DE69733102D1 - Reinigungsmittel - Google Patents

Reinigungsmittel

Info

Publication number
DE69733102D1
DE69733102D1 DE69733102T DE69733102T DE69733102D1 DE 69733102 D1 DE69733102 D1 DE 69733102D1 DE 69733102 T DE69733102 T DE 69733102T DE 69733102 T DE69733102 T DE 69733102T DE 69733102 D1 DE69733102 D1 DE 69733102D1
Authority
DE
Germany
Prior art keywords
cleaning supplies
supplies
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69733102T
Other languages
English (en)
Other versions
DE69733102T2 (de
Inventor
Masahiko Kakizawa
Osamu Ichikawa
Ichiro Hayashida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Wako Pure Chemical Corp
Original Assignee
Wako Pure Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wako Pure Chemical Industries Ltd filed Critical Wako Pure Chemical Industries Ltd
Application granted granted Critical
Publication of DE69733102D1 publication Critical patent/DE69733102D1/de
Publication of DE69733102T2 publication Critical patent/DE69733102T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/264Aldehydes; Ketones; Acetals or ketals
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/265Carboxylic acids or salts thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3209Amines or imines with one to four nitrogen atoms; Quaternized amines
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3218Alkanolamines or alkanolimines
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3245Aminoacids
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
DE69733102T 1996-06-05 1997-06-03 Reinigungsmittel Expired - Lifetime DE69733102T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16535396 1996-06-05
JP16535396 1996-06-05

Publications (2)

Publication Number Publication Date
DE69733102D1 true DE69733102D1 (de) 2005-06-02
DE69733102T2 DE69733102T2 (de) 2006-03-02

Family

ID=15810758

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69733102T Expired - Lifetime DE69733102T2 (de) 1996-06-05 1997-06-03 Reinigungsmittel

Country Status (5)

Country Link
US (2) US6143705A (de)
EP (1) EP0812011B1 (de)
KR (1) KR100322392B1 (de)
DE (1) DE69733102T2 (de)
TW (1) TW416987B (de)

Families Citing this family (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896826B2 (en) 1997-01-09 2005-05-24 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
US6755989B2 (en) 1997-01-09 2004-06-29 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
WO1998030667A1 (en) * 1997-01-09 1998-07-16 Advanced Technology Materials, Inc. Semiconductor wafer cleaning composition and method with aqueous ammonium fluoride and amine
TW387936B (en) * 1997-08-12 2000-04-21 Kanto Kagaku Washing solution
US5977041A (en) * 1997-09-23 1999-11-02 Olin Microelectronic Chemicals Aqueous rinsing composition
US6165956A (en) * 1997-10-21 2000-12-26 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6303551B1 (en) 1997-10-21 2001-10-16 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film
US6479443B1 (en) 1997-10-21 2002-11-12 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
US6593282B1 (en) 1997-10-21 2003-07-15 Lam Research Corporation Cleaning solutions for semiconductor substrates after polishing of copper film
JP3039493B2 (ja) * 1997-11-28 2000-05-08 日本電気株式会社 基板の洗浄方法及び洗浄溶液
DE19758533B4 (de) * 1997-12-04 2005-09-29 Micronas Gmbh Verfahren zum Strukturieren einer Oberflächenschicht
US6231677B1 (en) * 1998-02-27 2001-05-15 Kanto Kagaku Kabushiki Kaisha Photoresist stripping liquid composition
KR100532380B1 (ko) * 1998-05-12 2006-01-27 삼성전자주식회사 반도체장치의 세정방법
JP3003684B1 (ja) 1998-09-07 2000-01-31 日本電気株式会社 基板洗浄方法および基板洗浄液
JP3279532B2 (ja) * 1998-11-06 2002-04-30 日本電気株式会社 半導体装置の製造方法
ES2249925T3 (es) * 1998-12-04 2006-04-01 The Farrow System Limited Procedimiento para eliminar un revestimiento de una superficie.
JP4224652B2 (ja) * 1999-03-08 2009-02-18 三菱瓦斯化学株式会社 レジスト剥離液およびそれを用いたレジストの剥離方法
US6358847B1 (en) 1999-03-31 2002-03-19 Lam Research Corporation Method for enabling conventional wire bonding to copper-based bond pad features
JP4516176B2 (ja) * 1999-04-20 2010-08-04 関東化学株式会社 電子材料用基板洗浄液
US6562726B1 (en) * 1999-06-29 2003-05-13 Micron Technology, Inc. Acid blend for removing etch residue
US6395693B1 (en) 1999-09-27 2002-05-28 Cabot Microelectronics Corporation Cleaning solution for semiconductor surfaces following chemical-mechanical polishing
US6537381B1 (en) 1999-09-29 2003-03-25 Lam Research Corporation Method for cleaning and treating a semiconductor wafer after chemical mechanical polishing
US6194366B1 (en) * 1999-11-16 2001-02-27 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6592433B2 (en) * 1999-12-31 2003-07-15 Intel Corporation Method for defect reduction
JP3645144B2 (ja) * 2000-02-24 2005-05-11 Necエレクトロニクス株式会社 半導体装置の製造方法
AU2001241190A1 (en) * 2000-03-21 2001-10-03 Wako Pure Chemical Industries, Ltd. Semiconductor wafer cleaning agent and cleaning method
US6486108B1 (en) * 2000-05-31 2002-11-26 Micron Technology, Inc. Cleaning composition useful in semiconductor integrated circuit fabrication
DE60115909T2 (de) 2000-06-16 2006-09-07 Kao Corp. Reinigungsmittelzusammensetzung
DE60044470D1 (de) * 2000-06-23 2010-07-08 Fujitsu Ltd Verfahren zur herstellung eines halbleiterelement
US6762132B1 (en) * 2000-08-31 2004-07-13 Micron Technology, Inc. Compositions for dissolution of low-K dielectric films, and methods of use
JP4661005B2 (ja) * 2000-09-05 2011-03-30 和光純薬工業株式会社 Ti系膜用エッチング剤及びエッチング方法
JP2002114993A (ja) * 2000-10-10 2002-04-16 Tokyo Electron Ltd 洗浄剤及び洗浄方法
JP2002113431A (ja) * 2000-10-10 2002-04-16 Tokyo Electron Ltd 洗浄方法
US6627550B2 (en) * 2001-03-27 2003-09-30 Micron Technology, Inc. Post-planarization clean-up
US6627546B2 (en) 2001-06-29 2003-09-30 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
US6705926B2 (en) * 2001-10-24 2004-03-16 Cabot Microelectronics Corporation Boron-containing polishing system and method
EP1335016A1 (de) * 2002-02-06 2003-08-13 Shipley Company LLC Reinigungszusammensetzung
TWI339680B (en) * 2002-02-19 2011-04-01 Kanto Kagaku Washing liquid composition for semiconductor substrate
EP1501916B1 (de) * 2002-04-25 2009-06-17 FujiFilm Electronic Materials USA, Inc. Nicht korrodierende reinigungsmittel zur entfernung von ätzmittelrückständen
JP4221191B2 (ja) * 2002-05-16 2009-02-12 関東化学株式会社 Cmp後洗浄液組成物
US20060166846A1 (en) * 2002-08-19 2006-07-27 Ying-Hao Li Remover solution
EP1567633B1 (de) * 2002-11-05 2011-08-24 Basf Se Halbleiteroberflächenbehandlung und dabei verwendete mischung
AU2003277597A1 (en) * 2002-11-08 2004-06-07 Wako Pure Chemical Industries, Ltd. Cleaning composition and method of cleaning therewith
JP4355785B2 (ja) * 2002-11-26 2009-11-04 光 小林 半導体装置製造用基板の製造方法および半導体装置の製造方法
JP4375991B2 (ja) * 2003-04-09 2009-12-02 関東化学株式会社 半導体基板洗浄液組成物
US7188630B2 (en) * 2003-05-07 2007-03-13 Freescale Semiconductor, Inc. Method to passivate conductive surfaces during semiconductor processing
US8316866B2 (en) * 2003-06-27 2012-11-27 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US7737097B2 (en) 2003-06-27 2010-06-15 Lam Research Corporation Method for removing contamination from a substrate and for making a cleaning solution
US7648584B2 (en) * 2003-06-27 2010-01-19 Lam Research Corporation Method and apparatus for removing contamination from substrate
US7913703B1 (en) 2003-06-27 2011-03-29 Lam Research Corporation Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate
US20040261823A1 (en) * 2003-06-27 2004-12-30 Lam Research Corporation Method and apparatus for removing a target layer from a substrate using reactive gases
US8522801B2 (en) * 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
TWI362415B (en) * 2003-10-27 2012-04-21 Wako Pure Chem Ind Ltd Novel detergent and method for cleaning
BRPI0416067A (pt) * 2003-10-29 2007-01-02 Mallinckrodt Baker Inc removedores alcalinos de resìduo de cinza/gravação pós-plasma e composições de descascamento de fotorresistes contendo inibidores de corrosão de haleto de metal
US7862662B2 (en) * 2005-12-30 2011-01-04 Lam Research Corporation Method and material for cleaning a substrate
US7568490B2 (en) * 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
US8043441B2 (en) 2005-06-15 2011-10-25 Lam Research Corporation Method and apparatus for cleaning a substrate using non-Newtonian fluids
US8522799B2 (en) * 2005-12-30 2013-09-03 Lam Research Corporation Apparatus and system for cleaning a substrate
US7416370B2 (en) * 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US8323420B2 (en) 2005-06-30 2012-12-04 Lam Research Corporation Method for removing material from semiconductor wafer and apparatus for performing the same
EP1717344A4 (de) * 2004-01-23 2008-08-20 Ebara Corp Verfahren zur verarbeitung eines substrats, katalysatorprozessflüssigkeit und substratverarbeitungsvorrichtung
KR101166002B1 (ko) * 2004-02-09 2012-07-18 미쓰비시 가가꾸 가부시키가이샤 반도체 디바이스용 기판 세정액 및 세정방법
KR100606187B1 (ko) * 2004-07-14 2006-08-01 테크노세미켐 주식회사 반도체 기판 세정용 조성물, 이를 이용한 반도체 기판세정방법 및 반도체 장치 제조 방법
JP5600376B2 (ja) * 2005-01-27 2014-10-01 アドバンスド テクノロジー マテリアルズ,インコーポレイテッド 半導体基材の処理のための組成物
US7923423B2 (en) * 2005-01-27 2011-04-12 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
CN101171551B (zh) * 2005-05-06 2012-12-26 安万托特性材料股份有限公司 用于清除蚀刻后和灰化的光致抗蚀剂残余物及大部分光致抗蚀剂的组合物
US7939482B2 (en) * 2005-05-25 2011-05-10 Freescale Semiconductor, Inc. Cleaning solution for a semiconductor wafer
SG154438A1 (en) * 2005-12-30 2009-08-28 Lam Res Corp Cleaning compound and method and system for using the cleaning compound
TW200734448A (en) * 2006-02-03 2007-09-16 Advanced Tech Materials Low pH post-CMP residue removal composition and method of use
WO2008023214A1 (en) * 2006-08-23 2008-02-28 Freescale Semiconductor, Inc. Rinse formulation for use in the manufacture of an integrated circuit
US8685909B2 (en) * 2006-09-21 2014-04-01 Advanced Technology Materials, Inc. Antioxidants for post-CMP cleaning formulations
US20080076688A1 (en) * 2006-09-21 2008-03-27 Barnes Jeffrey A Copper passivating post-chemical mechanical polishing cleaning composition and method of use
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
US20080148595A1 (en) * 2006-12-20 2008-06-26 Lam Research Corporation Method and apparatus for drying substrates using a surface tensions reducing gas
US7897213B2 (en) * 2007-02-08 2011-03-01 Lam Research Corporation Methods for contained chemical surface treatment
TW200916571A (en) * 2007-08-02 2009-04-16 Advanced Tech Materials Non-fluoride containing composition for the removal of residue from a microelectronic device
DE102007058829A1 (de) * 2007-12-06 2009-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Textur- und Reinigungsmedium zur Oberflächenbehandlung von Wafern und dessen Verwendung
US8084406B2 (en) * 2007-12-14 2011-12-27 Lam Research Corporation Apparatus for particle removal by single-phase and two-phase media
US8404626B2 (en) 2007-12-21 2013-03-26 Lam Research Corporation Post-deposition cleaning methods and formulations for substrates with cap layers
US9048088B2 (en) * 2008-03-28 2015-06-02 Lam Research Corporation Processes and solutions for substrate cleaning and electroless deposition
US9074170B2 (en) 2008-10-21 2015-07-07 Advanced Technology Materials, Inc. Copper cleaning and protection formulations
US8148311B2 (en) 2009-10-24 2012-04-03 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
US8431516B2 (en) 2009-10-24 2013-04-30 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
US7947130B2 (en) * 2009-10-24 2011-05-24 Wai Mun Lee Troika acid semiconductor cleaning compositions and methods of use
US8148310B2 (en) * 2009-10-24 2012-04-03 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
JP6066552B2 (ja) 2011-12-06 2017-01-25 関東化學株式会社 電子デバイス用洗浄液組成物
JP6123335B2 (ja) 2012-02-17 2017-05-10 三菱化学株式会社 半導体デバイス用洗浄液及び半導体デバイス用基板の洗浄方法
WO2013162020A1 (ja) 2012-04-27 2013-10-31 和光純薬工業株式会社 半導体基板用洗浄剤および半導体基板表面の処理方法
KR101799946B1 (ko) 2014-11-18 2017-11-22 삼성에스디아이 주식회사 유기막 연마 후 세정조성물 및 이를 이용한 세정방법
FR3046062B1 (fr) * 2015-12-23 2018-02-16 L'oreal Procede d'extraction d'ions metalliques des fibres keratiniques par application repetee d'une composition acide

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970044A (en) * 1957-12-30 1961-01-31 Ibm Solution and process for etching indium dots
US3290174A (en) * 1961-10-09 1966-12-06 Rohr Corp Two-stage process for derusting and protecting the surfaces of ferrous materials
NL149551B (nl) * 1964-08-04 1976-05-17 Dow Chemical Co Werkwijze voor het reinigen en passiveren van ijzerhoudende metaaloppervlakken, waarop metallisch koper is afgezet.
FR1603558A (en) * 1968-12-18 1971-05-03 Cleaning heating surfaces with complexing agent soln
GB1571438A (en) * 1977-03-15 1980-07-16 Colgate Palmolive Co Cleaning compositions
US4215005A (en) * 1978-01-30 1980-07-29 Allied Chemical Corporation Organic stripping compositions and method for using same
US4217234A (en) * 1978-02-16 1980-08-12 Werner Krisp Denture cleansing tablet and method of manufacturing the same
US4209418A (en) * 1978-07-18 1980-06-24 Union Carbide Corporation Gelatin benzimidazole blends as inhibitors for carboxylic acids
US4264418A (en) * 1978-09-19 1981-04-28 Kilene Corp. Method for detersifying and oxide coating removal
US4164477A (en) * 1978-10-02 1979-08-14 Chem-X3, Inc. Fungicidal detergent composition
US4239567A (en) * 1978-10-16 1980-12-16 Western Electric Company, Inc. Removably holding planar articles for polishing operations
SU1070210A1 (ru) * 1981-09-17 1984-01-30 Предприятие П/Я А-3562 Раствор дл размерного травлени железа
US4395304A (en) * 1982-05-11 1983-07-26 Rca Corporation Selective etching of phosphosilicate glass
US4610728A (en) * 1982-10-19 1986-09-09 Ram Natesh Method and composition for dissolving deposits of magnetite
SU1153226A1 (ru) * 1982-12-23 1985-04-30 Московский Ордена Ленина И Ордена Октябрьской Революции Энергетический Институт Композици дл отмывки отложений с поверхностей нагрева котлов и парогенераторов
US4452643A (en) * 1983-01-12 1984-06-05 Halliburton Company Method of removing copper and copper oxide from a ferrous metal surface
US4587043A (en) * 1983-06-07 1986-05-06 Westinghouse Electric Corp. Decontamination of metal surfaces in nuclear power reactors
US4529450A (en) * 1983-10-18 1985-07-16 The United States Of America As Represented By The Secretary Of The Navy Metal oxide remover and method of using
US4626324A (en) * 1984-04-30 1986-12-02 Allied Corporation Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards
US5318717A (en) * 1984-12-28 1994-06-07 Alcon Laboratories, Inc. Use of nonionic surfactant to enhance the cleaning effect of pancreatin on contact lenses
US4623399A (en) * 1985-02-04 1986-11-18 Dowell Schlumberger Incorporated Solvent for removing iron oxide deposits
JPS61231188A (ja) * 1985-04-04 1986-10-15 Nippon Paint Co Ltd アルミニウム表面洗浄剤の管理方法
JP2504978B2 (ja) 1987-01-27 1996-06-05 株式会社リコー トナ−担持体
US4802990A (en) * 1987-07-30 1989-02-07 Inskeep Jr Eugene L Solution and method for dissolving minerals
JPS6448302A (en) * 1987-08-18 1989-02-22 Matsushita Electric Ind Co Ltd Floating type illumination device
US4845125A (en) * 1987-11-10 1989-07-04 Indianapolis Center For Advanced Research, Inc. Chemolytic EDTA-citric acid composition for dissolution of calculi
US5039441A (en) * 1988-02-10 1991-08-13 Colgate-Palmolive Company Safe acidic hard surface cleaner
US4992212A (en) * 1988-10-18 1991-02-12 Lever Brothers Company, Division Of Conopco, Inc. Alkaline light duty liquid detergents that are non-staining to aluminum
JPH03161585A (ja) * 1989-08-30 1991-07-11 Hakutou Kagaku Kk 古紙脱墨工程におけるシリカ系スケール防止剤及び防止方法
JP2940058B2 (ja) * 1990-03-05 1999-08-25 栗田工業株式会社 抄紙機の脱水部用デポジット防止方法
EP0496605B1 (de) * 1991-01-24 2001-08-01 Wako Pure Chemical Industries Ltd Lösungen zur Oberflächenbehandlung von Halbleitern
TW263531B (de) * 1992-03-11 1995-11-21 Mitsubishi Gas Chemical Co
NZ248582A (en) * 1992-09-24 1995-02-24 Colgate Palmolive Co Acidic, thickened cleaner containing dicarboxylic acids and aminoalkylene phosphonic acid for cleaning lime scale from acid-resistant or zirconium white enamel hard surfaces
US5389194A (en) * 1993-02-05 1995-02-14 Lsi Logic Corporation Methods of cleaning semiconductor substrates after polishing
US5288332A (en) * 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
US5635104A (en) * 1993-06-24 1997-06-03 The Procter & Gamble Company Bleaching solutions and method utilizing selected bleach activators effective at low perhydroxyl concentrations
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
JPH07286172A (ja) * 1994-04-20 1995-10-31 Asahi Glass Co Ltd エッチング液およびエッチング方法
US5498293A (en) * 1994-06-23 1996-03-12 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
US5637151A (en) * 1994-06-27 1997-06-10 Siemens Components, Inc. Method for reducing metal contamination of silicon wafers during semiconductor manufacturing
DE19525521B4 (de) * 1994-07-15 2007-04-26 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Verfahren zum Reinigen von Substraten
US5460802A (en) * 1994-07-18 1995-10-24 Minnesota Mining And Manufacturing Company Oral disinfectant for companion animals
US5635167A (en) * 1994-12-28 1997-06-03 L'avante Garde, Inc. Removal of minerals from human hair and animal keratin fibers
US5662769A (en) * 1995-02-21 1997-09-02 Advanced Micro Devices, Inc. Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning
DE69636618T2 (de) * 1995-07-27 2007-08-30 Mitsubishi Chemical Corp. Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür
EP0784336A3 (de) * 1995-12-15 1998-05-13 Texas Instruments Incorporated Verbesserungen bei der Herstellung und Bearbeitung von Halbleitervorrichtungen

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US6143705A (en) 2000-11-07
DE69733102T2 (de) 2006-03-02
TW416987B (en) 2001-01-01
EP0812011A3 (de) 1998-05-13
EP0812011B1 (de) 2005-04-27
EP0812011A2 (de) 1997-12-10
KR100322392B1 (ko) 2002-03-08
US6514921B1 (en) 2003-02-04
KR980005773A (ko) 1998-03-30

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