DE69828973D1 - Vorrichtung zur erfassung von ungerichteten wafern - Google Patents

Vorrichtung zur erfassung von ungerichteten wafern

Info

Publication number
DE69828973D1
DE69828973D1 DE69828973T DE69828973T DE69828973D1 DE 69828973 D1 DE69828973 D1 DE 69828973D1 DE 69828973 T DE69828973 T DE 69828973T DE 69828973 T DE69828973 T DE 69828973T DE 69828973 D1 DE69828973 D1 DE 69828973D1
Authority
DE
Germany
Prior art keywords
unrated
wafer
detecting
unrated wafer
detecting unrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69828973T
Other languages
English (en)
Other versions
DE69828973T2 (de
Inventor
Shih-Hung Li
Curtis Vass
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69828973D1 publication Critical patent/DE69828973D1/de
Publication of DE69828973T2 publication Critical patent/DE69828973T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
DE69828973T 1997-07-23 1998-07-22 Vorrichtung zur erfassung von ungerichteten wafern Expired - Fee Related DE69828973T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US899631 1997-07-23
US08/899,631 US6099596A (en) 1997-07-23 1997-07-23 Wafer out-of-pocket detection tool
PCT/US1998/015519 WO1999005705A1 (en) 1997-07-23 1998-07-22 Wafer out-of-pocket detection tool

Publications (2)

Publication Number Publication Date
DE69828973D1 true DE69828973D1 (de) 2005-03-17
DE69828973T2 DE69828973T2 (de) 2006-04-13

Family

ID=25411328

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69828973T Expired - Fee Related DE69828973T2 (de) 1997-07-23 1998-07-22 Vorrichtung zur erfassung von ungerichteten wafern

Country Status (6)

Country Link
US (2) US6099596A (de)
EP (1) EP0998752B1 (de)
JP (1) JP2001518691A (de)
KR (1) KR100583605B1 (de)
DE (1) DE69828973T2 (de)
WO (1) WO1999005705A1 (de)

Families Citing this family (374)

* Cited by examiner, † Cited by third party
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US6274878B1 (en) 2001-08-14
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KR100583605B1 (ko) 2006-05-26
US6099596A (en) 2000-08-08
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