DE69813488D1 - Härtbare Zusammensetzungen und gehärtete Gel-Gegenstände daraus - Google Patents

Härtbare Zusammensetzungen und gehärtete Gel-Gegenstände daraus

Info

Publication number
DE69813488D1
DE69813488D1 DE69813488T DE69813488T DE69813488D1 DE 69813488 D1 DE69813488 D1 DE 69813488D1 DE 69813488 T DE69813488 T DE 69813488T DE 69813488 T DE69813488 T DE 69813488T DE 69813488 D1 DE69813488 D1 DE 69813488D1
Authority
DE
Germany
Prior art keywords
curable compositions
articles therefrom
hardened gel
gel articles
hardened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69813488T
Other languages
English (en)
Other versions
DE69813488T2 (de
Inventor
Kenichi Fukuda
Yasuo Tarumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE69813488D1 publication Critical patent/DE69813488D1/de
Application granted granted Critical
Publication of DE69813488T2 publication Critical patent/DE69813488T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/002—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds
    • C08G65/005—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens
    • C08G65/007—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens containing fluorine

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69813488T 1997-12-24 1998-12-24 Härtbare Zusammensetzungen und gehärtete Gel-Gegenstände daraus Expired - Fee Related DE69813488T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36649997 1997-12-24
JP36649997A JP3475760B2 (ja) 1997-12-24 1997-12-24 硬化性組成物及びゲル硬化物

Publications (2)

Publication Number Publication Date
DE69813488D1 true DE69813488D1 (de) 2003-05-22
DE69813488T2 DE69813488T2 (de) 2004-03-25

Family

ID=18486941

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69813488T Expired - Fee Related DE69813488T2 (de) 1997-12-24 1998-12-24 Härtbare Zusammensetzungen und gehärtete Gel-Gegenstände daraus

Country Status (4)

Country Link
US (1) US6127504A (de)
EP (1) EP0926182B1 (de)
JP (1) JP3475760B2 (de)
DE (1) DE69813488T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3573191B2 (ja) * 1998-06-22 2004-10-06 信越化学工業株式会社 フッ素ゴム組成物及びその製造方法
US6265515B1 (en) * 1999-06-14 2001-07-24 The United States Of America As Represented By The Secretary Of The Navy Fluorinated silicone resin fouling release composition
JP3640337B2 (ja) * 1999-10-04 2005-04-20 信越化学工業株式会社 圧力センサー装置
JP2001192546A (ja) * 2000-01-07 2001-07-17 Shin Etsu Chem Co Ltd 硬化性フルオロポリエーテル系ゴム組成物
JP4016239B2 (ja) * 2000-07-05 2007-12-05 信越化学工業株式会社 硬化性フルオロポリエーテル系ゴム組成物
DE60220962T2 (de) * 2001-02-20 2008-03-13 Shin-Etsu Chemical Co., Ltd. Fluorinierte härtbare Zusammensetzungen, deren Herstellung und Verwendung
JP3815778B2 (ja) 2002-01-10 2006-08-30 信越化学工業株式会社 低ブリード性ゲル状硬化物を与える硬化性組成物
WO2004050758A1 (ja) * 2002-12-05 2004-06-17 Daikin Industries, Ltd. 含フッ素ポリマー組成物及び硬化体
JP4618230B2 (ja) * 2002-12-05 2011-01-26 ダイキン工業株式会社 含フッ素ポリマー組成物及び硬化体
JP3962927B2 (ja) 2003-05-01 2007-08-22 信越化学工業株式会社 電気電子部品を保護する封止材の除去方法
JP2006219668A (ja) * 2005-01-14 2006-08-24 Shin Etsu Chem Co Ltd 熱硬化性フルオロポリエーテル系組成物
JP4784743B2 (ja) * 2005-02-14 2011-10-05 信越化学工業株式会社 硬化性パーフルオロポリエーテル組成物、その硬化物を用いたゴム及びゲル製品
US7988106B2 (en) 2007-02-23 2011-08-02 Carnevali Jeffrey D Adaptive mounting structure
JP5223978B2 (ja) * 2011-03-30 2013-06-26 ダイキン工業株式会社 光学素子封止用含フッ素樹脂組成物、及び、硬化物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056190B2 (ja) * 1980-04-11 1985-12-09 東芝シリコ−ン株式会社 ポリオルガノシロキサン組成物
JPS623959A (ja) * 1985-06-29 1987-01-09 Toshiba Corp 記録装置
DE3624776A1 (de) * 1986-07-22 1988-01-28 Bayer Ag Weiche siliconelastomere
JPS6335655A (ja) * 1986-07-30 1988-02-16 Toshiba Silicone Co Ltd シリコ−ンゲル組成物
JPH0786175B2 (ja) * 1990-11-29 1995-09-20 信越化学工業株式会社 離型耐久性に優れたシリコーンゴム組成物
JP3017657B2 (ja) * 1995-02-03 2000-03-13 信越化学工業株式会社 硬化性フルオロポリエーテル系ゴム組成物
JP3239717B2 (ja) * 1995-09-29 2001-12-17 信越化学工業株式会社 硬化性組成物
JP3298413B2 (ja) * 1996-06-03 2002-07-02 信越化学工業株式会社 硬化性組成物

Also Published As

Publication number Publication date
JP3475760B2 (ja) 2003-12-08
JPH11181288A (ja) 1999-07-06
EP0926182A3 (de) 2000-02-02
US6127504A (en) 2000-10-03
DE69813488T2 (de) 2004-03-25
EP0926182B1 (de) 2003-04-16
EP0926182A2 (de) 1999-06-30

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee