DE69715962D1 - Plasma Behandlung Anlage und Behandlung-Methode - Google Patents
Plasma Behandlung Anlage und Behandlung-MethodeInfo
- Publication number
- DE69715962D1 DE69715962D1 DE69715962T DE69715962T DE69715962D1 DE 69715962 D1 DE69715962 D1 DE 69715962D1 DE 69715962 T DE69715962 T DE 69715962T DE 69715962 T DE69715962 T DE 69715962T DE 69715962 D1 DE69715962 D1 DE 69715962D1
- Authority
- DE
- Germany
- Prior art keywords
- treatment
- facility
- plasma
- treatment method
- plasma treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title 1
- 238000009832 plasma treatment Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/507—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12577096A JP3437376B2 (ja) | 1996-05-21 | 1996-05-21 | プラズマ処理装置及び処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69715962D1 true DE69715962D1 (de) | 2002-11-07 |
DE69715962T2 DE69715962T2 (de) | 2003-06-18 |
Family
ID=14918408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69715962T Expired - Lifetime DE69715962T2 (de) | 1996-05-21 | 1997-05-20 | Plasma Behandlung Anlage und Behandlung-Methode |
Country Status (5)
Country | Link |
---|---|
US (2) | US6145469A (de) |
EP (1) | EP0808918B1 (de) |
JP (1) | JP3437376B2 (de) |
KR (1) | KR100276599B1 (de) |
DE (1) | DE69715962T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3437376B2 (ja) * | 1996-05-21 | 2003-08-18 | キヤノン株式会社 | プラズマ処理装置及び処理方法 |
JP2921499B2 (ja) * | 1996-07-30 | 1999-07-19 | 日本電気株式会社 | プラズマ処理装置 |
JP5165825B2 (ja) * | 2000-01-10 | 2013-03-21 | 東京エレクトロン株式会社 | 分割された電極集合体並びにプラズマ処理方法。 |
JP2001323379A (ja) | 2000-05-15 | 2001-11-22 | Canon Inc | 堆積膜形成装置および堆積膜形成方法 |
JP2002030447A (ja) * | 2000-07-11 | 2002-01-31 | Canon Inc | プラズマ処理方法及びプラズマ処理装置 |
KR100829327B1 (ko) * | 2002-04-05 | 2008-05-13 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치 및 반응 용기 |
KR100837474B1 (ko) * | 2003-03-04 | 2008-06-12 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리장치 및 디바이스의 제조방법 |
JP4298401B2 (ja) * | 2003-06-27 | 2009-07-22 | キヤノン株式会社 | 堆積膜形成装置、及び堆積膜形成方法 |
DE102004009735A1 (de) * | 2004-02-25 | 2005-09-15 | Endress + Hauser Gmbh + Co. Kg | Meßgerät mit Anzeigevorrichtung |
US20070048456A1 (en) * | 2004-09-14 | 2007-03-01 | Keshner Marvin S | Plasma enhanced chemical vapor deposition apparatus and method |
US8251012B2 (en) * | 2005-03-01 | 2012-08-28 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and semiconductor device producing method |
WO2007111348A1 (ja) * | 2006-03-28 | 2007-10-04 | Hitachi Kokusai Electric Inc. | 基板処理装置 |
US20080139003A1 (en) * | 2006-10-26 | 2008-06-12 | Shahid Pirzada | Barrier coating deposition for thin film devices using plasma enhanced chemical vapor deposition process |
JP5568212B2 (ja) * | 2007-09-19 | 2014-08-06 | 株式会社日立国際電気 | 基板処理装置、そのコーティング方法、基板処理方法及び半導体デバイスの製造方法 |
TWI477646B (zh) * | 2010-08-09 | 2015-03-21 | Hon Hai Prec Ind Co Ltd | 化學氣相沉積設備 |
JP5730521B2 (ja) * | 2010-09-08 | 2015-06-10 | 株式会社日立ハイテクノロジーズ | 熱処理装置 |
US9932252B2 (en) | 2013-05-01 | 2018-04-03 | Nch Corporation | System and method for treating water systems with high voltage discharge and ozone |
US9868653B2 (en) * | 2013-05-01 | 2018-01-16 | Nch Corporation | System and method for treating water systems with high voltage discharge and ozone |
US11390950B2 (en) * | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4158717A (en) * | 1977-02-14 | 1979-06-19 | Varian Associates, Inc. | Silicon nitride film and method of deposition |
DE2908123A1 (de) * | 1978-03-03 | 1979-09-06 | Canon Kk | Bildaufzeichnungsmaterial fuer elektrophotographie |
CA1269950C (en) * | 1984-06-22 | 1990-06-05 | DEVICE FOR DECOMPOSITION BY GLOWING DISCHARGE | |
JPH04362091A (ja) * | 1991-06-05 | 1992-12-15 | Mitsubishi Heavy Ind Ltd | プラズマ化学気相成長装置 |
US5383984A (en) * | 1992-06-17 | 1995-01-24 | Tokyo Electron Limited | Plasma processing apparatus etching tunnel-type |
US5277751A (en) * | 1992-06-18 | 1994-01-11 | Ogle John S | Method and apparatus for producing low pressure planar plasma using a coil with its axis parallel to the surface of a coupling window |
TW249313B (de) * | 1993-03-06 | 1995-06-11 | Tokyo Electron Co | |
WO2004083486A1 (ja) * | 1993-03-23 | 2004-09-30 | Atsushi Yamagami | 超短波を用いたプラズマcvd法及び該プラズマcvd装置 |
US5531834A (en) * | 1993-07-13 | 1996-07-02 | Tokyo Electron Kabushiki Kaisha | Plasma film forming method and apparatus and plasma processing apparatus |
US5571366A (en) * | 1993-10-20 | 1996-11-05 | Tokyo Electron Limited | Plasma processing apparatus |
US5653811A (en) * | 1995-07-19 | 1997-08-05 | Chan; Chung | System for the plasma treatment of large area substrates |
US6065425A (en) | 1996-03-25 | 2000-05-23 | Canon Kabushiki Kaisha | Plasma process apparatus and plasma process method |
JP3437376B2 (ja) * | 1996-05-21 | 2003-08-18 | キヤノン株式会社 | プラズマ処理装置及び処理方法 |
US5970907A (en) | 1997-01-27 | 1999-10-26 | Canon Kabushiki Kaisha | Plasma processing apparatus |
-
1996
- 1996-05-21 JP JP12577096A patent/JP3437376B2/ja not_active Expired - Fee Related
-
1997
- 1997-05-09 US US08/853,449 patent/US6145469A/en not_active Expired - Lifetime
- 1997-05-20 EP EP97303434A patent/EP0808918B1/de not_active Expired - Lifetime
- 1997-05-20 DE DE69715962T patent/DE69715962T2/de not_active Expired - Lifetime
- 1997-05-21 KR KR1019970019765A patent/KR100276599B1/ko not_active IP Right Cessation
-
2000
- 2000-09-18 US US09/664,339 patent/US6558507B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0808918A2 (de) | 1997-11-26 |
KR100276599B1 (ko) | 2000-12-15 |
EP0808918A3 (de) | 1998-10-28 |
EP0808918B1 (de) | 2002-10-02 |
DE69715962T2 (de) | 2003-06-18 |
JPH09310181A (ja) | 1997-12-02 |
US6145469A (en) | 2000-11-14 |
US6558507B1 (en) | 2003-05-06 |
KR970077336A (ko) | 1997-12-12 |
JP3437376B2 (ja) | 2003-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |