DE60119017D1 - Bleifreie Zink enthaltende Weichlotpaste - Google Patents

Bleifreie Zink enthaltende Weichlotpaste

Info

Publication number
DE60119017D1
DE60119017D1 DE60119017T DE60119017T DE60119017D1 DE 60119017 D1 DE60119017 D1 DE 60119017D1 DE 60119017 T DE60119017 T DE 60119017T DE 60119017 T DE60119017 T DE 60119017T DE 60119017 D1 DE60119017 D1 DE 60119017D1
Authority
DE
Germany
Prior art keywords
solder paste
lead
soft solder
zinc containing
containing soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60119017T
Other languages
English (en)
Other versions
DE60119017T2 (de
Inventor
Toshihiko Taguchi
Kunihito Takaura
Masahiko Hirata
Hisahiko Yoshida
Takashi Nagashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd, Matsushita Electric Industrial Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of DE60119017D1 publication Critical patent/DE60119017D1/de
Application granted granted Critical
Publication of DE60119017T2 publication Critical patent/DE60119017T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE60119017T 2000-02-04 2001-02-01 Bleifreie,Zink enthaltende Lötpaste Expired - Lifetime DE60119017T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000028034 2000-02-04
JP2000028034 2000-02-04

Publications (2)

Publication Number Publication Date
DE60119017D1 true DE60119017D1 (de) 2006-06-01
DE60119017T2 DE60119017T2 (de) 2006-11-30

Family

ID=18553513

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60119017T Expired - Lifetime DE60119017T2 (de) 2000-02-04 2001-02-01 Bleifreie,Zink enthaltende Lötpaste

Country Status (6)

Country Link
US (1) US6440228B1 (de)
EP (1) EP1142666B1 (de)
CN (1) CN1162249C (de)
AT (1) ATE324222T1 (de)
DE (1) DE60119017T2 (de)
MY (1) MY128285A (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002224880A (ja) * 2000-11-28 2002-08-13 Fujitsu Ltd はんだペースト、および電子装置
WO2002099827A1 (en) * 2001-06-05 2002-12-12 Matsushita Electric Industrial Co., Ltd. Temperature fuse, and battery using the same
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP3788335B2 (ja) * 2001-12-07 2006-06-21 千住金属工業株式会社 ソルダペースト
CN1445049A (zh) * 2002-03-19 2003-10-01 日本胜利株式会社 焊锡膏、焊接成品及焊接方法
US6887319B2 (en) * 2002-04-16 2005-05-03 Senju Metal Industry Co., Ltd. Residue-free solder paste
JP4337326B2 (ja) 2002-10-31 2009-09-30 千住金属工業株式会社 鉛フリーはんだおよびはんだ付け物品
US7180186B2 (en) * 2003-07-31 2007-02-20 Cts Corporation Ball grid array package
JP3797990B2 (ja) * 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
US6946733B2 (en) * 2003-08-13 2005-09-20 Cts Corporation Ball grid array package having testing capability after mounting
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
US7767032B2 (en) 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
WO2010036953A2 (en) 2008-09-26 2010-04-01 Fry's Metals, Inc. Conductive compositions and methods of using them
CN103084756B (zh) * 2013-02-04 2015-04-15 江苏科技大学 一种用于镀锌钢板的点涂式无卤锡膏及其制备方法
CN104384747B (zh) * 2014-10-08 2017-10-13 深圳市唯特偶新材料股份有限公司 一种免冷藏焊锡膏及其制备方法
CN105081600B (zh) * 2015-07-24 2017-07-07 深圳市福英达工业技术有限公司 封装倒置led芯片用的锡基钎焊焊料及其制备方法
TWI646203B (zh) * 2016-07-15 2019-01-01 日商Ｊｘ金屬股份有限公司 Solder alloy

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE581360A (de) 1958-08-05
US3655461A (en) 1970-09-02 1972-04-11 Sanyo Electric Works Flux for aluminum soldering
WO1996037336A1 (en) 1995-05-24 1996-11-28 Fry's Metals Inc. Epoxy-based, voc-free soldering flux
US6159304A (en) * 1997-07-03 2000-12-12 Matsushita Electric Industrial Co., Ltd. Solder paste

Also Published As

Publication number Publication date
US6440228B1 (en) 2002-08-27
EP1142666A1 (de) 2001-10-10
CN1316312A (zh) 2001-10-10
EP1142666B1 (de) 2006-04-26
ATE324222T1 (de) 2006-05-15
CN1162249C (zh) 2004-08-18
MY128285A (en) 2007-01-31
DE60119017T2 (de) 2006-11-30
US20020050305A1 (en) 2002-05-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

Owner name: SENJU METAL INDUSTRY CO., LTD., TOKIO/TOKYO, JP