DE69733102D1 - Reinigungsmittel - Google Patents
ReinigungsmittelInfo
- Publication number
- DE69733102D1 DE69733102D1 DE69733102T DE69733102T DE69733102D1 DE 69733102 D1 DE69733102 D1 DE 69733102D1 DE 69733102 T DE69733102 T DE 69733102T DE 69733102 T DE69733102 T DE 69733102T DE 69733102 D1 DE69733102 D1 DE 69733102D1
- Authority
- DE
- Germany
- Prior art keywords
- cleaning supplies
- supplies
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/264—Aldehydes; Ketones; Acetals or ketals
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16535396 | 1996-06-05 | ||
JP16535396 | 1996-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69733102D1 true DE69733102D1 (de) | 2005-06-02 |
DE69733102T2 DE69733102T2 (de) | 2006-03-02 |
Family
ID=15810758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69733102T Expired - Lifetime DE69733102T2 (de) | 1996-06-05 | 1997-06-03 | Reinigungsmittel |
Country Status (5)
Country | Link |
---|---|
US (2) | US6143705A (de) |
EP (1) | EP0812011B1 (de) |
KR (1) | KR100322392B1 (de) |
DE (1) | DE69733102T2 (de) |
TW (1) | TW416987B (de) |
Families Citing this family (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6896826B2 (en) | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
US6755989B2 (en) | 1997-01-09 | 2004-06-29 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
WO1998030667A1 (en) * | 1997-01-09 | 1998-07-16 | Advanced Technology Materials, Inc. | Semiconductor wafer cleaning composition and method with aqueous ammonium fluoride and amine |
TW387936B (en) * | 1997-08-12 | 2000-04-21 | Kanto Kagaku | Washing solution |
US5977041A (en) * | 1997-09-23 | 1999-11-02 | Olin Microelectronic Chemicals | Aqueous rinsing composition |
US6165956A (en) * | 1997-10-21 | 2000-12-26 | Lam Research Corporation | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
US6303551B1 (en) | 1997-10-21 | 2001-10-16 | Lam Research Corporation | Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film |
US6479443B1 (en) | 1997-10-21 | 2002-11-12 | Lam Research Corporation | Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film |
US6593282B1 (en) | 1997-10-21 | 2003-07-15 | Lam Research Corporation | Cleaning solutions for semiconductor substrates after polishing of copper film |
JP3039493B2 (ja) * | 1997-11-28 | 2000-05-08 | 日本電気株式会社 | 基板の洗浄方法及び洗浄溶液 |
DE19758533B4 (de) * | 1997-12-04 | 2005-09-29 | Micronas Gmbh | Verfahren zum Strukturieren einer Oberflächenschicht |
US6231677B1 (en) * | 1998-02-27 | 2001-05-15 | Kanto Kagaku Kabushiki Kaisha | Photoresist stripping liquid composition |
KR100532380B1 (ko) * | 1998-05-12 | 2006-01-27 | 삼성전자주식회사 | 반도체장치의 세정방법 |
JP3003684B1 (ja) | 1998-09-07 | 2000-01-31 | 日本電気株式会社 | 基板洗浄方法および基板洗浄液 |
JP3279532B2 (ja) * | 1998-11-06 | 2002-04-30 | 日本電気株式会社 | 半導体装置の製造方法 |
ES2249925T3 (es) * | 1998-12-04 | 2006-04-01 | The Farrow System Limited | Procedimiento para eliminar un revestimiento de una superficie. |
JP4224652B2 (ja) * | 1999-03-08 | 2009-02-18 | 三菱瓦斯化学株式会社 | レジスト剥離液およびそれを用いたレジストの剥離方法 |
US6358847B1 (en) | 1999-03-31 | 2002-03-19 | Lam Research Corporation | Method for enabling conventional wire bonding to copper-based bond pad features |
JP4516176B2 (ja) * | 1999-04-20 | 2010-08-04 | 関東化学株式会社 | 電子材料用基板洗浄液 |
US6562726B1 (en) * | 1999-06-29 | 2003-05-13 | Micron Technology, Inc. | Acid blend for removing etch residue |
US6395693B1 (en) | 1999-09-27 | 2002-05-28 | Cabot Microelectronics Corporation | Cleaning solution for semiconductor surfaces following chemical-mechanical polishing |
US6537381B1 (en) | 1999-09-29 | 2003-03-25 | Lam Research Corporation | Method for cleaning and treating a semiconductor wafer after chemical mechanical polishing |
US6194366B1 (en) * | 1999-11-16 | 2001-02-27 | Esc, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
US6592433B2 (en) * | 1999-12-31 | 2003-07-15 | Intel Corporation | Method for defect reduction |
JP3645144B2 (ja) * | 2000-02-24 | 2005-05-11 | Necエレクトロニクス株式会社 | 半導体装置の製造方法 |
AU2001241190A1 (en) * | 2000-03-21 | 2001-10-03 | Wako Pure Chemical Industries, Ltd. | Semiconductor wafer cleaning agent and cleaning method |
US6486108B1 (en) * | 2000-05-31 | 2002-11-26 | Micron Technology, Inc. | Cleaning composition useful in semiconductor integrated circuit fabrication |
DE60115909T2 (de) | 2000-06-16 | 2006-09-07 | Kao Corp. | Reinigungsmittelzusammensetzung |
DE60044470D1 (de) * | 2000-06-23 | 2010-07-08 | Fujitsu Ltd | Verfahren zur herstellung eines halbleiterelement |
US6762132B1 (en) * | 2000-08-31 | 2004-07-13 | Micron Technology, Inc. | Compositions for dissolution of low-K dielectric films, and methods of use |
JP4661005B2 (ja) * | 2000-09-05 | 2011-03-30 | 和光純薬工業株式会社 | Ti系膜用エッチング剤及びエッチング方法 |
JP2002114993A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄剤及び洗浄方法 |
JP2002113431A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄方法 |
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US6627546B2 (en) | 2001-06-29 | 2003-09-30 | Ashland Inc. | Process for removing contaminant from a surface and composition useful therefor |
US6705926B2 (en) * | 2001-10-24 | 2004-03-16 | Cabot Microelectronics Corporation | Boron-containing polishing system and method |
EP1335016A1 (de) * | 2002-02-06 | 2003-08-13 | Shipley Company LLC | Reinigungszusammensetzung |
TWI339680B (en) * | 2002-02-19 | 2011-04-01 | Kanto Kagaku | Washing liquid composition for semiconductor substrate |
EP1501916B1 (de) * | 2002-04-25 | 2009-06-17 | FujiFilm Electronic Materials USA, Inc. | Nicht korrodierende reinigungsmittel zur entfernung von ätzmittelrückständen |
JP4221191B2 (ja) * | 2002-05-16 | 2009-02-12 | 関東化学株式会社 | Cmp後洗浄液組成物 |
US20060166846A1 (en) * | 2002-08-19 | 2006-07-27 | Ying-Hao Li | Remover solution |
EP1567633B1 (de) * | 2002-11-05 | 2011-08-24 | Basf Se | Halbleiteroberflächenbehandlung und dabei verwendete mischung |
AU2003277597A1 (en) * | 2002-11-08 | 2004-06-07 | Wako Pure Chemical Industries, Ltd. | Cleaning composition and method of cleaning therewith |
JP4355785B2 (ja) * | 2002-11-26 | 2009-11-04 | 光 小林 | 半導体装置製造用基板の製造方法および半導体装置の製造方法 |
JP4375991B2 (ja) * | 2003-04-09 | 2009-12-02 | 関東化学株式会社 | 半導体基板洗浄液組成物 |
US7188630B2 (en) * | 2003-05-07 | 2007-03-13 | Freescale Semiconductor, Inc. | Method to passivate conductive surfaces during semiconductor processing |
US8316866B2 (en) * | 2003-06-27 | 2012-11-27 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US7799141B2 (en) * | 2003-06-27 | 2010-09-21 | Lam Research Corporation | Method and system for using a two-phases substrate cleaning compound |
US7737097B2 (en) | 2003-06-27 | 2010-06-15 | Lam Research Corporation | Method for removing contamination from a substrate and for making a cleaning solution |
US7648584B2 (en) * | 2003-06-27 | 2010-01-19 | Lam Research Corporation | Method and apparatus for removing contamination from substrate |
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US20040261823A1 (en) * | 2003-06-27 | 2004-12-30 | Lam Research Corporation | Method and apparatus for removing a target layer from a substrate using reactive gases |
US8522801B2 (en) * | 2003-06-27 | 2013-09-03 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
TWI362415B (en) * | 2003-10-27 | 2012-04-21 | Wako Pure Chem Ind Ltd | Novel detergent and method for cleaning |
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US7568490B2 (en) * | 2003-12-23 | 2009-08-04 | Lam Research Corporation | Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids |
US8043441B2 (en) | 2005-06-15 | 2011-10-25 | Lam Research Corporation | Method and apparatus for cleaning a substrate using non-Newtonian fluids |
US8522799B2 (en) * | 2005-12-30 | 2013-09-03 | Lam Research Corporation | Apparatus and system for cleaning a substrate |
US7416370B2 (en) * | 2005-06-15 | 2008-08-26 | Lam Research Corporation | Method and apparatus for transporting a substrate using non-Newtonian fluid |
US8323420B2 (en) | 2005-06-30 | 2012-12-04 | Lam Research Corporation | Method for removing material from semiconductor wafer and apparatus for performing the same |
EP1717344A4 (de) * | 2004-01-23 | 2008-08-20 | Ebara Corp | Verfahren zur verarbeitung eines substrats, katalysatorprozessflüssigkeit und substratverarbeitungsvorrichtung |
KR101166002B1 (ko) * | 2004-02-09 | 2012-07-18 | 미쓰비시 가가꾸 가부시키가이샤 | 반도체 디바이스용 기판 세정액 및 세정방법 |
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JP5600376B2 (ja) * | 2005-01-27 | 2014-10-01 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 半導体基材の処理のための組成物 |
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US9048088B2 (en) * | 2008-03-28 | 2015-06-02 | Lam Research Corporation | Processes and solutions for substrate cleaning and electroless deposition |
US9074170B2 (en) | 2008-10-21 | 2015-07-07 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
US8148311B2 (en) | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
US8431516B2 (en) | 2009-10-24 | 2013-04-30 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
US7947130B2 (en) * | 2009-10-24 | 2011-05-24 | Wai Mun Lee | Troika acid semiconductor cleaning compositions and methods of use |
US8148310B2 (en) * | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
JP6066552B2 (ja) | 2011-12-06 | 2017-01-25 | 関東化學株式会社 | 電子デバイス用洗浄液組成物 |
JP6123335B2 (ja) | 2012-02-17 | 2017-05-10 | 三菱化学株式会社 | 半導体デバイス用洗浄液及び半導体デバイス用基板の洗浄方法 |
WO2013162020A1 (ja) | 2012-04-27 | 2013-10-31 | 和光純薬工業株式会社 | 半導体基板用洗浄剤および半導体基板表面の処理方法 |
KR101799946B1 (ko) | 2014-11-18 | 2017-11-22 | 삼성에스디아이 주식회사 | 유기막 연마 후 세정조성물 및 이를 이용한 세정방법 |
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EP0496605B1 (de) * | 1991-01-24 | 2001-08-01 | Wako Pure Chemical Industries Ltd | Lösungen zur Oberflächenbehandlung von Halbleitern |
TW263531B (de) * | 1992-03-11 | 1995-11-21 | Mitsubishi Gas Chemical Co | |
NZ248582A (en) * | 1992-09-24 | 1995-02-24 | Colgate Palmolive Co | Acidic, thickened cleaner containing dicarboxylic acids and aminoalkylene phosphonic acid for cleaning lime scale from acid-resistant or zirconium white enamel hard surfaces |
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JPH07286172A (ja) * | 1994-04-20 | 1995-10-31 | Asahi Glass Co Ltd | エッチング液およびエッチング方法 |
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DE19525521B4 (de) * | 1994-07-15 | 2007-04-26 | Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont | Verfahren zum Reinigen von Substraten |
US5460802A (en) * | 1994-07-18 | 1995-10-24 | Minnesota Mining And Manufacturing Company | Oral disinfectant for companion animals |
US5635167A (en) * | 1994-12-28 | 1997-06-03 | L'avante Garde, Inc. | Removal of minerals from human hair and animal keratin fibers |
US5662769A (en) * | 1995-02-21 | 1997-09-02 | Advanced Micro Devices, Inc. | Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning |
DE69636618T2 (de) * | 1995-07-27 | 2007-08-30 | Mitsubishi Chemical Corp. | Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür |
EP0784336A3 (de) * | 1995-12-15 | 1998-05-13 | Texas Instruments Incorporated | Verbesserungen bei der Herstellung und Bearbeitung von Halbleitervorrichtungen |
-
1997
- 1997-05-21 TW TW086106782A patent/TW416987B/zh not_active IP Right Cessation
- 1997-06-03 EP EP97108877A patent/EP0812011B1/de not_active Expired - Lifetime
- 1997-06-03 DE DE69733102T patent/DE69733102T2/de not_active Expired - Lifetime
- 1997-06-04 US US08/868,891 patent/US6143705A/en not_active Expired - Lifetime
- 1997-06-05 KR KR1019970023398A patent/KR100322392B1/ko not_active IP Right Cessation
-
2000
- 2000-09-11 US US09/658,926 patent/US6514921B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6143705A (en) | 2000-11-07 |
DE69733102T2 (de) | 2006-03-02 |
TW416987B (en) | 2001-01-01 |
EP0812011A3 (de) | 1998-05-13 |
EP0812011B1 (de) | 2005-04-27 |
EP0812011A2 (de) | 1997-12-10 |
KR100322392B1 (ko) | 2002-03-08 |
US6514921B1 (en) | 2003-02-04 |
KR980005773A (ko) | 1998-03-30 |
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