DE69819159T2 - System zum detektieren von oberflächenanomalien und/oder -merkmalen - Google Patents
System zum detektieren von oberflächenanomalien und/oder -merkmalen Download PDFInfo
- Publication number
- DE69819159T2 DE69819159T2 DE69819159T DE69819159T DE69819159T2 DE 69819159 T2 DE69819159 T2 DE 69819159T2 DE 69819159 T DE69819159 T DE 69819159T DE 69819159 T DE69819159 T DE 69819159T DE 69819159 T2 DE69819159 T2 DE 69819159T2
- Authority
- DE
- Germany
- Prior art keywords
- line
- plane
- detector
- incidence
- focused
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 27
- 230000008859 change Effects 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000013507 mapping Methods 0.000 claims description 7
- 230000004044 response Effects 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims description 2
- 230000003111 delayed effect Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 42
- 238000007689 inspection Methods 0.000 description 21
- 238000003384 imaging method Methods 0.000 description 16
- 239000011159 matrix material Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005286 illumination Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000007847 structural defect Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 241000405086 Bembrops curvatura Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US904892 | 1997-08-01 | ||
| US08/904,892 US6608676B1 (en) | 1997-08-01 | 1997-08-01 | System for detecting anomalies and/or features of a surface |
| PCT/US1998/016116 WO1999006823A1 (en) | 1997-08-01 | 1998-07-28 | System for detecting anomalies and/or features of a surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69819159D1 DE69819159D1 (de) | 2003-11-27 |
| DE69819159T2 true DE69819159T2 (de) | 2004-06-17 |
Family
ID=25419930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69819159T Expired - Lifetime DE69819159T2 (de) | 1997-08-01 | 1998-07-28 | System zum detektieren von oberflächenanomalien und/oder -merkmalen |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US6608676B1 (OSRAM) |
| EP (1) | EP1000346B1 (OSRAM) |
| JP (1) | JP4616472B2 (OSRAM) |
| AT (1) | ATE252731T1 (OSRAM) |
| AU (1) | AU8765798A (OSRAM) |
| DE (1) | DE69819159T2 (OSRAM) |
| WO (1) | WO1999006823A1 (OSRAM) |
Families Citing this family (100)
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| US6608676B1 (en) * | 1997-08-01 | 2003-08-19 | Kla-Tencor Corporation | System for detecting anomalies and/or features of a surface |
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| US6724473B2 (en) | 2002-03-27 | 2004-04-20 | Kla-Tencor Technologies Corporation | Method and system using exposure control to inspect a surface |
| US7130039B2 (en) * | 2002-04-18 | 2006-10-31 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
| US20040042001A1 (en) | 2002-04-18 | 2004-03-04 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
| US20070258085A1 (en) * | 2006-05-02 | 2007-11-08 | Robbins Michael D | Substrate illumination and inspection system |
| DE10232781B4 (de) * | 2002-07-18 | 2013-03-28 | Vistec Semiconductor Systems Gmbh | Vorrichtung zur Wafer-Inspektion |
| US7068363B2 (en) * | 2003-06-06 | 2006-06-27 | Kla-Tencor Technologies Corp. | Systems for inspection of patterned or unpatterned wafers and other specimen |
| JP4536337B2 (ja) * | 2003-06-10 | 2010-09-01 | 株式会社トプコン | 表面検査方法および表面検査装置 |
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| JP4641143B2 (ja) * | 2003-06-30 | 2011-03-02 | 株式会社トプコン | 表面検査装置 |
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| US7265809B2 (en) * | 2003-10-07 | 2007-09-04 | Universal Avionics Systems Corporation | Flat panel display having integral metal heater optically hidden behind an EMI shield |
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| JP4988223B2 (ja) * | 2005-06-22 | 2012-08-01 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
| US7345754B1 (en) | 2005-09-16 | 2008-03-18 | Kla-Tencor Technologies Corp. | Fourier filters and wafer inspection systems |
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| JP5319930B2 (ja) | 2008-02-20 | 2013-10-16 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
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| US7973921B2 (en) * | 2008-06-25 | 2011-07-05 | Applied Materials South East Asia Pte Ltd. | Dynamic illumination in optical inspection systems |
| NL2003658A (en) * | 2008-12-31 | 2010-07-01 | Asml Holding Nv | Euv mask inspection. |
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| JP3599631B2 (ja) | 1993-03-09 | 2004-12-08 | 株式会社ルネサステクノロジ | 欠陥検査方法及び欠陥検査装置 |
| JP3435187B2 (ja) * | 1993-05-12 | 2003-08-11 | 株式会社日立製作所 | 欠陥検査方法及びその装置 |
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-
1997
- 1997-08-01 US US08/904,892 patent/US6608676B1/en not_active Expired - Lifetime
-
1998
- 1998-07-28 JP JP2000505506A patent/JP4616472B2/ja not_active Expired - Lifetime
- 1998-07-28 EP EP98939174A patent/EP1000346B1/en not_active Expired - Lifetime
- 1998-07-28 AT AT98939174T patent/ATE252731T1/de not_active IP Right Cessation
- 1998-07-28 AU AU87657/98A patent/AU8765798A/en not_active Abandoned
- 1998-07-28 DE DE69819159T patent/DE69819159T2/de not_active Expired - Lifetime
- 1998-07-28 WO PCT/US1998/016116 patent/WO1999006823A1/en not_active Ceased
-
2003
- 2003-05-30 US US10/452,624 patent/US20040036864A1/en not_active Abandoned
-
2004
- 2004-09-24 US US10/949,078 patent/US7280199B2/en not_active Expired - Fee Related
-
2007
- 2007-09-14 US US11/855,935 patent/US20080002193A1/en not_active Abandoned
-
2008
- 2008-05-19 US US12/123,393 patent/US7869023B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1000346B1 (en) | 2003-10-22 |
| US6608676B1 (en) | 2003-08-19 |
| JP4616472B2 (ja) | 2011-01-19 |
| US20050036138A1 (en) | 2005-02-17 |
| DE69819159D1 (de) | 2003-11-27 |
| US20080218762A1 (en) | 2008-09-11 |
| ATE252731T1 (de) | 2003-11-15 |
| US20040036864A1 (en) | 2004-02-26 |
| WO1999006823A1 (en) | 1999-02-11 |
| AU8765798A (en) | 1999-02-22 |
| US7869023B2 (en) | 2011-01-11 |
| US7280199B2 (en) | 2007-10-09 |
| US20080002193A1 (en) | 2008-01-03 |
| EP1000346A1 (en) | 2000-05-17 |
| JP2001512237A (ja) | 2001-08-21 |
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