DE69738172D1 - Eine integrierte Schaltung auf einem ultrabiegsamen Substrat und ein Verfahren für eine Drahtverbindung zwischen einer integrierten Schaltung und einem ultrabiegsamen Substrat - Google Patents

Eine integrierte Schaltung auf einem ultrabiegsamen Substrat und ein Verfahren für eine Drahtverbindung zwischen einer integrierten Schaltung und einem ultrabiegsamen Substrat

Info

Publication number
DE69738172D1
DE69738172D1 DE69738172T DE69738172T DE69738172D1 DE 69738172 D1 DE69738172 D1 DE 69738172D1 DE 69738172 T DE69738172 T DE 69738172T DE 69738172 T DE69738172 T DE 69738172T DE 69738172 D1 DE69738172 D1 DE 69738172D1
Authority
DE
Germany
Prior art keywords
integrated circuit
substrate
wire bonding
attachment area
resonant circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69738172T
Other languages
English (en)
Other versions
DE69738172T2 (de
Inventor
Mark R Isaacson
Anthony F Piccoli
Michael Holloway
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Checkpoint Systems Inc
Original Assignee
Checkpoint Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems Inc filed Critical Checkpoint Systems Inc
Publication of DE69738172D1 publication Critical patent/DE69738172D1/de
Application granted granted Critical
Publication of DE69738172T2 publication Critical patent/DE69738172T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0726—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Burglar Alarm Systems (AREA)
DE1997638172 1996-07-22 1997-07-21 Eine integrierte Schaltung auf einem ultrabiegsamen Substrat und ein Verfahren für eine Drahtverbindung zwischen einer integrierten Schaltung und einem ultrabiegsamen Substrat Expired - Lifetime DE69738172T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/681,195 US5708419A (en) 1996-07-22 1996-07-22 Method of wire bonding an integrated circuit to an ultraflexible substrate
US681195 2001-02-16

Publications (2)

Publication Number Publication Date
DE69738172D1 true DE69738172D1 (de) 2007-11-15
DE69738172T2 DE69738172T2 (de) 2008-07-10

Family

ID=24734222

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997638172 Expired - Lifetime DE69738172T2 (de) 1996-07-22 1997-07-21 Eine integrierte Schaltung auf einem ultrabiegsamen Substrat und ein Verfahren für eine Drahtverbindung zwischen einer integrierten Schaltung und einem ultrabiegsamen Substrat

Country Status (15)

Country Link
US (1) US5708419A (de)
EP (1) EP0821406B1 (de)
JP (2) JP4290233B2 (de)
KR (1) KR100543349B1 (de)
CN (1) CN1108634C (de)
AR (1) AR007853A1 (de)
AT (1) ATE375004T1 (de)
AU (1) AU715326B2 (de)
CA (1) CA2210833C (de)
DE (1) DE69738172T2 (de)
ES (1) ES2294790T3 (de)
IL (1) IL121087A (de)
MX (1) MX9705524A (de)
NZ (1) NZ328217A (de)
TW (1) TW342582B (de)

Families Citing this family (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158031B2 (en) * 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US6075441A (en) 1996-09-05 2000-06-13 Key-Trak, Inc. Inventoriable-object control and tracking system
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
CA2283503C (en) * 1997-03-10 2002-08-06 Precision Dynamics Corporation Reactively coupled elements in circuits on flexible substrates
US6980085B1 (en) 1997-08-18 2005-12-27 Micron Technology, Inc. Wireless communication devices and methods of forming and operating the same
US6339385B1 (en) * 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
EP0901155B1 (de) * 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
US5982284A (en) * 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
US5861809A (en) * 1997-09-22 1999-01-19 Checkpoint Systems, Inc. Deactivateable resonant circuit
US6164551A (en) * 1997-10-29 2000-12-26 Meto International Gmbh Radio frequency identification transponder having non-encapsulated IC chip
DE59711263D1 (de) 1997-10-30 2004-03-04 Esec Trading Sa Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
US7844505B1 (en) 1997-11-21 2010-11-30 Symbol Technologies, Inc. Automated real-time distributed tag reader network
US7035818B1 (en) * 1997-11-21 2006-04-25 Symbol Technologies, Inc. System and method for electronic inventory
EP0958663A1 (de) * 1997-12-05 1999-11-24 Koninklijke Philips Electronics N.V. Zwischenverstärker zur identifikation
EP0923111B1 (de) 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
US6249227B1 (en) * 1998-01-05 2001-06-19 Intermec Ip Corp. RFID integrated in electronic assets
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
US6262664B1 (en) 1998-09-11 2001-07-17 Key-Trak, Inc. Tamper detection prevention for an object control and tracking system
US6891473B2 (en) * 1998-09-11 2005-05-10 Key-Trak, Inc. Object carriers and lighted tags for an object control and tracking system
US6204764B1 (en) * 1998-09-11 2001-03-20 Key-Trak, Inc. Object tracking system with non-contact object detection and identification
WO2000016564A1 (en) * 1998-09-11 2000-03-23 Key-Trak, Inc. Object control and tracking system with zonal transition detection
US6195005B1 (en) 1998-09-11 2001-02-27 Key-Trak, Inc. Object carriers for an object control and tracking system
WO2000016281A1 (en) 1998-09-11 2000-03-23 Key-Trak, Inc. Mobile object tracking system
US6630370B2 (en) 1998-10-02 2003-10-07 Shinko Electric Industries Co., Ltd. Process for manufacturing IC card
US6114962A (en) * 1998-10-15 2000-09-05 Intermec Ip Corp. RF tag having strain relieved stiff substrate and hydrostatic protection for a chip mounted thereto
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
US6226619B1 (en) * 1998-10-29 2001-05-01 International Business Machines Corporation Method and system for preventing counterfeiting of high price wholesale and retail items
DE19850353C1 (de) * 1998-11-02 2000-03-16 David Finn Identifikationslabel sowie Verfahren zur Herstellung eines Indentifikationslabels
US6163260A (en) * 1998-12-10 2000-12-19 Intermec Ip Corp. Linerless label tracking system
US6091607A (en) * 1998-12-10 2000-07-18 Checkpoint Systems, Inc. Resonant tag with a conductive composition closing an electrical circuit
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US8636220B2 (en) * 2006-12-29 2014-01-28 Vanguard Identification Systems, Inc. Printed planar RFID element wristbands and like personal identification devices
US8585852B2 (en) * 1999-06-16 2013-11-19 Vanguard Identification Systems, Inc. Methods of making printed planar radio frequency identification elements
US8654018B2 (en) * 2005-04-06 2014-02-18 Vanguard Identificaiton Systems, Inc. Printed planar RFID element wristbands and like personal identification devices
JP2001043336A (ja) * 1999-07-29 2001-02-16 Sony Chem Corp Ｉｃカード
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6509217B1 (en) 1999-10-22 2003-01-21 Damoder Reddy Inexpensive, reliable, planar RFID tag structure and method for making same
US6522308B1 (en) * 2000-01-03 2003-02-18 Ask S.A. Variable capacitance coupling antenna
ES2351549T3 (es) * 2000-03-21 2011-02-07 Mikoh Corporation Una etiqueta de identificación por radiofrecuencia con indicación de manipulación indebida.
US6796508B2 (en) * 2000-03-28 2004-09-28 Lucatron Ag Rfid-label with an element for regulating the resonance frequency
GB2361584A (en) * 2000-04-19 2001-10-24 Motorola Israel Ltd Multi-band antenna and switch system
MXPA02010342A (es) * 2000-04-20 2004-09-06 Cogiscan Inc Sistema automatizado de control de manufactura.
AU2001279161A1 (en) 2000-08-04 2002-02-18 Hei, Inc. Structures and assembly methods for radio-frequency-identification modules
US6714136B1 (en) * 2000-08-14 2004-03-30 Computime, Ltd. Alarm clock with remote control function
KR100367301B1 (ko) * 2000-10-09 2003-01-09 (주)이.씨테크날리지 비접촉식 카드모듈의 제조방법 및 그 장치
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6693541B2 (en) * 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
US7190083B1 (en) 2002-01-07 2007-03-13 Vixs Systems, Inc. High frequency integrated circuit using capacitive bonding
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6777829B2 (en) * 2002-03-13 2004-08-17 Celis Semiconductor Corporation Rectifier utilizing a grounded antenna
DE10232007A1 (de) * 2002-07-15 2004-02-19 Giesecke & Devrient Gmbh Transponder für flachstückartig ausgebildete Artikel
GB2395628B (en) * 2002-11-21 2006-05-10 Hewlett Packard Co Memory tag
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
WO2004100255A1 (en) * 2003-04-29 2004-11-18 Semiconductor Components Industries L.L.C. Method of making a low profile packaged semiconductor device
TWI245238B (en) 2003-05-01 2005-12-11 Checkpoint Systems Inc LC resonant circuit with amplification device
JP2005129900A (ja) * 2003-09-30 2005-05-19 Sanyo Electric Co Ltd 回路装置およびその製造方法
US7704346B2 (en) 2004-02-23 2010-04-27 Checkpoint Systems, Inc. Method of fabricating a security tag in an integrated surface processing system
US8099335B2 (en) * 2004-02-23 2012-01-17 Checkpoint Systems, Inc. Method and system for determining billing information in a tag fabrication process
US7138919B2 (en) * 2004-02-23 2006-11-21 Checkpoint Systems, Inc. Identification marking and method for applying the identification marking to an item
US7119685B2 (en) * 2004-02-23 2006-10-10 Checkpoint Systems, Inc. Method for aligning capacitor plates in a security tag and a capacitor formed thereby
US7116227B2 (en) * 2004-02-23 2006-10-03 Checkpoint Systems, Inc. Tag having patterned circuit elements and a process for making same
US7384496B2 (en) * 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
TWI288885B (en) * 2004-06-24 2007-10-21 Checkpoint Systems Inc Die attach area cut-on-fly method and apparatus
EP1950791B1 (de) 2004-06-24 2009-02-11 Checkpoint Systems, Inc. Bonding Maschine um Transponder zu befestigen und Verfahren
US20060055531A1 (en) * 2004-09-14 2006-03-16 Honeywell International, Inc. Combined RF tag and SAW sensor
AU2005294309A1 (en) * 2004-10-07 2006-04-20 West Pharmaceutical Services, Inc. Closure for a container
US7353598B2 (en) 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7615479B1 (en) * 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
JP3915927B2 (ja) * 2004-11-18 2007-05-16 セイコーエプソン株式会社 電子部品及びその製造方法
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
CN100369932C (zh) * 2005-04-07 2008-02-20 苏州大学 抗人cd154单克隆抗体及其应用
EP1908043B1 (de) * 2005-04-28 2015-03-25 ZIH Corporation Antimikrobielle beschichtung für identifikationsvorrichtungen
US7347148B2 (en) * 2005-05-11 2008-03-25 Hunter Paine Enterprises, Llc Shipping pallet equipped with a non-structural member carrying a readable device
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
US20070013487A1 (en) * 2005-07-18 2007-01-18 Jan Scholtz Digital certificate on connectors and other products using RFID tags and/or labels as well as RFID reader/interrogator
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
US20070102486A1 (en) * 2005-10-24 2007-05-10 Checkpoint Systems, Inc. Wire embedded bridge
JP4750530B2 (ja) * 2005-10-27 2011-08-17 ルネサスエレクトロニクス株式会社 半導体集積回路装置及びそれを用いた非接触電子装置
US7621043B2 (en) * 2005-11-02 2009-11-24 Checkpoint Systems, Inc. Device for making an in-mold circuit
US7569932B2 (en) * 2005-11-18 2009-08-04 Checkpoint Systems, Inc. Rotary chip attach
GB0526452D0 (en) * 2005-12-23 2006-02-08 Hughes Thomas F A laboratory slide
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
JP2007233703A (ja) * 2006-03-01 2007-09-13 Minerva:Kk 無線タグおよびその製造方法
DE102006028827A1 (de) * 2006-06-21 2008-01-10 Dynamic Systems Gmbh Transponder mit elektronischem Speicherchip und magnetischer Ringantenne
US7506450B2 (en) * 2006-06-30 2009-03-24 The Stanley Works Adhesive mount for a leveling device and a leveling device
US20090021377A1 (en) * 2006-10-19 2009-01-22 Upm Raflatac Oy Tamperproof tag
MY159909A (en) * 2007-09-14 2017-02-15 Toppan Printing Co Ltd Antenna sheet, transponder and book form
EP2256672B1 (de) * 2008-02-22 2016-04-13 Toppan Printing Co., Ltd. Transponder und buchform
WO2010066955A1 (fr) 2008-12-11 2010-06-17 Yves Eray Circuit d'antenne rfid
US8444057B2 (en) * 2009-07-29 2013-05-21 Checkpoint Systems, Inc. Security labels with reinforced windows and methods of making the same
ES2739355T3 (es) 2010-06-14 2020-01-30 Avery Dennison Corp Producto intermedio estratificado de lámina fina y método de fabricación
FI125720B (fi) 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
US20140214687A1 (en) * 2011-07-20 2014-07-31 Horatio Nelson Huxham Cryptographic expansion device and related protocols
US10229353B2 (en) 2014-07-31 2019-03-12 3M Innovative Properties Company RFID tag on stretchable substrate
EP3175392A2 (de) 2014-07-31 2017-06-07 3M Innovative Properties Company Rfid-etikett auf einem flexiblen substrat
US10685273B2 (en) 2016-10-07 2020-06-16 Avery Dennison Retail Information Services, Llc Vibratory feeder systems for RFID elements
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce
CN109344949B (zh) * 2018-08-01 2020-06-16 浙江大学 一种天线和电路分离的防伪防盗rfid标签

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4381602A (en) * 1980-12-29 1983-05-03 Honeywell Information Systems Inc. Method of mounting an I.C. chip on a substrate
US4656463A (en) * 1983-04-21 1987-04-07 Intelli-Tech Corporation LIMIS systems, devices and methods
US4727246A (en) * 1984-08-31 1988-02-23 Casio Computer Co., Ltd. IC card
JPS61157990A (ja) * 1984-12-29 1986-07-17 Kyodo Printing Co Ltd Ｉｃカ−ド
JPH0751390B2 (ja) * 1985-07-10 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
ES2040343T3 (es) * 1987-06-08 1993-10-16 Esselte Meto International Gmbh Dispositivos magneticos.
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
JP2753746B2 (ja) * 1989-11-06 1998-05-20 日本メクトロン株式会社 Ｉｃ搭載用可撓性回路基板及びその製造法
US5103210A (en) * 1990-06-27 1992-04-07 Checkpoint Systems, Inc. Activatable/deactivatable security tag for use with an electronic security system
US5276431A (en) * 1992-04-29 1994-01-04 Checkpoint Systems, Inc. Security tag for use with article having inherent capacitance
GB9222460D0 (en) * 1992-10-26 1992-12-09 Hughes Microelectronics Europa Radio frequency baggage tag
NL9202067A (nl) * 1992-11-27 1994-06-16 Dutch A & A Trading Bv Detectielabel.
US5430441A (en) * 1993-10-12 1995-07-04 Motorola, Inc. Transponding tag and method
US5444223A (en) * 1994-01-11 1995-08-22 Blama; Michael J. Radio frequency identification tag and method
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices
US5546654A (en) * 1994-08-29 1996-08-20 General Electric Company Vacuum fixture and method for fabricating electronic assemblies
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
EP0704928A3 (de) * 1994-09-30 1998-08-05 HID Corporation HF Transpondersystem mit Parallelresonanz-Abfrage und Serienresonanz-Antwort

Also Published As

Publication number Publication date
US5708419A (en) 1998-01-13
KR980012391A (ko) 1998-04-30
MX9705524A (es) 1998-02-28
TW342582B (en) 1998-10-11
IL121087A (en) 2000-07-26
AR007853A1 (es) 1999-11-24
AU2491597A (en) 1998-01-29
AU715326B2 (en) 2000-01-20
JPH1084075A (ja) 1998-03-31
DE69738172T2 (de) 2008-07-10
KR100543349B1 (ko) 2006-06-13
EP0821406A2 (de) 1998-01-28
CA2210833C (en) 2008-01-29
CN1173735A (zh) 1998-02-18
EP0821406A3 (de) 2000-03-22
EP0821406B1 (de) 2007-10-03
JP4290233B2 (ja) 2009-07-01
JP2008165829A (ja) 2008-07-17
IL121087A0 (en) 1997-11-20
CA2210833A1 (en) 1998-01-22
ATE375004T1 (de) 2007-10-15
JP4342589B2 (ja) 2009-10-14
NZ328217A (en) 1998-03-25
CN1108634C (zh) 2003-05-14
ES2294790T3 (es) 2008-04-01

Similar Documents

Publication Publication Date Title
DE69738172D1 (de) Eine integrierte Schaltung auf einem ultrabiegsamen Substrat und ein Verfahren für eine Drahtverbindung zwischen einer integrierten Schaltung und einem ultrabiegsamen Substrat
US5089878A (en) Low impedance packaging
CA1180824A (en) Integrated circuit device having internal dampening for a plurality of power supplies
SG68074A1 (en) Method and apparatus for wire bonded package for integrated circuits
DE69729719D1 (de) Gefilterte Durchführung für implantierbare medizinische Geräte und entsprechendes Herstellungsverfahren
WO2002056245A2 (en) Radio frequency identification tag on a single layer substrate
US5309021A (en) Semiconductor device having particular power distribution interconnection arrangement
JPH02500231A (ja) 電子モジユール回路用テープの生産方法とこの方法によつて得られるテープ
US6608259B1 (en) Ground plane for a semiconductor chip
DE69533823D1 (de) Elektrische Verbindungsstruktur auf einer integrierten Schaltungsanordnung mit einem Zapfen mit vergrössertem Kopf
EP0961531A3 (de) Hochintegrierte elektronische Schaltung, insbesondere zum Einsatz in Herzschrittmachern
KR960032705A (ko) 반도체 집적회로장치
US5986886A (en) Three-dimensional flexible electronic module
DE69939692D1 (de) Herstellungsverfahren von Windungen für induktive Bauelemente, und nach diesem Verfahren hergestellte Bauelemente
EP0867939A2 (de) Verdrahtungssubstrat für Halbleiter mit externen geführten Drähten
US5177326A (en) Lead wire array for a leadless chip carrier
WO2002103789A2 (en) Electronic assembly with laterally connected capacitors and manufacturing method
GB2091035A (en) Integrated circuit device and subassembly
JPS5868996A (ja) プリント板上のモジユ−ルおよび導体路の損傷防止装置
DE29819349U1 (de) Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung
CA2327796A1 (en) Support for electronic components
WO1998028955A3 (en) Microelectric assembly fabrication with terminal formation
WO2002027338A2 (en) Device for testing contacts
GB2317751A (en) Electromagnetic structure
JPH06309523A (ja) メモリカード

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: ACKMANN MENGES PATENT- UND RECHTSANWAELTE, 80469 M

R082 Change of representative

Ref document number: 821406

Country of ref document: EP

Representative=s name: SCHUMACHER & WILLSAU PATENTANWALTSGESELLSCHAFT, DE