DE69700286T2 - Verfahren und Vorrichtung zum Abziehen von Chips - Google Patents

Verfahren und Vorrichtung zum Abziehen von Chips

Info

Publication number
DE69700286T2
DE69700286T2 DE69700286T DE69700286T DE69700286T2 DE 69700286 T2 DE69700286 T2 DE 69700286T2 DE 69700286 T DE69700286 T DE 69700286T DE 69700286 T DE69700286 T DE 69700286T DE 69700286 T2 DE69700286 T2 DE 69700286T2
Authority
DE
Germany
Prior art keywords
removal method
chip removal
chip
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69700286T
Other languages
English (en)
Other versions
DE69700286D1 (de
Inventor
Hiroyuki Tsuji
Takao Ohnishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE69700286D1 publication Critical patent/DE69700286D1/de
Publication of DE69700286T2 publication Critical patent/DE69700286T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
DE69700286T 1996-03-29 1997-03-26 Verfahren und Vorrichtung zum Abziehen von Chips Expired - Fee Related DE69700286T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07740796A JP3441879B2 (ja) 1996-03-29 1996-03-29 チップ剥離装置

Publications (2)

Publication Number Publication Date
DE69700286D1 DE69700286D1 (de) 1999-07-29
DE69700286T2 true DE69700286T2 (de) 1999-11-25

Family

ID=13633067

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69700286T Expired - Fee Related DE69700286T2 (de) 1996-03-29 1997-03-26 Verfahren und Vorrichtung zum Abziehen von Chips

Country Status (4)

Country Link
US (2) US6106222A (de)
EP (1) EP0798955B1 (de)
JP (1) JP3441879B2 (de)
DE (1) DE69700286T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752582C2 (de) * 1997-11-27 2000-06-21 Inst Mikrotechnik Mainz Gmbh Ablösevorrichtung für Mikrobauteile
JP2990197B1 (ja) * 1999-01-20 1999-12-13 熊本日本電気株式会社 半導体チップのピックアップ装置
JP2001196328A (ja) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Ｃｓｐ基板の分割方法
DE10151441B4 (de) * 2001-10-18 2015-08-20 Infineon Technologies Ag Anordnung und Verfahren zur Aufnahme und zum Bearbeiten eines dünnen Wafers
US20030209847A1 (en) * 2002-05-10 2003-11-13 Allison Claudia Leigh Handling device comprising multiple immobilization segments
US7780005B2 (en) * 2002-05-10 2010-08-24 Delphon Industries LLC Multiple segment vacuum release handling device
US20110005667A1 (en) * 2002-05-10 2011-01-13 Delphon Industries LLC Multiple segment vacuum release handling device
AU2003902270A0 (en) * 2003-05-09 2003-05-29 Origin Energy Solar Pty Ltd Separating and assembling semiconductor strips
JP4405211B2 (ja) * 2003-09-08 2010-01-27 パナソニック株式会社 半導体チップの剥離装置、剥離方法、及び半導体チップの供給装置
DE102006022277B4 (de) 2006-05-11 2010-03-11 Deutsche Post Ag Sauggreifer
KR100817068B1 (ko) * 2006-10-24 2008-03-27 삼성전자주식회사 박형의 반도체 칩 픽업 장치 및 방법
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
JP5318557B2 (ja) * 2008-12-24 2013-10-16 信越ポリマー株式会社 保持治具
JP2013102126A (ja) * 2011-10-14 2013-05-23 Fuji Electric Co Ltd 半導体装置の製造方法および半導体装置の製造装置
JP2013191781A (ja) * 2012-03-14 2013-09-26 Fuji Electric Co Ltd 半導体製造装置および半導体製造装置の制御方法
US20150247879A1 (en) 2014-03-03 2015-09-03 Infineon Technologies Ag Acceleration sensor
US9196520B1 (en) * 2014-08-01 2015-11-24 Freescale Semiconductor, Inc. Tape release systems and methods for semiconductor dies
JP2018056159A (ja) * 2016-09-26 2018-04-05 セイコーエプソン株式会社 粘着テープ剥離治具、半導体チップの製造装置、ｍｅｍｓデバイスの製造装置、液体噴射ヘッドの製造装置、および、粘着テープ剥離方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3988196A (en) * 1967-10-09 1976-10-26 Western Electric Company, Inc. Apparatus for transferring an oriented array of articles
US3707760A (en) * 1971-05-19 1973-01-02 Sieburg Ind Inc Method and device for article working such as fracturing of semiconductor slices and separating semiconductor chips
US3790051A (en) * 1971-09-07 1974-02-05 Radiant Energy Systems Semiconductor wafer fracturing technique employing a pressure controlled roller
US3747282A (en) * 1971-11-29 1973-07-24 E Katzke Apparatus for polishing wafers
US4778326A (en) * 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4556362A (en) * 1983-12-21 1985-12-03 At&T Technologies, Inc. Methods of and apparatus for handling semiconductor devices
JPS62166536A (ja) * 1986-01-20 1987-07-23 Sanyo Electric Co Ltd 電子部品の突き上げ装置
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
US4921564A (en) * 1988-05-23 1990-05-01 Semiconductor Equipment Corp. Method and apparatus for removing circuit chips from wafer handling tape
US5098501A (en) * 1989-12-08 1992-03-24 Sumitomo Electric Industries, Ltd. Pickup method and the pickup apparatus for chip-type part
US5310104A (en) * 1991-12-16 1994-05-10 General Electric Company Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置

Also Published As

Publication number Publication date
US6106222A (en) 2000-08-22
US6464444B1 (en) 2002-10-15
DE69700286D1 (de) 1999-07-29
EP0798955B1 (de) 1999-06-23
JP3441879B2 (ja) 2003-09-02
EP0798955A1 (de) 1997-10-01
JPH09270453A (ja) 1997-10-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee