IL121087A - Method of wire bonding an integrated circuit to an ultraflexible substrate - Google Patents
Method of wire bonding an integrated circuit to an ultraflexible substrateInfo
- Publication number
- IL121087A IL121087A IL12108797A IL12108797A IL121087A IL 121087 A IL121087 A IL 121087A IL 12108797 A IL12108797 A IL 12108797A IL 12108797 A IL12108797 A IL 12108797A IL 121087 A IL121087 A IL 121087A
- Authority
- IL
- Israel
- Prior art keywords
- integrated circuit
- attachment area
- resonant circuit
- wire bonding
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
- G06K19/0726—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Burglar Alarm Systems (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/681,195 US5708419A (en) | 1996-07-22 | 1996-07-22 | Method of wire bonding an integrated circuit to an ultraflexible substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
IL121087A0 IL121087A0 (en) | 1997-11-20 |
IL121087A true IL121087A (en) | 2000-07-26 |
Family
ID=24734222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL12108797A IL121087A (en) | 1996-07-22 | 1997-06-16 | Method of wire bonding an integrated circuit to an ultraflexible substrate |
Country Status (15)
Country | Link |
---|---|
US (1) | US5708419A (xx) |
EP (1) | EP0821406B1 (xx) |
JP (2) | JP4290233B2 (xx) |
KR (1) | KR100543349B1 (xx) |
CN (1) | CN1108634C (xx) |
AR (1) | AR007853A1 (xx) |
AT (1) | ATE375004T1 (xx) |
AU (1) | AU715326B2 (xx) |
CA (1) | CA2210833C (xx) |
DE (1) | DE69738172T2 (xx) |
ES (1) | ES2294790T3 (xx) |
IL (1) | IL121087A (xx) |
MX (1) | MX9705524A (xx) |
NZ (1) | NZ328217A (xx) |
TW (1) | TW342582B (xx) |
Families Citing this family (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7158031B2 (en) | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
US6075441A (en) | 1996-09-05 | 2000-06-13 | Key-Trak, Inc. | Inventoriable-object control and tracking system |
US6157870A (en) * | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
US6077022A (en) * | 1997-02-18 | 2000-06-20 | Zevatech Trading Ag | Placement machine and a method to control a placement machine |
US6181287B1 (en) * | 1997-03-10 | 2001-01-30 | Precision Dynamics Corporation | Reactively coupled elements in circuits on flexible substrates |
US6980085B1 (en) | 1997-08-18 | 2005-12-27 | Micron Technology, Inc. | Wireless communication devices and methods of forming and operating the same |
US6339385B1 (en) * | 1997-08-20 | 2002-01-15 | Micron Technology, Inc. | Electronic communication devices, methods of forming electrical communication devices, and communication methods |
DE59811823D1 (de) * | 1997-09-05 | 2004-09-23 | Esec Trading Sa | Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat |
US5982284A (en) * | 1997-09-19 | 1999-11-09 | Avery Dennison Corporation | Tag or label with laminated thin, flat, flexible device |
US5861809A (en) * | 1997-09-22 | 1999-01-19 | Checkpoint Systems, Inc. | Deactivateable resonant circuit |
US6164551A (en) * | 1997-10-29 | 2000-12-26 | Meto International Gmbh | Radio frequency identification transponder having non-encapsulated IC chip |
DE59711263D1 (de) | 1997-10-30 | 2004-03-04 | Esec Trading Sa | Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial |
US7035818B1 (en) * | 1997-11-21 | 2006-04-25 | Symbol Technologies, Inc. | System and method for electronic inventory |
US7844505B1 (en) | 1997-11-21 | 2010-11-30 | Symbol Technologies, Inc. | Automated real-time distributed tag reader network |
EP0958663A1 (en) * | 1997-12-05 | 1999-11-24 | Koninklijke Philips Electronics N.V. | Identification transponder |
EP0923111B1 (de) | 1997-12-07 | 2007-05-02 | Oerlikon Assembly Equipment AG, Steinhausen | Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer |
US6249227B1 (en) * | 1998-01-05 | 2001-06-19 | Intermec Ip Corp. | RFID integrated in electronic assets |
US6031242A (en) * | 1998-01-23 | 2000-02-29 | Zevatech, Inc. | Semiconductor die in-flight registration and orientation method and apparatus |
SG71189A1 (en) * | 1998-01-26 | 2000-03-21 | Esec Sa | Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder |
CA2343411C (en) | 1998-09-11 | 2002-11-12 | Key-Trak, Inc. | Object carriers for an object control and tracking system |
CA2343412A1 (en) * | 1998-09-11 | 2000-03-23 | William C. Maloney | Object control and tracking system with zonal transition detection |
WO2000016284A1 (en) | 1998-09-11 | 2000-03-23 | Key-Trak, Inc. | Tamper detection and prevention for an object control and tracking system |
WO2000016281A1 (en) | 1998-09-11 | 2000-03-23 | Key-Trak, Inc. | Mobile object tracking system |
US6891473B2 (en) * | 1998-09-11 | 2005-05-10 | Key-Trak, Inc. | Object carriers and lighted tags for an object control and tracking system |
US6204764B1 (en) * | 1998-09-11 | 2001-03-20 | Key-Trak, Inc. | Object tracking system with non-contact object detection and identification |
US6630370B2 (en) | 1998-10-02 | 2003-10-07 | Shinko Electric Industries Co., Ltd. | Process for manufacturing IC card |
US6114962A (en) * | 1998-10-15 | 2000-09-05 | Intermec Ip Corp. | RF tag having strain relieved stiff substrate and hydrostatic protection for a chip mounted thereto |
FR2785072B1 (fr) * | 1998-10-23 | 2001-01-19 | St Microelectronics Sa | Circuit electronique autocollant |
US6226619B1 (en) * | 1998-10-29 | 2001-05-01 | International Business Machines Corporation | Method and system for preventing counterfeiting of high price wholesale and retail items |
DE19850353C1 (de) * | 1998-11-02 | 2000-03-16 | David Finn | Identifikationslabel sowie Verfahren zur Herstellung eines Indentifikationslabels |
US6163260A (en) * | 1998-12-10 | 2000-12-19 | Intermec Ip Corp. | Linerless label tracking system |
US6091607A (en) * | 1998-12-10 | 2000-07-18 | Checkpoint Systems, Inc. | Resonant tag with a conductive composition closing an electrical circuit |
US6262692B1 (en) * | 1999-01-13 | 2001-07-17 | Brady Worldwide, Inc. | Laminate RFID label and method of manufacture |
US6468638B2 (en) * | 1999-03-16 | 2002-10-22 | Alien Technology Corporation | Web process interconnect in electronic assemblies |
US8585852B2 (en) * | 1999-06-16 | 2013-11-19 | Vanguard Identification Systems, Inc. | Methods of making printed planar radio frequency identification elements |
US8654018B2 (en) * | 2005-04-06 | 2014-02-18 | Vanguard Identificaiton Systems, Inc. | Printed planar RFID element wristbands and like personal identification devices |
US8636220B2 (en) * | 2006-12-29 | 2014-01-28 | Vanguard Identification Systems, Inc. | Printed planar RFID element wristbands and like personal identification devices |
JP2001043336A (ja) * | 1999-07-29 | 2001-02-16 | Sony Chem Corp | Icカード |
US6147662A (en) * | 1999-09-10 | 2000-11-14 | Moore North America, Inc. | Radio frequency identification tags and labels |
US6509217B1 (en) | 1999-10-22 | 2003-01-21 | Damoder Reddy | Inexpensive, reliable, planar RFID tag structure and method for making same |
US6522308B1 (en) * | 2000-01-03 | 2003-02-18 | Ask S.A. | Variable capacitance coupling antenna |
US6888509B2 (en) * | 2000-03-21 | 2005-05-03 | Mikoh Corporation | Tamper indicating radio frequency identification label |
JP2003529163A (ja) * | 2000-03-28 | 2003-09-30 | ルカトロン アーゲー | 共振周波数を調整する部材を有するrfidラベル |
GB2361584A (en) * | 2000-04-19 | 2001-10-24 | Motorola Israel Ltd | Multi-band antenna and switch system |
DE60133378T2 (de) | 2000-04-20 | 2009-01-08 | Cogiscan Inc., Bromont | Automatisches herstellungssteuerungssystem |
WO2002013135A2 (en) | 2000-08-04 | 2002-02-14 | Hei, Inc. | Structures and assembly methods for radio-frequency-identification modules |
US6714136B1 (en) * | 2000-08-14 | 2004-03-30 | Computime, Ltd. | Alarm clock with remote control function |
KR100367301B1 (ko) * | 2000-10-09 | 2003-01-09 | (주)이.씨테크날리지 | 비접촉식 카드모듈의 제조방법 및 그 장치 |
US6606247B2 (en) * | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
US6693541B2 (en) | 2001-07-19 | 2004-02-17 | 3M Innovative Properties Co | RFID tag with bridge circuit assembly and methods of use |
US7190083B1 (en) | 2002-01-07 | 2007-03-13 | Vixs Systems, Inc. | High frequency integrated circuit using capacitive bonding |
US7214569B2 (en) * | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
US6777829B2 (en) * | 2002-03-13 | 2004-08-17 | Celis Semiconductor Corporation | Rectifier utilizing a grounded antenna |
DE10232007A1 (de) * | 2002-07-15 | 2004-02-19 | Giesecke & Devrient Gmbh | Transponder für flachstückartig ausgebildete Artikel |
GB2395628B (en) * | 2002-11-21 | 2006-05-10 | Hewlett Packard Co | Memory tag |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
US8574961B2 (en) * | 2003-04-29 | 2013-11-05 | Semiconductor Components Industries, Llc | Method of marking a low profile packaged semiconductor device |
DE602004015586D1 (de) | 2003-05-01 | 2008-09-18 | Checkpoint Systems Inc | Lc resonanzschaltkreis mit verstärkungskomponente |
JP2005129900A (ja) * | 2003-09-30 | 2005-05-19 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
US7384496B2 (en) * | 2004-02-23 | 2008-06-10 | Checkpoint Systems, Inc. | Security tag system for fabricating a tag including an integrated surface processing system |
US7119685B2 (en) * | 2004-02-23 | 2006-10-10 | Checkpoint Systems, Inc. | Method for aligning capacitor plates in a security tag and a capacitor formed thereby |
US7704346B2 (en) | 2004-02-23 | 2010-04-27 | Checkpoint Systems, Inc. | Method of fabricating a security tag in an integrated surface processing system |
US7138919B2 (en) * | 2004-02-23 | 2006-11-21 | Checkpoint Systems, Inc. | Identification marking and method for applying the identification marking to an item |
US7116227B2 (en) * | 2004-02-23 | 2006-10-03 | Checkpoint Systems, Inc. | Tag having patterned circuit elements and a process for making same |
US8099335B2 (en) * | 2004-02-23 | 2012-01-17 | Checkpoint Systems, Inc. | Method and system for determining billing information in a tag fabrication process |
TWI288885B (en) * | 2004-06-24 | 2007-10-21 | Checkpoint Systems Inc | Die attach area cut-on-fly method and apparatus |
EP1950791B1 (en) | 2004-06-24 | 2009-02-11 | Checkpoint Systems, Inc. | Bonding machine for applying transponders and method |
US20060055531A1 (en) * | 2004-09-14 | 2006-03-16 | Honeywell International, Inc. | Combined RF tag and SAW sensor |
CA2582382A1 (en) * | 2004-10-07 | 2006-04-20 | West Pharmaceutical Services, Inc. | Closure for a container |
US7615479B1 (en) * | 2004-11-08 | 2009-11-10 | Alien Technology Corporation | Assembly comprising functional block deposited therein |
US7353598B2 (en) | 2004-11-08 | 2008-04-08 | Alien Technology Corporation | Assembly comprising functional devices and method of making same |
US7551141B1 (en) | 2004-11-08 | 2009-06-23 | Alien Technology Corporation | RFID strap capacitively coupled and method of making same |
JP3915927B2 (ja) * | 2004-11-18 | 2007-05-16 | セイコーエプソン株式会社 | 電子部品及びその製造方法 |
US20060109130A1 (en) * | 2004-11-22 | 2006-05-25 | Hattick John B | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US7385284B2 (en) * | 2004-11-22 | 2008-06-10 | Alien Technology Corporation | Transponder incorporated into an electronic device |
CN100369932C (zh) * | 2005-04-07 | 2008-02-20 | 苏州大学 | 抗人cd154单克隆抗体及其应用 |
US9114187B2 (en) * | 2005-04-28 | 2015-08-25 | Zih Corp. | Antimicrobial coating for identification devices |
US7347148B2 (en) * | 2005-05-11 | 2008-03-25 | Hunter Paine Enterprises, Llc | Shipping pallet equipped with a non-structural member carrying a readable device |
US7542301B1 (en) | 2005-06-22 | 2009-06-02 | Alien Technology Corporation | Creating recessed regions in a substrate and assemblies having such recessed regions |
US20070013487A1 (en) * | 2005-07-18 | 2007-01-18 | Jan Scholtz | Digital certificate on connectors and other products using RFID tags and/or labels as well as RFID reader/interrogator |
US20070031992A1 (en) * | 2005-08-05 | 2007-02-08 | Schatz Kenneth D | Apparatuses and methods facilitating functional block deposition |
US20070102486A1 (en) * | 2005-10-24 | 2007-05-10 | Checkpoint Systems, Inc. | Wire embedded bridge |
JP4750530B2 (ja) * | 2005-10-27 | 2011-08-17 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置及びそれを用いた非接触電子装置 |
US7621043B2 (en) * | 2005-11-02 | 2009-11-24 | Checkpoint Systems, Inc. | Device for making an in-mold circuit |
US7569932B2 (en) * | 2005-11-18 | 2009-08-04 | Checkpoint Systems, Inc. | Rotary chip attach |
GB0526452D0 (en) * | 2005-12-23 | 2006-02-08 | Hughes Thomas F | A laboratory slide |
US8786510B2 (en) * | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
JP2007233703A (ja) * | 2006-03-01 | 2007-09-13 | Minerva:Kk | 無線タグおよびその製造方法 |
DE102006028827A1 (de) * | 2006-06-21 | 2008-01-10 | Dynamic Systems Gmbh | Transponder mit elektronischem Speicherchip und magnetischer Ringantenne |
US7506450B2 (en) * | 2006-06-30 | 2009-03-24 | The Stanley Works | Adhesive mount for a leveling device and a leveling device |
US20090021377A1 (en) * | 2006-10-19 | 2009-01-22 | Upm Raflatac Oy | Tamperproof tag |
US8519905B2 (en) * | 2007-09-14 | 2013-08-27 | Toppan Printing Co., Ltd. | Antenna sheet, transponder, and booklet |
EP2256672B1 (en) * | 2008-02-22 | 2016-04-13 | Toppan Printing Co., Ltd. | Transponder and book form |
WO2010066955A1 (fr) | 2008-12-11 | 2010-06-17 | Yves Eray | Circuit d'antenne rfid |
US8444057B2 (en) * | 2009-07-29 | 2013-05-21 | Checkpoint Systems, Inc. | Security labels with reinforced windows and methods of making the same |
BR112012031670B8 (pt) | 2010-06-14 | 2023-01-24 | Avery Dennison Corp | Método de fabricação de uma trama de estruturas condutoras |
FI125720B (fi) | 2011-05-19 | 2016-01-29 | Tecnomar Oy | Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä |
US8909556B2 (en) | 2011-07-20 | 2014-12-09 | Visa International Service Association | Security gateway communication |
US10229353B2 (en) | 2014-07-31 | 2019-03-12 | 3M Innovative Properties Company | RFID tag on stretchable substrate |
WO2016018777A2 (en) | 2014-07-31 | 2016-02-04 | 3M Innovative Properties Company | Rfid tag on flexible substrate |
US10685273B2 (en) | 2016-10-07 | 2020-06-16 | Avery Dennison Retail Information Services, Llc | Vibratory feeder systems for RFID elements |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
CN109344949B (zh) * | 2018-08-01 | 2020-06-16 | 浙江大学 | 一种天线和电路分离的防伪防盗rfid标签 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4381602A (en) * | 1980-12-29 | 1983-05-03 | Honeywell Information Systems Inc. | Method of mounting an I.C. chip on a substrate |
US4656463A (en) * | 1983-04-21 | 1987-04-07 | Intelli-Tech Corporation | LIMIS systems, devices and methods |
US4727246A (en) * | 1984-08-31 | 1988-02-23 | Casio Computer Co., Ltd. | IC card |
JPS61157990A (ja) * | 1984-12-29 | 1986-07-17 | Kyodo Printing Co Ltd | Icカ−ド |
JPH0751390B2 (ja) * | 1985-07-10 | 1995-06-05 | カシオ計算機株式会社 | Icカ−ド |
US4857893A (en) * | 1986-07-18 | 1989-08-15 | Bi Inc. | Single chip transponder device |
DE3880202T2 (de) * | 1987-06-08 | 1993-08-05 | Esselte Meto Int Gmbh | Magnetische vorrichtungen. |
US5304513A (en) * | 1987-07-16 | 1994-04-19 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame |
JP2753746B2 (ja) * | 1989-11-06 | 1998-05-20 | 日本メクトロン株式会社 | Ic搭載用可撓性回路基板及びその製造法 |
US5103210A (en) * | 1990-06-27 | 1992-04-07 | Checkpoint Systems, Inc. | Activatable/deactivatable security tag for use with an electronic security system |
US5276431A (en) * | 1992-04-29 | 1994-01-04 | Checkpoint Systems, Inc. | Security tag for use with article having inherent capacitance |
GB9222460D0 (en) * | 1992-10-26 | 1992-12-09 | Hughes Microelectronics Europa | Radio frequency baggage tag |
NL9202067A (nl) * | 1992-11-27 | 1994-06-16 | Dutch A & A Trading Bv | Detectielabel. |
US5430441A (en) * | 1993-10-12 | 1995-07-04 | Motorola, Inc. | Transponding tag and method |
US5444223A (en) * | 1994-01-11 | 1995-08-22 | Blama; Michael J. | Radio frequency identification tag and method |
US5519201A (en) * | 1994-04-29 | 1996-05-21 | Us3, Inc. | Electrical interconnection for structure including electronic and/or electromagnetic devices |
US5546654A (en) * | 1994-08-29 | 1996-08-20 | General Electric Company | Vacuum fixture and method for fabricating electronic assemblies |
US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
EP0704928A3 (en) * | 1994-09-30 | 1998-08-05 | HID Corporation | RF transponder system with parallel resonant interrogation and series resonant response |
-
1996
- 1996-07-22 US US08/681,195 patent/US5708419A/en not_active Expired - Lifetime
-
1997
- 1997-06-16 AU AU24915/97A patent/AU715326B2/en not_active Ceased
- 1997-06-16 IL IL12108797A patent/IL121087A/xx not_active IP Right Cessation
- 1997-07-01 NZ NZ328217A patent/NZ328217A/en unknown
- 1997-07-03 CN CN97111895A patent/CN1108634C/zh not_active Expired - Lifetime
- 1997-07-10 TW TW086109739A patent/TW342582B/zh not_active IP Right Cessation
- 1997-07-11 AR ARP970103099 patent/AR007853A1/es not_active Application Discontinuation
- 1997-07-18 CA CA 2210833 patent/CA2210833C/en not_active Expired - Fee Related
- 1997-07-21 ES ES97112463T patent/ES2294790T3/es not_active Expired - Lifetime
- 1997-07-21 DE DE1997638172 patent/DE69738172T2/de not_active Expired - Lifetime
- 1997-07-21 MX MX9705524A patent/MX9705524A/es unknown
- 1997-07-21 AT AT97112463T patent/ATE375004T1/de not_active IP Right Cessation
- 1997-07-21 EP EP19970112463 patent/EP0821406B1/en not_active Expired - Lifetime
- 1997-07-22 JP JP19540397A patent/JP4290233B2/ja not_active Expired - Fee Related
- 1997-07-22 KR KR1019970035517A patent/KR100543349B1/ko not_active IP Right Cessation
-
2008
- 2008-03-10 JP JP2008059376A patent/JP4342589B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH1084075A (ja) | 1998-03-31 |
EP0821406A3 (en) | 2000-03-22 |
JP4342589B2 (ja) | 2009-10-14 |
CN1173735A (zh) | 1998-02-18 |
ATE375004T1 (de) | 2007-10-15 |
KR100543349B1 (ko) | 2006-06-13 |
JP4290233B2 (ja) | 2009-07-01 |
MX9705524A (es) | 1998-02-28 |
US5708419A (en) | 1998-01-13 |
CN1108634C (zh) | 2003-05-14 |
ES2294790T3 (es) | 2008-04-01 |
AR007853A1 (es) | 1999-11-24 |
EP0821406B1 (en) | 2007-10-03 |
JP2008165829A (ja) | 2008-07-17 |
EP0821406A2 (en) | 1998-01-28 |
CA2210833C (en) | 2008-01-29 |
DE69738172T2 (de) | 2008-07-10 |
CA2210833A1 (en) | 1998-01-22 |
TW342582B (en) | 1998-10-11 |
AU715326B2 (en) | 2000-01-20 |
KR980012391A (ko) | 1998-04-30 |
AU2491597A (en) | 1998-01-29 |
IL121087A0 (en) | 1997-11-20 |
DE69738172D1 (de) | 2007-11-15 |
NZ328217A (en) | 1998-03-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL121087A (en) | Method of wire bonding an integrated circuit to an ultraflexible substrate | |
SG68074A1 (en) | Method and apparatus for wire bonded package for integrated circuits | |
DE69527473D1 (de) | Halbleiteranordnung bestehend aus einem Halbleiterchip, der mittels Kontakthöckern auf der Leiterplatte verbunden ist und Montageverfahren | |
CA2343397A1 (en) | Radio frequency identification tag apparatus and related method | |
MY117368A (en) | A resistor and its manufacturing method | |
EP0827191A3 (en) | Semiconductor device mounting structure | |
EP0917189A4 (en) | METHOD FOR MOUNTING AN ENCAPSULATED BODY ON AN OPTICAL BOARD AND CONVERTER | |
WO2002063688A1 (fr) | Dispositif a circuit integre hybride, son procede de fabrication et dispositif electronique | |
CA2117239A1 (en) | Capacitor Mounting Structure for Printed Circuit Boards | |
GB2140205B (en) | Integrated circuit module and method of making same | |
EP0952545A4 (en) | INTEGRATED CIRCUIT CARD | |
CA2266158A1 (en) | Connecting devices and method for interconnecting circuit components | |
US5986886A (en) | Three-dimensional flexible electronic module | |
EP1096516A3 (en) | Low profile inductive component | |
CA2095609A1 (en) | Leadless pad array chip carrier | |
EP0817266A3 (en) | Mounting structure for an integrated circuit | |
EP0743716A3 (de) | Elektronisches Bauteil für Oberflächenmontage (SMT) | |
EP1041618A4 (en) | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT | |
GB2261121A (en) | Electrical interconnect apparatus | |
CA2180164A1 (en) | Component-Module-Adapted Oscillating Circuit Arrangement | |
GB9420191D0 (en) | Electronic circuit packaging | |
WO1998028955A3 (en) | Microelectric assembly fabrication with terminal formation | |
EP0859411A3 (en) | Semiconducor device of surface-mount type, circuit board having such a semiconductor device mounted thereon, and method of producing such a semiconductor device | |
GB9313750D0 (en) | A card | |
JP3259217B2 (ja) | ノイズ低減パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
MM9K | Patent not in force due to non-payment of renewal fees |