KR100395438B1 - Lead-free solder alloy composite - Google Patents

Lead-free solder alloy composite Download PDF

Info

Publication number
KR100395438B1
KR100395438B1 KR1020020023962A KR20020023962A KR100395438B1 KR 100395438 B1 KR100395438 B1 KR 100395438B1 KR 1020020023962 A KR1020020023962 A KR 1020020023962A KR 20020023962 A KR20020023962 A KR 20020023962A KR 100395438 B1 KR100395438 B1 KR 100395438B1
Authority
KR
South Korea
Prior art keywords
lead
free solder
solder alloy
tin
copper
Prior art date
Application number
KR1020020023962A
Other languages
Korean (ko)
Inventor
Tae Yeob La
Ju Hyun Sun
Myung Wwan Ko
Original Assignee
Ecojoin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ecojoin Co Ltd filed Critical Ecojoin Co Ltd
Priority to KR1020020023962A priority Critical patent/KR100395438B1/en
Application granted granted Critical
Publication of KR100395438B1 publication Critical patent/KR100395438B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: A lead-free solder alloy composite is provided to increase strength and hardness by minimizing oxide in soldering with including phosphorus among lead-free solder alloy, and to prevent lowering of bonding strength between a PCB(printed circuit board) and parts by minimizing compound at reaction of copper and tin with including nickel among solder. CONSTITUTION: A lead-free solder alloy composite is composed of copper of 0.1 to 2.0 wt%, phosphorus of 0.001 to 0.005 wt%, and tin. Nickel of 0.01 to 1.0 wt% is added to the lead-free solder alloy composite. Strength and hardness of solder is improved by adding the small amount of phosphorus to the lead-free solder alloy composite, and oxidation with tin or copper and oxygen is prevented in soldering. The amount of compound generated in reaction of copper and tin is minimized with optimizing the composite rate of copper. Spreading of base metal is improved, and fatigue against heat is relieved with tin among solder.
KR1020020023962A 2002-05-01 2002-05-01 Lead-free solder alloy composite KR100395438B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020020023962A KR100395438B1 (en) 2002-05-01 2002-05-01 Lead-free solder alloy composite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020020023962A KR100395438B1 (en) 2002-05-01 2002-05-01 Lead-free solder alloy composite

Publications (1)

Publication Number Publication Date
KR100395438B1 true KR100395438B1 (en) 2003-08-21

Family

ID=37422093

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020023962A KR100395438B1 (en) 2002-05-01 2002-05-01 Lead-free solder alloy composite

Country Status (1)

Country Link
KR (1) KR100395438B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007082459A1 (en) * 2006-01-11 2007-07-26 Thousand Island Metal Foil Co., Ltd Lead-free solder and its preparation method
US20140183733A1 (en) * 2013-01-03 2014-07-03 Duksan Hi-Metal Co., Ltd Metal core solder ball and heat dissipation structure for semiconductor device using the same
WO2017047974A1 (en) * 2015-09-16 2017-03-23 덕산하이메탈(주) Solder alloy composition having improved missing rate and method for preparing same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000197988A (en) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd Leadless solder alloy
JP2000225490A (en) * 1999-02-08 2000-08-15 Nihon Almit Co Ltd Lead-free solder alloy
JP2001191196A (en) * 1999-10-29 2001-07-17 Topy Ind Ltd Sn BASE Pb-FREE SOLDER EXCELLENT IN WETTABILITY, HEAT CYCLE CHARACTERISTICS AND OXIDATION RESISTANCE

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000197988A (en) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd Leadless solder alloy
JP2000225490A (en) * 1999-02-08 2000-08-15 Nihon Almit Co Ltd Lead-free solder alloy
JP2001191196A (en) * 1999-10-29 2001-07-17 Topy Ind Ltd Sn BASE Pb-FREE SOLDER EXCELLENT IN WETTABILITY, HEAT CYCLE CHARACTERISTICS AND OXIDATION RESISTANCE

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007082459A1 (en) * 2006-01-11 2007-07-26 Thousand Island Metal Foil Co., Ltd Lead-free solder and its preparation method
US20140183733A1 (en) * 2013-01-03 2014-07-03 Duksan Hi-Metal Co., Ltd Metal core solder ball and heat dissipation structure for semiconductor device using the same
US10661394B2 (en) * 2013-01-03 2020-05-26 Duksan Hi-Metal Co., Ltd. Metal core solder ball and heat dissipation structure for semiconductor device using the same
WO2017047974A1 (en) * 2015-09-16 2017-03-23 덕산하이메탈(주) Solder alloy composition having improved missing rate and method for preparing same

Similar Documents

Publication Publication Date Title
CN103962744B (en) Soldering tin material and electronic unit conjugant
EP2589459B1 (en) Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
US9333593B2 (en) Joining method, joint structure and method for producing the same
GB2433944A (en) Solder alloy
SG139507A1 (en) Improvements in or relating to solders
MY136743A (en) Lead-free solder alloy
MXPA03000899A (en) Bath and method of electroless plating of silver on metal surfaces.
PL340028A1 (en) Flux for brazing metal material hardly wettable by molten brazing solder and method of obtaining such flux
PL361336A1 (en) Lead-free solders
GB2352200A (en) Lead-free solder alloy powder paste use in PCB
CN100439027C (en) Lead-free welding flux alloy suitable for dissimilar metals soldering flux of aluminum and copper
IL180932A0 (en) Improvements in or relating to solders
EP1402988A1 (en) The use of a solder on surfaces coated with nickel by electroless plating
TW200518871A (en) Lead-free solder ball
MY138109A (en) Electronic part and surface treatment method of the same
JP2013049073A (en) Solder alloy
CN107877031A (en) A kind of lead-free low-temperature solder and preparation method thereof
MY128285A (en) Lead-free zinc-containing solder paste
CN101585119A (en) Oxidation resistant lead-free solder alloy in low silver
KR100395438B1 (en) Lead-free solder alloy composite
WO2003064102A8 (en) Solder metal, soldering flux and solder paste
JP2005340275A (en) Electronic component junction, its manufacturing method and electronic device comprising same
WO2007045191A3 (en) Lead-free solder alloy
JP2000317629A (en) Iron tip for soldering iron
CN101214590A (en) Lead-free solder

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
J204 Request for invalidation trial [patent]
J301 Trial decision

Free format text: TRIAL DECISION FOR INVALIDATION REQUESTED 20030919

Effective date: 20041030

J2X1 Appeal (before the patent court)

Free format text: INVALIDATION

J2X2 Appeal (before the supreme court)

Free format text: APPEAL BEFORE THE SUPREME COURT FOR INVALIDATION

EXTG Ip right invalidated
J302 Written judgement (patent court)

Free format text: JUDGMENT (PATENT COURT) FOR INVALIDATION REQUESTED 20041203

Effective date: 20050819