DE69819159D1 - System zum detektieren von oberflächenanomalien und/oder -merkmalen - Google Patents

System zum detektieren von oberflächenanomalien und/oder -merkmalen

Info

Publication number
DE69819159D1
DE69819159D1 DE69819159T DE69819159T DE69819159D1 DE 69819159 D1 DE69819159 D1 DE 69819159D1 DE 69819159 T DE69819159 T DE 69819159T DE 69819159 T DE69819159 T DE 69819159T DE 69819159 D1 DE69819159 D1 DE 69819159D1
Authority
DE
Germany
Prior art keywords
features
line
detecting surface
surface anomalies
incidence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69819159T
Other languages
English (en)
Other versions
DE69819159T2 (de
Inventor
Guoheng Zhao
Stanley Stokowski
Mehdi Vaez-Iravani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Publication of DE69819159D1 publication Critical patent/DE69819159D1/de
Application granted granted Critical
Publication of DE69819159T2 publication Critical patent/DE69819159T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
DE69819159T 1997-08-01 1998-07-28 System zum detektieren von oberflächenanomalien und/oder -merkmalen Expired - Lifetime DE69819159T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/904,892 US6608676B1 (en) 1997-08-01 1997-08-01 System for detecting anomalies and/or features of a surface
US904892 1997-08-01
PCT/US1998/016116 WO1999006823A1 (en) 1997-08-01 1998-07-28 System for detecting anomalies and/or features of a surface

Publications (2)

Publication Number Publication Date
DE69819159D1 true DE69819159D1 (de) 2003-11-27
DE69819159T2 DE69819159T2 (de) 2004-06-17

Family

ID=25419930

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69819159T Expired - Lifetime DE69819159T2 (de) 1997-08-01 1998-07-28 System zum detektieren von oberflächenanomalien und/oder -merkmalen

Country Status (7)

Country Link
US (5) US6608676B1 (de)
EP (1) EP1000346B1 (de)
JP (1) JP4616472B2 (de)
AT (1) ATE252731T1 (de)
AU (1) AU8765798A (de)
DE (1) DE69819159T2 (de)
WO (1) WO1999006823A1 (de)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6411377B1 (en) * 1991-04-02 2002-06-25 Hitachi, Ltd. Optical apparatus for defect and particle size inspection
US6608676B1 (en) * 1997-08-01 2003-08-19 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
US6091488A (en) * 1999-03-22 2000-07-18 Beltronics, Inc. Method of and apparatus for automatic high-speed optical inspection of semi-conductor structures and the like through fluorescent photoresist inspection
US6587193B1 (en) * 1999-05-11 2003-07-01 Applied Materials, Inc. Inspection systems performing two-dimensional imaging with line light spot
IL146386A (en) * 2001-11-08 2010-02-17 Nova Measuring Instr Ltd Method and apparatus for measuring thin films
US20040032581A1 (en) * 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
US7088443B2 (en) * 2002-02-11 2006-08-08 Kla-Tencor Technologies Corporation System for detecting anomalies and/or features of a surface
US6724473B2 (en) 2002-03-27 2004-04-20 Kla-Tencor Technologies Corporation Method and system using exposure control to inspect a surface
US7130039B2 (en) * 2002-04-18 2006-10-31 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US20040042001A1 (en) 2002-04-18 2004-03-04 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
DE10232781B4 (de) * 2002-07-18 2013-03-28 Vistec Semiconductor Systems Gmbh Vorrichtung zur Wafer-Inspektion
US7068363B2 (en) * 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
JP4536337B2 (ja) * 2003-06-10 2010-09-01 株式会社トプコン 表面検査方法および表面検査装置
US7365834B2 (en) * 2003-06-24 2008-04-29 Kla-Tencor Technologies Corporation Optical system for detecting anomalies and/or features of surfaces
JP4641143B2 (ja) * 2003-06-30 2011-03-02 株式会社トプコン 表面検査装置
US7280200B2 (en) * 2003-07-18 2007-10-09 Ade Corporation Detection of a wafer edge using collimated light
US7130036B1 (en) * 2003-09-16 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for inspection of an entire wafer surface using multiple detection channels
US7265809B2 (en) * 2003-10-07 2007-09-04 Universal Avionics Systems Corporation Flat panel display having integral metal heater optically hidden behind an EMI shield
US7760882B2 (en) * 2004-06-28 2010-07-20 Japan Communications, Inc. Systems and methods for mutual authentication of network nodes
US7420669B2 (en) * 2004-07-01 2008-09-02 Midwest Research Institute Optic probe for semiconductor characterization
US7233389B2 (en) * 2004-12-03 2007-06-19 Omnitek Partners, Llc System and method for the measurement of the velocity and acceleration of objects
US7253376B2 (en) * 2005-01-21 2007-08-07 Ultratech, Inc. Methods and apparatus for truncating an image formed with coherent radiation
US7804993B2 (en) * 2005-02-28 2010-09-28 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
US7315361B2 (en) * 2005-04-29 2008-01-01 Gsi Group Corporation System and method for inspecting wafers in a laser marking system
JP4988223B2 (ja) * 2005-06-22 2012-08-01 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US7345754B1 (en) 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
US20070119836A1 (en) * 2005-11-29 2007-05-31 Thomas Schroeder Method and apparatus for focusing a beam from an excimer laser to form a line of light on a substrate
JP4996856B2 (ja) * 2006-01-23 2012-08-08 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US20070229833A1 (en) * 2006-02-22 2007-10-04 Allan Rosencwaig High-sensitivity surface detection system and method
US9068917B1 (en) * 2006-03-14 2015-06-30 Kla-Tencor Technologies Corp. Systems and methods for inspection of a specimen
JP2007248086A (ja) 2006-03-14 2007-09-27 Hitachi High-Technologies Corp 欠陥検査装置
US20090122304A1 (en) * 2006-05-02 2009-05-14 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Exclusion Measurement
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
US20090116727A1 (en) * 2006-05-02 2009-05-07 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Defects Detection
US7433033B2 (en) * 2006-05-05 2008-10-07 Asml Netherlands B.V. Inspection method and apparatus using same
US7525649B1 (en) * 2007-10-19 2009-04-28 Kla-Tencor Technologies Corporation Surface inspection system using laser line illumination with two dimensional imaging
US7826049B2 (en) * 2008-02-11 2010-11-02 Applied Materials South East Asia Pte. Ltd. Inspection tools supporting multiple operating states for multiple detector arrangements
JP5319930B2 (ja) 2008-02-20 2013-10-16 株式会社日立ハイテクノロジーズ 欠陥検査装置及び欠陥検査方法
US8285025B2 (en) * 2008-03-25 2012-10-09 Electro Scientific Industries, Inc. Method and apparatus for detecting defects using structured light
US7973921B2 (en) * 2008-06-25 2011-07-05 Applied Materials South East Asia Pte Ltd. Dynamic illumination in optical inspection systems
NL2003658A (en) * 2008-12-31 2010-07-01 Asml Holding Nv Euv mask inspection.
JP5331586B2 (ja) 2009-06-18 2013-10-30 株式会社日立ハイテクノロジーズ 欠陥検査装置および検査方法
JP5405956B2 (ja) 2009-09-24 2014-02-05 株式会社日立ハイテクノロジーズ 欠陥検査装置
JP5538072B2 (ja) 2010-06-03 2014-07-02 株式会社日立ハイテクノロジーズ 欠陥検査方法およびその装置
JP5520737B2 (ja) 2010-07-30 2014-06-11 株式会社日立ハイテクノロジーズ 欠陥検査装置および欠陥検査方法
JP5259669B2 (ja) * 2010-09-27 2013-08-07 株式会社日立ハイテクノロジーズ 欠陥検査装置及び欠陥検査方法
JP2012127682A (ja) 2010-12-13 2012-07-05 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
JP2012137350A (ja) 2010-12-27 2012-07-19 Hitachi High-Technologies Corp 欠陥検査方法および欠陥検査装置
US8885158B2 (en) * 2011-03-10 2014-11-11 Kla-Tencor Corporation Surface scanning inspection system with adjustable scan pitch
US9793673B2 (en) 2011-06-13 2017-10-17 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US9250178B2 (en) 2011-10-07 2016-02-02 Kla-Tencor Corporation Passivation of nonlinear optical crystals
CN102489875A (zh) * 2011-11-25 2012-06-13 中国航空工业集团公司北京航空制造工程研究所 一种利用柱面镜进行激光倾斜入射的能量补偿方法
EP2786117B1 (de) 2011-12-01 2022-12-21 Particle Measuring Systems, Inc. Schema zur erkennung von partikelgrössen und -konzentrationen
US9151719B2 (en) 2011-12-27 2015-10-06 Hitachi High-Technologies Corporation Inspection apparatus
JP5865738B2 (ja) * 2012-03-13 2016-02-17 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
US9496425B2 (en) 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
US9535009B2 (en) * 2012-05-16 2017-01-03 Hitachi High-Technologies Corporation Inspection system
US9601299B2 (en) 2012-08-03 2017-03-21 Kla-Tencor Corporation Photocathode including silicon substrate with boron layer
US9086389B2 (en) 2012-10-26 2015-07-21 Kla-Tencor Corporation Sample inspection system detector
US9151940B2 (en) 2012-12-05 2015-10-06 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US9426400B2 (en) 2012-12-10 2016-08-23 Kla-Tencor Corporation Method and apparatus for high speed acquisition of moving images using pulsed illumination
US8929406B2 (en) 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
US9529182B2 (en) 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
US9608399B2 (en) 2013-03-18 2017-03-28 Kla-Tencor Corporation 193 nm laser and an inspection system using a 193 nm laser
US9478402B2 (en) 2013-04-01 2016-10-25 Kla-Tencor Corporation Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
US9748294B2 (en) 2014-01-10 2017-08-29 Hamamatsu Photonics K.K. Anti-reflection layer for back-illuminated sensor
US9410901B2 (en) 2014-03-17 2016-08-09 Kla-Tencor Corporation Image sensor, an inspection system and a method of inspecting an article
US9804101B2 (en) 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
GB2526866A (en) * 2014-06-05 2015-12-09 Univ Bristol Apparatus for and method of inspecting surface topography of a moving object
US9525265B2 (en) 2014-06-20 2016-12-20 Kla-Tencor Corporation Laser repetition rate multiplier and flat-top beam profile generators using mirrors and/or prisms
KR102316146B1 (ko) 2014-08-13 2021-10-22 삼성전자주식회사 표면 검사용 광학 모듈 및 이를 포함하는 표면 검사 장치
US9767986B2 (en) 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
US9891177B2 (en) 2014-10-03 2018-02-13 Kla-Tencor Corporation TDI sensor in a darkfield system
US9748729B2 (en) 2014-10-03 2017-08-29 Kla-Tencor Corporation 183NM laser and inspection system
JP6635674B2 (ja) * 2015-05-11 2020-01-29 キヤノン株式会社 計測装置、計測方法およびプログラム
US9860466B2 (en) 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
US10748730B2 (en) 2015-05-21 2020-08-18 Kla-Tencor Corporation Photocathode including field emitter array on a silicon substrate with boron layer
US10462391B2 (en) 2015-08-14 2019-10-29 Kla-Tencor Corporation Dark-field inspection using a low-noise sensor
US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
US10324045B2 (en) 2016-08-05 2019-06-18 Kla-Tencor Corporation Surface defect inspection with large particle monitoring and laser power control
US10739275B2 (en) 2016-09-15 2020-08-11 Kla-Tencor Corporation Simultaneous multi-directional laser wafer inspection
US11988603B2 (en) * 2016-10-30 2024-05-21 University Of Vienna High speed deep tissue imaging system using multiplexed scanned temporal focusing
US10175555B2 (en) 2017-01-03 2019-01-08 KLA—Tencor Corporation 183 nm CW laser and inspection system
JP7326256B2 (ja) * 2017-10-26 2023-08-15 パーティクル・メージャーリング・システムズ・インコーポレーテッド 粒子計測システム及び方法
US11114489B2 (en) 2018-06-18 2021-09-07 Kla-Tencor Corporation Back-illuminated sensor and a method of manufacturing a sensor
US10943760B2 (en) 2018-10-12 2021-03-09 Kla Corporation Electron gun and electron microscope
US11114491B2 (en) 2018-12-12 2021-09-07 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor
US11237095B2 (en) 2019-04-25 2022-02-01 Particle Measuring Systems, Inc. Particle detection systems and methods for on-axis particle detection and/or differential detection
WO2020257154A1 (en) * 2019-06-17 2020-12-24 Georgia Tech Research Corporation Low-aberration high-speed-compatible optical delay lines and methods thereof
US11703460B2 (en) 2019-07-09 2023-07-18 Kla Corporation Methods and systems for optical surface defect material characterization
CN114729868A (zh) 2019-11-22 2022-07-08 粒子监测系统有限公司 先进的用于干涉测量颗粒检测和具有小大小尺寸的颗粒的检测的系统和方法
US11668601B2 (en) * 2020-02-24 2023-06-06 Kla Corporation Instrumented substrate apparatus
US11848350B2 (en) 2020-04-08 2023-12-19 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor using a silicon on insulator wafer
CN115201990A (zh) * 2022-09-08 2022-10-18 成都中科卓尔智能科技集团有限公司 一种半导体光学材料内部缺陷检测片光源镜头

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0023577B1 (de) * 1979-07-06 1985-11-21 Kabushiki Kaisha Toshiba Messen der Oberflächenspannung
JPS5630630A (en) * 1979-08-23 1981-03-27 Hitachi Ltd Foreign matter detector
US4579455A (en) 1983-05-09 1986-04-01 Kla Instruments Corporation Photomask inspection apparatus and method with improved defect detection
JPH0750664B2 (ja) * 1983-06-23 1995-05-31 富士通株式会社 レチクルの検査方法
US4629319A (en) * 1984-02-14 1986-12-16 Diffracto Ltd. Panel surface flaw inspection
GB2159271B (en) * 1984-04-27 1988-05-18 Nissan Motor Surface flaw detecting method and apparatus
US4795911A (en) * 1986-02-14 1989-01-03 Canon Kabushiki Kaisha Surface examining apparatus for detecting the presence of foreign particles on the surface
JPS6333834A (ja) * 1986-07-28 1988-02-13 Canon Inc 表面状態検査装置
DE3637477A1 (de) 1986-11-04 1988-05-11 Wacker Chemitronic Verfahren und vorrichtung zur ermittlung der qualitaet von oberflaechen, insbesondere von halbleiterscheiben
JPS63314963A (ja) 1987-06-18 1988-12-22 Fuji Photo Film Co Ltd 原稿照明装置
US4898471A (en) 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
JP2512059B2 (ja) * 1988-02-26 1996-07-03 株式会社日立製作所 異物検出方法及びその装置
US5206699A (en) 1988-05-06 1993-04-27 Gersan Establishment Sensing a narrow frequency band of radiation and gemstones
US5274434A (en) * 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
DE4121464A1 (de) * 1990-06-28 1992-01-09 Mazda Motor Vorrichtung zur feststellung von oberflaechendefekten
US5192856A (en) 1990-11-19 1993-03-09 An Con Genetics, Inc. Auto focusing bar code reader
US5172005A (en) * 1991-02-20 1992-12-15 Pressco Technology, Inc. Engineered lighting system for tdi inspection comprising means for controlling lighting elements in accordance with specimen displacement
US5463459A (en) 1991-04-02 1995-10-31 Hitachi, Ltd. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
US6411377B1 (en) * 1991-04-02 2002-06-25 Hitachi, Ltd. Optical apparatus for defect and particle size inspection
US5479259A (en) 1991-05-20 1995-12-26 Hitachi, Ltd. Method and apparatus for detecting photoacoustic signal
US5251010A (en) * 1991-06-07 1993-10-05 Glasstech, Inc. Optical roller wave gauge
US5636187A (en) * 1992-12-11 1997-06-03 Canon Kabushiki Kaisha Magnetooptical recording apparatus and magnetooptical recording method for canceling leakage magnetic fields associated with a recording medium and devices ancillary to the recording medium
JPH06194320A (ja) * 1992-12-25 1994-07-15 Hitachi Ltd 半導体製造ラインにおける鏡面基板の検査方法およびその装置並びに半導体製造方法
JP3599631B2 (ja) 1993-03-09 2004-12-08 株式会社ルネサステクノロジ 欠陥検査方法及び欠陥検査装置
JP3599630B2 (ja) 1993-03-09 2004-12-08 株式会社ルネサステクノロジ 欠陥検査方法及び欠陥検査装置
JP3435187B2 (ja) * 1993-05-12 2003-08-11 株式会社日立製作所 欠陥検査方法及びその装置
JP3253177B2 (ja) 1993-06-15 2002-02-04 キヤノン株式会社 表面状態検査装置
US5663569A (en) * 1993-10-14 1997-09-02 Nikon Corporation Defect inspection method and apparatus, and defect display method
US5463549A (en) * 1993-10-15 1995-10-31 Schlumberger Technology Corporation Method and apparatus for determining permeability of subsurface formations
JPH07209202A (ja) * 1994-01-21 1995-08-11 Canon Inc 表面状態検査装置、該表面状態検査装置を備える露光装置及び該露光装置を用いてデバイスを製造する方法
JPH07318504A (ja) * 1994-05-23 1995-12-08 Hitachi Electron Eng Co Ltd ウエハの異物検出受光系
US5576831A (en) * 1994-06-20 1996-11-19 Tencor Instruments Wafer alignment sensor
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US5530550A (en) * 1994-12-21 1996-06-25 Tencor Instruments Optical wafer positioning system
US5883710A (en) * 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US6118525A (en) * 1995-03-06 2000-09-12 Ade Optical Systems Corporation Wafer inspection system for distinguishing pits and particles
JP3140664B2 (ja) 1995-06-30 2001-03-05 松下電器産業株式会社 異物検査方法及び装置
JP3668294B2 (ja) * 1995-08-22 2005-07-06 オリンパス株式会社 表面欠陥検査装置
US5825482A (en) 1995-09-29 1998-10-20 Kla-Tencor Corporation Surface inspection system with misregistration error correction and adaptive illumination
US5644393A (en) 1995-10-19 1997-07-01 Hitachi Electronics Engineering Co., Ltd. Extraneous substance inspection method and apparatus
US5737074A (en) * 1995-12-05 1998-04-07 New Creation Co., Ltd. Surface inspection method and apparatus
US5926266A (en) * 1996-09-23 1999-07-20 International Business Machines Corporation Optical apparatus for rapid defect analysis
US5719840A (en) 1996-12-30 1998-02-17 Phase Metrics Optical sensor with an elliptical illumination spot
JPH10318504A (ja) * 1997-05-16 1998-12-04 Babcock Hitachi Kk 大容量微粉固体燃料燃焼装置
US6608676B1 (en) 1997-08-01 2003-08-19 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
JPH11230915A (ja) 1998-02-13 1999-08-27 Hitachi Ltd 異物検査装置
US7088443B2 (en) * 2002-02-11 2006-08-08 Kla-Tencor Technologies Corporation System for detecting anomalies and/or features of a surface

Also Published As

Publication number Publication date
US20040036864A1 (en) 2004-02-26
US20080002193A1 (en) 2008-01-03
ATE252731T1 (de) 2003-11-15
US7280199B2 (en) 2007-10-09
JP2001512237A (ja) 2001-08-21
EP1000346B1 (de) 2003-10-22
WO1999006823A1 (en) 1999-02-11
JP4616472B2 (ja) 2011-01-19
US20080218762A1 (en) 2008-09-11
US6608676B1 (en) 2003-08-19
EP1000346A1 (de) 2000-05-17
US7869023B2 (en) 2011-01-11
DE69819159T2 (de) 2004-06-17
US20050036138A1 (en) 2005-02-17
AU8765798A (en) 1999-02-22

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