DE69918261D1 - Bleifreies lot - Google Patents

Bleifreies lot

Info

Publication number
DE69918261D1
DE69918261D1 DE69918261T DE69918261T DE69918261D1 DE 69918261 D1 DE69918261 D1 DE 69918261D1 DE 69918261 T DE69918261 T DE 69918261T DE 69918261 T DE69918261 T DE 69918261T DE 69918261 D1 DE69918261 D1 DE 69918261D1
Authority
DE
Germany
Prior art keywords
lead
solder
free
amount
mother alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918261T
Other languages
English (en)
Other versions
DE69918261T2 (de
Inventor
Tetsuro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Superior Sha Co Ltd
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Publication of DE69918261D1 publication Critical patent/DE69918261D1/de
Application granted granted Critical
Publication of DE69918261T2 publication Critical patent/DE69918261T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Glass Compositions (AREA)
DE1999618261 1998-10-28 1999-09-28 Bleifreie Lötlegierung Expired - Lifetime DE69918261T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP32448298 1998-10-28
JP32448298 1998-10-28
JP32448398 1998-10-28
JP32448398 1998-10-28
JP6974299 1999-03-16
JP11069742A JP2000197988A (ja) 1998-03-26 1999-03-16 無鉛はんだ合金
PCT/JP1999/005275 WO2000024544A1 (en) 1998-10-28 1999-09-28 Lead-free solder

Publications (2)

Publication Number Publication Date
DE69918261D1 true DE69918261D1 (de) 2004-07-29
DE69918261T2 DE69918261T2 (de) 2004-11-18

Family

ID=27300127

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1999618261 Expired - Lifetime DE69918261T2 (de) 1998-10-28 1999-09-28 Bleifreie Lötlegierung

Country Status (6)

Country Link
US (1) US6296722B1 (de)
EP (1) EP1043112B1 (de)
JP (1) JP2000197988A (de)
AT (1) ATE269776T1 (de)
DE (1) DE69918261T2 (de)
WO (1) WO2000024544A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4039653B2 (ja) * 1999-11-01 2008-01-30 千住金属工業株式会社 リードメッキ用Ｓｎ合金
US7005106B2 (en) * 2001-08-30 2006-02-28 Sumida Corporation Lead-free solder alloy and electronic components using it
US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
US6570260B1 (en) * 2002-02-15 2003-05-27 Delphi Technologies, Inc. Solder process and solder alloy therefor
US6933505B2 (en) * 2002-03-13 2005-08-23 Oy Ajat Ltd Low temperature, bump-bonded radiation imaging device
KR100395438B1 (en) * 2002-05-01 2003-08-21 Ecojoin Co Ltd Lead-free solder alloy composite
KR20040035458A (ko) * 2002-10-22 2004-04-29 희성금속 주식회사 납땜용 무연합금
US7193326B2 (en) * 2003-06-23 2007-03-20 Denso Corporation Mold type semiconductor device
JP4492231B2 (ja) * 2004-07-06 2010-06-30 セイコーエプソン株式会社 鉛フリーはんだ合金
US20060068218A1 (en) * 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
FR2888253B1 (fr) * 2005-07-07 2007-11-23 Ind Des Poudres Spheriques Sa Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.
TWI465312B (zh) * 2005-07-19 2014-12-21 日本斯倍利亞股份有限公司 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
CN1803380A (zh) * 2006-01-11 2006-07-19 黄守友 一种无铅焊料及其制备方法
JP4890221B2 (ja) * 2006-12-06 2012-03-07 株式会社日本スペリア社 ダイボンド材
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
JP5058766B2 (ja) * 2007-12-07 2012-10-24 山陽特殊製鋼株式会社 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器
JP5169354B2 (ja) * 2008-03-18 2013-03-27 富士通株式会社 接合材料及びそれを用いた接合方法
US8367244B2 (en) * 2008-04-17 2013-02-05 Enovix Corporation Anode material having a uniform metal-semiconductor alloy layer
EP2277657B1 (de) * 2008-04-23 2012-07-11 Senju Metal Industry Co., Ltd Bleifreies weichlot
JP2009071315A (ja) * 2008-10-20 2009-04-02 Sumida Corporation コイル部品
CN101412159A (zh) * 2008-11-24 2009-04-22 天津市宏远电子有限公司 热浸镀锡铜线用无铅焊料合金
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
JP2011041970A (ja) * 2009-08-24 2011-03-03 Nihon Superior Co Ltd 鉛フリーはんだ接合材料
CN101862921B (zh) * 2010-06-25 2012-02-15 南京航空航天大学 含Pr、Sr和Ga的Sn-Cu-Ni无铅钎料
JP5973992B2 (ja) * 2011-04-08 2016-08-23 株式会社日本スペリア社 はんだ合金
JP6292407B2 (ja) * 2011-06-17 2018-03-14 エルジー・ケム・リミテッド ソルダリングコネクター、これを含むバッテリーモジュール、及びバッテリーパック
WO2014084242A1 (ja) * 2012-11-30 2014-06-05 株式会社日本スペリア社 低融点ろう材
WO2014142153A1 (ja) * 2013-03-13 2014-09-18 株式会社日本スペリア社 はんだ接合物及びはんだ接合方法
JP2017509489A (ja) 2014-02-20 2017-04-06 ハネウェル・インターナショナル・インコーポレーテッド 鉛フリーはんだ組成物
AT517762A1 (de) * 2015-10-14 2017-04-15 Voestalpine Prec Strip Gmbh Schneidwerkzeug zum Trennen von Flachmaterialien
TW202403062A (zh) * 2018-12-27 2024-01-16 美商阿爾發金屬化工公司 無鉛焊料組成物
JP6649595B1 (ja) 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
CN114222638B (zh) * 2019-08-05 2024-03-12 日本斯倍利亚社股份有限公司 焊料－金属网格复合材料及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816219A (en) * 1986-07-18 1989-03-28 Nihon Speriasha Co., Ltd. Low-temperature solder composition
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
JP2667692B2 (ja) * 1988-12-29 1997-10-27 株式会社徳力本店 低融点Ａｇはんだ
JP3186178B2 (ja) * 1992-03-06 2001-07-11 田中電子工業株式会社 半導体素子用のはんだバンプ形成材料
US5837191A (en) 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3152945B2 (ja) * 1998-03-26 2001-04-03 株式会社日本スペリア社 無鉛はんだ合金

Also Published As

Publication number Publication date
WO2000024544A1 (en) 2000-05-04
EP1043112A4 (de) 2003-01-02
EP1043112B1 (de) 2004-06-23
JP2000197988A (ja) 2000-07-18
US6296722B1 (en) 2001-10-02
EP1043112A1 (de) 2000-10-11
DE69918261T2 (de) 2004-11-18
HK1031844A1 (en) 2001-06-29
ATE269776T1 (de) 2004-07-15

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Legal Events

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8364 No opposition during term of opposition