒とし、硬化物から可溶物を24時間、ソクスレー抽出し、次式に従い求めた。
ゲル分率(%)=(抽出と乾燥を行った試料の重量)/(抽出前の試料の重量)×100
JIS−K5400に従って測定した。
硬化型組成物をポリイミドフィルムカプトン100H(ポリイミドフィルム、東レデュポン(株)製)にラミネートし、150℃で2時間加熱硬化後の90度剥離強度を測定した。
硬化型組成物を100℃の沸水中に浸漬させ2時間放置後取出し、硬化物の外観を観察した。処理後外観に変化の無いものは○、クラック又は白化が観測されたものは×として耐水性を評価した。
100mlフラスコにエピコート828(エポキシ当量190g/eq.、ビスフェノールA型エポキシ化合物、ジャパンエポキシレジン製)19.0重量部と5−アミノ−2−(p−アミノフェニル)ベンズオキサゾール(式(I)の化合物、アミン当量113g/eq.)11.3重量部を加え、室温で5分間攪拌し、さらに3本ロールミルにて分散し、硬化型組成物を調製し、各評価試験に供した。この硬化型組成物を150℃、2時間加熱し硬化物を得た。
エピコート828(エポキシ当量190g/eq.、ビスフェノールA型エポキシ化合物、ジャパンエポキシレジン製)19.0重量部と、2,2’−p− フェニレンビス(5−アミノベンズオキサゾール)ベンズオキサゾール(式(V)の化合物、アミン当量171重量部/eq.)17.1重量部を用い、以下、実施例1と同様の手順で硬化型組成物を得、同様に評価した。
エピコート828(エポキシ当量190g/eq.)19.0重量部と2,6−(4,4’−ジアミノジフェニル)ベンゾ[1,2−d:4,5−d’]ビスオキサゾール(式(IX)の化合物、アミン当量171g/eq.)17.1重量部を用い、以下、実施例1と同様の手順で硬化型組成物を得、同様に評価した。
EOCN−102S(エポキシ当量210g/eq.、クレゾールノボラック型エポキシ化合物、日本化薬(株)製)21.0重量部、5−アミノ−2−(p−アミノフェニル)ベンズオキサゾール(式(I)の化合物、アミン当量113g/eq.)11.3重量部を用い、以下、実施例1と同様の手順で硬化型組成物を得、同様に評価した。
エピコート1001(0.050mol、エポキシ当量475g/eq、ビスフェノールA型エポキシ化合物、ジャパンエポキシレジン製)47.5重量部をメチルエチルケトン100重量部に溶解させ、5−アミノ−2−(p−アミノフェニル)ベンズオキサゾール(式(I)の化合物、アミン当量113g/eq.)11.3重量部を加え、室温で5分間攪拌し、次いで、直径10mmのアルミナボールを用いたボールミルにて3時間分散させ、硬化型組成物を調製し、各評価試験に供した。この硬化型組成物を所定の基材に塗布し、80℃30分熱風乾燥した後、150℃、2時間加熱して硬化物を得た。
エピコート1004(エポキシ当量925g/eq.、ビスフェノールA型エポキシ化合物、ジャパンエポキシレジン製)92.5重量部、5−アミノ−2−(p−アミノフェニル)ベンズオキサゾール(式(I)の化合物、アミン当量113g/eq.)11.3重量部、メチルエチルケトン200重量部を用い、以下、実施例5と同様の手順で硬化型組成物を調製し、同様に評価した。
エピコート828(エポキシ当量190g/eq.)19.0重量部とo−フェニレンジアミン(アミン当量54g/eq)5.4重量部を用い、以下、実施例1と同様の手順で硬化型組成物を調製し、同様に評価した。o−フェニレンジアミンは、室温で5分間攪拌することによりエピコート828に相溶した。念のために体積平均粒子径を測定したが、測定範囲である0.05μmより小さいという結果となり、実質的に固体粒子として存在していないことが裏付けられた。なお硬化型組成物を調製直後より粘度上昇が顕著であり、一晩放置した後には容器から取り出すことが出来ない状態であった。
エピコート828(エポキシ当量190g/eq)19.0重量部とm−フェニレンジアミン(アミン当量54g/eq)5.4重量部を用い、以下、実施例1と同様の手順で硬化型組成物を調製し、同様に評価した。m−フェニレンジアミンは、室温で5分間攪拌することによりエピコート828に相溶した。念のために体積平均粒子径を測定したが、測定範囲である0.05μmより小さいという結果となり、実質的に固体粒子として存在していないことが裏付けられた。なお比較例1と同様、硬化型組成物を調製直後より粘度上昇が顕著であり、一晩放置した後には容器から取り出すことが出来ない状態であった。
エピコート828(エポキシ当量190g/eq)19.0重量部とp−フェニレンジアミン(アミン当量54g/eq)5.4重量部を用い、以下、実施例1と同様の手順で硬化型組成物を調製し、同様に評価した。p−フェニレンジアミンは、室温で5分間攪拌することによりエピコート828に相溶した。念のために体積平均粒子径を測定したが、測定範囲である0.05μmより小さいという結果となり、実質的に固体粒子として存在していないことが裏付けられた。なお比較例1と同様、硬化型組成物を調製直後より粘度上昇が顕著であり、一晩放置した後には容器から取り出すことが出来ない状態であった。
エピコート828(エポキシ当量190g/eq)19.0重量部とエチレンジアミン(アミン当量30g/eq)3.0重量部を用い、以下、実施例1と同様の手順で硬化型組成物を調製し、同様に評価した。エチレンジアミンは、室温で5分間攪拌することによりエピコート828に相溶した。混合直後より発熱を伴う硬化反応が生じ、可使時間は数分間のレベルであった。
エピコート828(エポキシ当量190g/eq)19.0重量部とジアミノジフェニルエーテル(アミン当量166g/eq)16.6重量部を用い、以下、実施例1と同様の手順で硬化型組成物を調製し、同様に評価した。ジアミノジフェニルエーテルは、室温で5分間攪拌することによりエピコート828に相溶した。念のために体積平均粒子径を測定したが、測定範囲である0.05μmより小さいという結果となり、実質的に固体粒子として存在していないことが裏付けられた。混合直後より発熱を伴う硬化反応が生じ、可使時間は数分間のレベルであった。
シリカゾル(スノーテックスO、日産化学(株)製、粒子径10〜20nm、濃度20%)2000重量部に、DBU:1,8−ジアザ−ビシクロ−(5,4,0)−ウンデセン−7、80重量部を溶解し、ポリオキシエチレンソルビタンモノオレート8重量部、ソルビタントリオレート80重量部を溶解したクロロホルム6000重量部にホモジナイザーを用いて分散し(8000rpm.、30秒)、W/O型分散体を調製する。これを撹拌器のついた丸底フラスコに取り、撹拌しながら20重量%の塩化カルシウム水溶液1000重量部を約5分かけて室温で滴下する。そのまま15〜30分室温で撹拌を続ける。得られたカプセル粒子のスラリーにメタノールを1000〜2000重量部加えて、吸引濾過でカプセル粒子を濾別し乾燥、DBUを内包した、平均粒子径4.5μmのマイクロカプセル型硬化促進剤を得た。
4,4’−グリシジル−3,5,3’,5’−テトラメチル−ビフェニル(エポキシ当量165g/eq.)165重量部、エチレンジアミン(アミン当量30g/eq)30重量部、メチルエチルケトン100重量部を用い、以下、実施例5と同様の手順で硬化型組成物を調製し、同様に評価した。
実施例の評価結果を表1、比較例の評価結果を表2に示す。
Claims (4)
- 常温において連続相と分散質を形成する硬化型組成物において、
連続相が、常温で液状であり、かつ(a)分子内に2個以上のエポキシ基を有する化合物を含み、
分散質が、(b)常温で連続相に固体粒子として存在し、かつ分子内に2個以上のアミノ基を有する化合物を含む硬化型組成物であって、
前記分子内に2個以上のアミノ基を有する化合物が、ベンゾオキサゾール構造を有する芳香族アミン化合物であることを特徴とする硬化型組成物。 - 前記分子内に2個以上のエポキシ基を有する化合物が常温で液状であることを特徴とする、請求項1記載の硬化型組成物。
- 前記連続相が、沸点が200℃以下の有機溶剤を含むことを特徴とする請求項1または2に記載の硬化型組成物。
- 前記固体粒子の体積平均粒子径が、0.05〜50μmであることを特徴とする請求項1〜3のいずれかに記載の硬化型組成物。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003418789A JP4151573B2 (ja) | 2003-12-16 | 2003-12-16 | 硬化型組成物 |
| PCT/JP2004/018975 WO2005059001A1 (ja) | 2003-12-16 | 2004-12-14 | 硬化型組成物 |
| AT04807332T ATE510870T1 (de) | 2003-12-16 | 2004-12-14 | Härtbare zusammensetzung |
| EP04807332A EP1700874B1 (en) | 2003-12-16 | 2004-12-14 | Curable composition |
| KR1020067014295A KR100774059B1 (ko) | 2003-12-16 | 2004-12-14 | 경화형 조성물 |
| US10/583,147 US20070293588A1 (en) | 2003-12-16 | 2004-12-14 | Curable Composition |
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| JP2003418789A JP4151573B2 (ja) | 2003-12-16 | 2003-12-16 | 硬化型組成物 |
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| JP2005179404A JP2005179404A (ja) | 2005-07-07 |
| JP4151573B2 true JP4151573B2 (ja) | 2008-09-17 |
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| US (1) | US20070293588A1 (ja) |
| EP (1) | EP1700874B1 (ja) |
| JP (1) | JP4151573B2 (ja) |
| KR (1) | KR100774059B1 (ja) |
| AT (1) | ATE510870T1 (ja) |
| WO (1) | WO2005059001A1 (ja) |
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| JP4779112B2 (ja) * | 2005-02-01 | 2011-09-28 | 国立大学法人 千葉大学 | エポキシ樹脂組成物及びエポキシ樹脂硬化物 |
| JP4986485B2 (ja) | 2006-03-28 | 2012-07-25 | 株式会社Adeka | エポキシ樹脂硬化性組成物 |
| US9068040B2 (en) | 2010-10-12 | 2015-06-30 | Hexcel Corporation | Solvent resistant thermoplastic toughened epoxy |
| JP6725787B2 (ja) * | 2016-05-20 | 2020-07-22 | 学校法人東邦大学 | 芳香族ジアミンおよびこれを用いた液晶性エポキシ樹脂熱硬化物 |
| AU2016420190B2 (en) * | 2016-08-17 | 2020-02-13 | Dow Global Technologies Llc | Benzophenone derivative, aqueous copolymer dispersion and aqueous coating composition |
| CN112384546B (zh) * | 2018-10-17 | 2024-01-16 | 东洋纺株式会社 | 导热性树脂组合物 |
| EP3950763B1 (en) * | 2019-03-27 | 2025-10-22 | NHK Spring Co., Ltd. | Thermosetting epoxy resin composition, layered sheet for circuit board, metal-based circuit board, and power module |
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| TW353674B (en) * | 1996-12-31 | 1999-03-01 | Shell Int Research | Prereacted surfactant composition and water borne curing agent composition for self-curing epoxy resins at ambient or sub-ambient temperatures, comprising said surfactant composition |
| EP1082391B1 (en) * | 1998-03-24 | 2002-06-12 | Resolution Research Nederland B.V. | Thermosetting resinous binder compositions, their preparation and use as coating materials |
| CA2269378C (en) * | 1998-04-17 | 2008-04-01 | Ajinomoto Co., Inc. | Curable resin composition |
| JP4207101B2 (ja) * | 1999-05-25 | 2009-01-14 | 日立化成工業株式会社 | 半導体封止用樹脂組成物及び樹脂封止型半導体装置 |
| JP3585819B2 (ja) * | 2000-06-05 | 2004-11-04 | 住友電工スチールワイヤー株式会社 | プレストレストコンクリート緊張材用硬化性組成物及び緊張材 |
| EP1217049A1 (de) * | 2000-12-23 | 2002-06-26 | Sika AG, vorm. Kaspar Winkler & Co. | Voranstrich für Beton |
| JP3723483B2 (ja) * | 2001-10-16 | 2005-12-07 | 日本電気株式会社 | 電子部品装置 |
| JP2003213086A (ja) * | 2002-01-28 | 2003-07-30 | Sumitomo Bakelite Co Ltd | 半導体用樹脂ペースト及び半導体装置 |
| JP4036011B2 (ja) * | 2002-02-26 | 2008-01-23 | 日立化成工業株式会社 | 難燃性熱硬化樹脂組成物,それを用いたプリプレグ及び電気配線板用積層板 |
| TWI313684B (en) * | 2002-10-03 | 2009-08-21 | Chang Chun Plastics Co Ltd | Nitrogen-oxygen heterocyclic compound |
| US7060357B2 (en) * | 2002-10-04 | 2006-06-13 | Basf Corporation | Powder coatings containing symmetrical additives |
| TW576854B (en) * | 2002-10-25 | 2004-02-21 | Chang Chun Plastics Co Ltd | Halogen-free resin composition |
| JP4986485B2 (ja) * | 2006-03-28 | 2012-07-25 | 株式会社Adeka | エポキシ樹脂硬化性組成物 |
-
2003
- 2003-12-16 JP JP2003418789A patent/JP4151573B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-14 AT AT04807332T patent/ATE510870T1/de not_active IP Right Cessation
- 2004-12-14 US US10/583,147 patent/US20070293588A1/en not_active Abandoned
- 2004-12-14 EP EP04807332A patent/EP1700874B1/en not_active Expired - Lifetime
- 2004-12-14 WO PCT/JP2004/018975 patent/WO2005059001A1/ja not_active Ceased
- 2004-12-14 KR KR1020067014295A patent/KR100774059B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060134025A (ko) | 2006-12-27 |
| JP2005179404A (ja) | 2005-07-07 |
| US20070293588A1 (en) | 2007-12-20 |
| EP1700874A4 (en) | 2007-10-24 |
| WO2005059001A1 (ja) | 2005-06-30 |
| EP1700874A1 (en) | 2006-09-13 |
| ATE510870T1 (de) | 2011-06-15 |
| KR100774059B1 (ko) | 2007-11-06 |
| EP1700874B1 (en) | 2011-05-25 |
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