DE69734582D1 - Druckempfindlicher klebstoff mit ausgezeichneter wärmebeständigkeit und wärmeleitfähigkeit, klebstoffschichten und verfahren zur sicherung von elektronischen komponenten gegen wärmeausstrahlende komponenten unter verwendung desselben - Google Patents
Druckempfindlicher klebstoff mit ausgezeichneter wärmebeständigkeit und wärmeleitfähigkeit, klebstoffschichten und verfahren zur sicherung von elektronischen komponenten gegen wärmeausstrahlende komponenten unter verwendung desselbenInfo
- Publication number
- DE69734582D1 DE69734582D1 DE69734582T DE69734582T DE69734582D1 DE 69734582 D1 DE69734582 D1 DE 69734582D1 DE 69734582 T DE69734582 T DE 69734582T DE 69734582 T DE69734582 T DE 69734582T DE 69734582 D1 DE69734582 D1 DE 69734582D1
- Authority
- DE
- Germany
- Prior art keywords
- heat
- conductivity
- resistant
- pressure
- sensitive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
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- H—ELECTRICITY
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00013—Fully indexed content
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/19043—Component type being a resistor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8136248A JP2793559B2 (ja) | 1996-05-30 | 1996-05-30 | 耐熱性および熱伝導性にすぐれた感圧性接着剤とその接着シ―ト類およびこれらを用いた電子部品と放熱部材との固定方法 |
JP13624896 | 1996-05-30 | ||
PCT/JP1997/001812 WO1997045499A1 (fr) | 1996-05-30 | 1997-05-28 | Adhesif autocollant tres resistant a la chaleur et excellent conducteur thermique, feuilles adhesives, et procede de fixation de composants electroniques a des elements thermoradiants l'utilisant |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69734582D1 true DE69734582D1 (de) | 2005-12-15 |
DE69734582T2 DE69734582T2 (de) | 2006-05-24 |
Family
ID=15170756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69734582T Expired - Fee Related DE69734582T2 (de) | 1996-05-30 | 1997-05-28 | Druckempfindlicher klebstoff mit ausgezeichneter wärmebeständigkeit und wärmeleitfähigkeit, klebstoffschichten und verfahren zur sicherung von elektronischen komponenten gegen wärmeausstrahlende komponenten unter verwendung desselben |
Country Status (8)
Country | Link |
---|---|
US (1) | US6162319A (de) |
EP (1) | EP0903386B1 (de) |
JP (1) | JP2793559B2 (de) |
CN (1) | CN1089790C (de) |
DE (1) | DE69734582T2 (de) |
MY (1) | MY116904A (de) |
TW (1) | TW473534B (de) |
WO (1) | WO1997045499A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000057373A (ko) * | 1996-12-04 | 2000-09-15 | 가마이 고로 | 열 전도성 감압 접착제, 이의 접착 시트류 및 이를 사용한 전자부품과 방열 부재와의 고정방법 |
JPH11199841A (ja) * | 1998-01-19 | 1999-07-27 | Nitto Denko Corp | 半導体装置用接着シ―ト類と面実装型半導体装置 |
JP2000303046A (ja) * | 1999-04-20 | 2000-10-31 | Nitto Denko Corp | ポリエステルフイルム接着用のアクリル系感圧性接着剤組成物とその接着シ―ト類 |
JP5135494B2 (ja) * | 1999-12-22 | 2013-02-06 | 綜研化学株式会社 | アクリル系粘着テープおよびその製造方法 |
KR20010078953A (ko) * | 2001-05-25 | 2001-08-22 | 이장우 | 방열쉬트 |
JP3880418B2 (ja) | 2002-02-21 | 2007-02-14 | 日東電工株式会社 | 両面粘着シートおよびタッチパネルの表示装置への貼着固定方法 |
JP4385573B2 (ja) * | 2002-07-31 | 2009-12-16 | Dic株式会社 | 熱伝導電気絶縁感圧接着剤用組成物、およびこれを用いた粘着シート |
JP4009224B2 (ja) * | 2003-05-19 | 2007-11-14 | 株式会社日本触媒 | 放熱材料用樹脂組成物 |
WO2005034236A1 (de) * | 2003-09-29 | 2005-04-14 | Siemens Aktiengesellschaft | Plastisch verformbarer kühlkörper für elektrische und/ oder elektronische bauelemente |
JP4646508B2 (ja) * | 2003-10-01 | 2011-03-09 | 日東電工株式会社 | 両面接着テープ又はシートおよびその製造方法 |
KR101009084B1 (ko) * | 2003-11-07 | 2011-01-18 | 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 | 중합성 조성물 및 (메타)아크릴계 열전도 시트의 제조 방법 |
CN100357366C (zh) * | 2003-12-19 | 2007-12-26 | 中国印钞造币总公司 | 表面涂层组合物 |
JP4749061B2 (ja) * | 2005-07-13 | 2011-08-17 | 日東電工株式会社 | 反射性及び/又は遮光性を有する粘着テープ又はシート |
CN102942883B (zh) * | 2006-04-26 | 2015-08-26 | 日立化成株式会社 | 粘接带及使用其的太阳能电池模块 |
US20100073882A1 (en) * | 2006-11-01 | 2010-03-25 | Tooru Yoshikawa | Thermally conductive sheet, process for producing the same, and radiator utilizing thermally conductive sheet |
DE102008049849A1 (de) * | 2008-10-01 | 2010-04-08 | Tesa Se | Wärmeleitungszusammensetzung |
CN102858896A (zh) * | 2010-05-19 | 2013-01-02 | 日东电工株式会社 | 导热性粘合片 |
JP2011241328A (ja) * | 2010-05-19 | 2011-12-01 | Nitto Denko Corp | 熱伝導性粘着シート |
JP2011241329A (ja) * | 2010-05-19 | 2011-12-01 | Nitto Denko Corp | 熱伝導性粘着シート |
JP5501264B2 (ja) * | 2011-02-10 | 2014-05-21 | 日東電工株式会社 | 反射性及び/又は遮光性を有する粘着テープ又はシート |
CN102555341B (zh) * | 2011-02-25 | 2015-03-18 | 北京国科世纪激光技术有限公司 | 导热界面装置 |
WO2013061830A1 (ja) * | 2011-10-28 | 2013-05-02 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品 |
KR101324376B1 (ko) * | 2012-07-19 | 2013-11-01 | 박상열 | Led 디스플레이 방열용 혼합조성물 |
CN102775930A (zh) * | 2012-07-27 | 2012-11-14 | 昆山旭虹精密零组件有限公司 | 一种用于汽车灯的导热压敏胶带 |
JP6048219B2 (ja) * | 2013-02-28 | 2016-12-21 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子機器 |
KR20170042651A (ko) * | 2014-08-18 | 2017-04-19 | 애버리 데니슨 코포레이션 | 접착 테이프 및 히트 스프레더 어셈블리 |
JP2017045877A (ja) | 2015-08-27 | 2017-03-02 | ファナック株式会社 | 部品の脱落検出が可能なプリント基板および脱落検出回路 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US3692679A (en) * | 1970-06-18 | 1972-09-19 | Ethyl Corp | Stabilized organic material |
US4379201A (en) * | 1981-03-30 | 1983-04-05 | Minnesota Mining And Manufacturing Company | Multiacrylate cross-linking agents in pressure-sensitive photoadhesives |
US4869879A (en) * | 1982-03-25 | 1989-09-26 | Ashland Oil, Inc. | Vented riser for stripping spent catalyst |
AU565919B2 (en) * | 1983-06-13 | 1987-10-01 | Minnesota Mining And Manufacturing Company | Electrically and thermally conductive adhesive transfer tape |
US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
US4714655A (en) * | 1985-10-04 | 1987-12-22 | Avery International Corporation | Pressure-sensitive adhesive containing heat-sensitive materials, and method of making the same |
US4908296A (en) * | 1988-05-31 | 1990-03-13 | E. I. Du Pont De Nemours And Company | Photosensitive semi-aqueous developable ceramic coating composition |
DE3923023A1 (de) * | 1989-07-12 | 1991-01-24 | Siemens Ag | Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
JP2922036B2 (ja) * | 1991-10-31 | 1999-07-19 | 日東電工株式会社 | 耐熱性にすぐれた感圧性接着剤およびその接着シート類の製造方法 |
JP3040032B2 (ja) * | 1992-03-27 | 2000-05-08 | 日東電工株式会社 | 耐熱性にすぐれた感圧性接着剤およびその接着シ―ト類とこれらの製造方法 |
CA2093191A1 (en) * | 1992-04-15 | 1993-10-16 | Richard J. Webb | Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa |
-
1996
- 1996-05-30 JP JP8136248A patent/JP2793559B2/ja not_active Expired - Lifetime
-
1997
- 1997-05-28 MY MYPI97002324A patent/MY116904A/en unknown
- 1997-05-28 US US09/194,180 patent/US6162319A/en not_active Expired - Lifetime
- 1997-05-28 EP EP97924241A patent/EP0903386B1/de not_active Expired - Lifetime
- 1997-05-28 CN CN97196909A patent/CN1089790C/zh not_active Expired - Fee Related
- 1997-05-28 DE DE69734582T patent/DE69734582T2/de not_active Expired - Fee Related
- 1997-05-28 WO PCT/JP1997/001812 patent/WO1997045499A1/ja active IP Right Grant
- 1997-05-29 TW TW086107297A patent/TW473534B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6162319A (en) | 2000-12-19 |
WO1997045499A1 (fr) | 1997-12-04 |
CN1226914A (zh) | 1999-08-25 |
EP0903386A1 (de) | 1999-03-24 |
MY116904A (en) | 2004-04-30 |
JPH09316388A (ja) | 1997-12-09 |
TW473534B (en) | 2002-01-21 |
DE69734582T2 (de) | 2006-05-24 |
JP2793559B2 (ja) | 1998-09-03 |
EP0903386B1 (de) | 2005-11-09 |
EP0903386A4 (de) | 2001-01-10 |
CN1089790C (zh) | 2002-08-28 |
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