DE19883021T1 - Entladungsoberflächenbehandlungsgerät und Entladungsoberflächenbehandlungsverfahren - Google Patents
Entladungsoberflächenbehandlungsgerät und EntladungsoberflächenbehandlungsverfahrenInfo
- Publication number
- DE19883021T1 DE19883021T1 DE19883021T DE19883021T DE19883021T1 DE 19883021 T1 DE19883021 T1 DE 19883021T1 DE 19883021 T DE19883021 T DE 19883021T DE 19883021 T DE19883021 T DE 19883021T DE 19883021 T1 DE19883021 T1 DE 19883021T1
- Authority
- DE
- Germany
- Prior art keywords
- surface treatment
- discharge surface
- treatment device
- treatment method
- discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
- B23H1/02—Electric circuits specially adapted therefor, e.g. power supply, control, preventing short circuits or other abnormal discharges
- B23H1/028—Electric circuits specially adapted therefor, e.g. power supply, control, preventing short circuits or other abnormal discharges for multiple gap machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
- B23H9/008—Surface roughening or texturing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1998/005109 WO2000029154A1 (fr) | 1998-11-13 | 1998-11-13 | Appareil et procede de traitement de surface par decharge |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19883021T1 true DE19883021T1 (de) | 2002-01-31 |
DE19883021B4 DE19883021B4 (de) | 2006-02-02 |
Family
ID=14209394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883021T Expired - Fee Related DE19883021B4 (de) | 1998-11-13 | 1998-11-13 | Entladungsoberflächenbehandlungsgerät und Entladungsoberflächenbehandlungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US6548028B1 (de) |
KR (1) | KR100411454B1 (de) |
CN (1) | CN1106902C (de) |
CH (1) | CH693845A5 (de) |
DE (1) | DE19883021B4 (de) |
WO (1) | WO2000029154A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9284647B2 (en) * | 2002-09-24 | 2016-03-15 | Mitsubishi Denki Kabushiki Kaisha | Method for coating sliding surface of high-temperature member, high-temperature member and electrode for electro-discharge surface treatment |
EP1544321B1 (de) * | 2002-09-24 | 2016-08-10 | IHI Corporation | Verfahren zum beschichten der gleitfläche eines hochtemperaturelements |
TWI272993B (en) * | 2002-10-09 | 2007-02-11 | Ishikawajima Harima Heavy Ind | Method for coating rotary member, rotary member, labyrinth seal structure and method for manufacturing rotary member |
US20060280597A1 (en) * | 2003-06-11 | 2006-12-14 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Rotating member, housing, bearing, gearbox, rotating machine, shaft structure, and surface treatment method |
WO2010010927A1 (ja) * | 2008-07-24 | 2010-01-28 | 三菱電機株式会社 | 放電加工装置、放電加工方法および半導体基板の製造方法 |
US8525064B2 (en) * | 2009-11-12 | 2013-09-03 | Denso Corporation | Electric discharge machine and method of producing nozzle body using the same |
JP5056832B2 (ja) * | 2009-11-12 | 2012-10-24 | 株式会社デンソー | 放電加工機および放電加工機を用いたノズルボディの製造方法 |
EP2397250B1 (de) | 2010-06-16 | 2017-09-20 | Agie Charmilles SA | Verfahren und Vorrichtung zur funkenerosiven Bearbeitung eines Werkstücks |
CN102226280B (zh) * | 2011-06-13 | 2015-02-18 | 天津职业技术师范大学 | 一种自动电火花沉积系统 |
CN103809245B (zh) | 2012-11-09 | 2017-02-08 | 泰科电子(上海)有限公司 | 用于处理光纤端面的系统和用于处理光纤端面的方法 |
US9072898B2 (en) * | 2013-03-14 | 2015-07-07 | CyMedica, Inc. | System and methods for treating or supporting human joints or a portion of the human body |
CN104014878B (zh) * | 2014-06-19 | 2016-04-13 | 哈尔滨工业大学 | 一种可实现多点放电高速电火花加工的新型放电加工回路及加工方法 |
CN105215492B (zh) * | 2015-11-03 | 2017-09-01 | 南京航空航天大学 | 并行放电多电极运丝机构与均衡放电控制方法 |
CN106270836A (zh) * | 2016-09-05 | 2017-01-04 | 常州大学 | 电火花放电制备荧光碳量子点的方法 |
CN106956048B (zh) * | 2017-05-08 | 2019-07-02 | 广东工业大学 | 一种分时分区电解加工方法及装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4613720Y1 (de) * | 1967-05-23 | 1971-05-15 | ||
JPS5372295A (en) | 1976-12-10 | 1978-06-27 | Mitsubishi Electric Corp | Electrical discharge machining method of roll-shaped workpieces |
JPS57138536A (en) | 1981-02-20 | 1982-08-26 | Nippon Kokan Kk <Nkk> | Method of machining roll-shaped material with electric discharge |
JPH08229742A (ja) * | 1995-03-01 | 1996-09-10 | Naotake Mori | 三次元形状創成方法 |
JP3376174B2 (ja) | 1995-07-04 | 2003-02-10 | 三菱電機株式会社 | 放電加工による表面処理方法および装置 |
DE19540352C2 (de) * | 1995-10-28 | 2000-05-31 | Charmilles Technologies | Einrichtung zum funkenerosiven Senken mit einer großflächigen Elektrode |
JP3537939B2 (ja) | 1996-01-17 | 2004-06-14 | 独立行政法人 科学技術振興機構 | 液中放電による表面処理方法 |
-
1998
- 1998-11-13 DE DE19883021T patent/DE19883021B4/de not_active Expired - Fee Related
- 1998-11-13 WO PCT/JP1998/005109 patent/WO2000029154A1/ja active IP Right Grant
- 1998-11-13 CN CN98814312A patent/CN1106902C/zh not_active Expired - Fee Related
- 1998-11-13 CH CH00718/01A patent/CH693845A5/de not_active IP Right Cessation
- 1998-11-13 KR KR10-2001-7005987A patent/KR100411454B1/ko not_active IP Right Cessation
- 1998-11-13 US US09/807,762 patent/US6548028B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1322159A (zh) | 2001-11-14 |
WO2000029154A1 (fr) | 2000-05-25 |
KR20010107960A (ko) | 2001-12-07 |
CN1106902C (zh) | 2003-04-30 |
KR100411454B1 (ko) | 2003-12-18 |
DE19883021B4 (de) | 2006-02-02 |
CH693845A5 (de) | 2004-03-15 |
US6548028B1 (en) | 2003-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960008976A (ko) | 처리장치 및 처리방법 | |
DE60044764D1 (de) | Durchgangs -Vorrichtung und -Verfahren | |
DE69912017D1 (de) | Peripheriegerät und Steuerverfahren dafür | |
HUP0004105A2 (en) | Method and device for sewage treatment | |
DE69708619D1 (de) | Elektroentionisierungsvorrichtung und methode | |
DE60025136D1 (de) | Empfangsvorrichtung und Empfangsverarbeitungsverfahren | |
DE69829919D1 (de) | Polierverfahren und Vorrichtung | |
DE69840108D1 (de) | Versuchsverfahren und vorrichtung | |
DE60036631D1 (de) | Plasmabehandlungsapparatur und plasmabehandlungsverfahren | |
DE69904731D1 (de) | Feinzerkleinerer und feinzerkleinerungsverfahren | |
DE60039547D1 (de) | Bestückungsverfahren und Bestückungsvorrichtung | |
DE19883021T1 (de) | Entladungsoberflächenbehandlungsgerät und Entladungsoberflächenbehandlungsverfahren | |
DE69515626T2 (de) | Plasmabehandlungsverfahren und -vorrichtung | |
DE69911848D1 (de) | Bilderzeugungsgerät und Bildherstellungsverfahren | |
DE69830149D1 (de) | Reinigungsverfahren und reinigungsgerät | |
DE69832364D1 (de) | Therapiegerät und entsprechendes Herstellungsverfahren | |
DE69804551T2 (de) | Spannkluppenreinigungs- Verfahren und Vorrichtung | |
DE69736267D1 (de) | Plasmabehandlungsvorrichtung und -verfahren | |
DE60025792D1 (de) | Bearbeitungsvorrichtung und Bearbeitungsverfahren | |
DE69913476D1 (de) | Polierverfahren und vorrichtung | |
DE69812595D1 (de) | Walzvorrichtung und walzverfahren | |
GB9809448D0 (en) | Treatment device and method | |
DE19882322T1 (de) | Ortsprogrammiereinrichtung und Ortsprogrammierverfahren | |
DE60030201D1 (de) | Substratbehandlungsvorrichtung und Betriebsverfahren | |
FI974205A (fi) | Ilmankäsittelylaite ja -menetelmä |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8607 | Notification of search results after publication | ||
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |