DE69904074T2 - Verfahren und vorrichtung zum polieren von halbleiterscheiben - Google Patents
Verfahren und vorrichtung zum polieren von halbleiterscheibenInfo
- Publication number
- DE69904074T2 DE69904074T2 DE69904074T DE69904074T DE69904074T2 DE 69904074 T2 DE69904074 T2 DE 69904074T2 DE 69904074 T DE69904074 T DE 69904074T DE 69904074 T DE69904074 T DE 69904074T DE 69904074 T2 DE69904074 T2 DE 69904074T2
- Authority
- DE
- Germany
- Prior art keywords
- polishing semiconductor
- semiconductor discs
- discs
- polishing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S451/00—Abrading
- Y10S451/921—Pad for lens shaping tool
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/149,166 US6093085A (en) | 1998-09-08 | 1998-09-08 | Apparatuses and methods for polishing semiconductor wafers |
PCT/US1999/005353 WO2000013852A1 (en) | 1998-09-08 | 1999-03-12 | Apparatuses and methods for polishing semiconductor wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69904074D1 DE69904074D1 (de) | 2003-01-02 |
DE69904074T2 true DE69904074T2 (de) | 2003-10-02 |
Family
ID=22529059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69904074T Expired - Fee Related DE69904074T2 (de) | 1998-09-08 | 1999-03-12 | Verfahren und vorrichtung zum polieren von halbleiterscheiben |
Country Status (6)
Country | Link |
---|---|
US (1) | US6093085A (de) |
EP (1) | EP1126950B1 (de) |
JP (1) | JP2002524863A (de) |
KR (1) | KR20010073048A (de) |
DE (1) | DE69904074T2 (de) |
WO (1) | WO2000013852A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109719616A (zh) * | 2017-10-30 | 2019-05-07 | 台湾积体电路制造股份有限公司 | 平坦化机台及其平坦化方法 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040072518A1 (en) * | 1999-04-02 | 2004-04-15 | Applied Materials, Inc. | Platen with patterned surface for chemical mechanical polishing |
US6217426B1 (en) * | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
US20040053566A1 (en) * | 2001-01-12 | 2004-03-18 | Applied Materials, Inc. | CMP platen with patterned surface |
US20020077037A1 (en) * | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
US6722963B1 (en) * | 1999-08-03 | 2004-04-20 | Micron Technology, Inc. | Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
US6287172B1 (en) * | 1999-12-17 | 2001-09-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for improvement of tungsten chemical-mechanical polishing process |
US6616513B1 (en) * | 2000-04-07 | 2003-09-09 | Applied Materials, Inc. | Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
KR100394572B1 (ko) * | 2000-12-28 | 2003-08-14 | 삼성전자주식회사 | 복합특성을 가지는 씨엠피 패드구조와 그 제조방법 |
US6544107B2 (en) * | 2001-02-16 | 2003-04-08 | Agere Systems Inc. | Composite polishing pads for chemical-mechanical polishing |
US6857941B2 (en) * | 2001-06-01 | 2005-02-22 | Applied Materials, Inc. | Multi-phase polishing pad |
US7121919B2 (en) * | 2001-08-30 | 2006-10-17 | Micron Technology, Inc. | Chemical mechanical polishing system and process |
US6663472B2 (en) | 2002-02-01 | 2003-12-16 | Chartered Semiconductor Manufacturing Ltd. | Multiple step CMP polishing |
US6761625B1 (en) | 2003-05-20 | 2004-07-13 | Intel Corporation | Reclaiming virgin test wafers |
JP4292025B2 (ja) * | 2003-05-23 | 2009-07-08 | Jsr株式会社 | 研磨パッド |
KR100546355B1 (ko) * | 2003-07-28 | 2006-01-26 | 삼성전자주식회사 | 국부 단차 형성용 삽입 패드를 구비하는 cmp 장치 |
US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
KR100578133B1 (ko) * | 2003-11-04 | 2006-05-10 | 삼성전자주식회사 | 화학적 기계적 연마 장치 및 이에 사용되는 연마 패드 |
JP4641781B2 (ja) * | 2003-11-04 | 2011-03-02 | 三星電子株式会社 | 不均一強度を有する研磨面を使用した化学的機械的研磨装置および方法 |
US20050148289A1 (en) * | 2004-01-06 | 2005-07-07 | Cabot Microelectronics Corp. | Micromachining by chemical mechanical polishing |
US6951509B1 (en) * | 2004-03-09 | 2005-10-04 | 3M Innovative Properties Company | Undulated pad conditioner and method of using same |
JP5389543B2 (ja) * | 2009-06-19 | 2014-01-15 | 株式会社ディスコ | 研磨パッド |
DE102013201663B4 (de) * | 2012-12-04 | 2020-04-23 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
CN103707178A (zh) * | 2013-02-26 | 2014-04-09 | 任靖日 | 加工表面高平坦化方法及其装置 |
KR20180120280A (ko) * | 2016-03-25 | 2018-11-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 국부 영역 속도 제어 및 진동 모드를 갖는 연마 시스템 |
JP7232763B2 (ja) * | 2016-12-21 | 2023-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | スペーサ及びウェハ平坦化システムを有するパッドコンディショナ |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03259520A (ja) * | 1990-03-08 | 1991-11-19 | Nec Corp | 回転研磨装置 |
US5435772A (en) * | 1993-04-30 | 1995-07-25 | Motorola, Inc. | Method of polishing a semiconductor substrate |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US5897424A (en) * | 1995-07-10 | 1999-04-27 | The United States Of America As Represented By The Secretary Of Commerce | Renewable polishing lap |
US5899799A (en) * | 1996-01-19 | 1999-05-04 | Micron Display Technology, Inc. | Method and system to increase delivery of slurry to the surface of large substrates during polishing operations |
US5800248A (en) * | 1996-04-26 | 1998-09-01 | Ontrak Systems Inc. | Control of chemical-mechanical polishing rate across a substrate surface |
US5733176A (en) * | 1996-05-24 | 1998-03-31 | Micron Technology, Inc. | Polishing pad and method of use |
JP2865061B2 (ja) * | 1996-06-27 | 1999-03-08 | 日本電気株式会社 | 研磨パッドおよび研磨装置ならびに半導体装置の製造方法 |
US5645469A (en) * | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
US5899745A (en) * | 1997-07-03 | 1999-05-04 | Motorola, Inc. | Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor |
WO1999007518A1 (en) * | 1997-08-06 | 1999-02-18 | Rodel Holdings, Inc. | Continuously variable planarization and polishing pad system |
US5931719A (en) * | 1997-08-25 | 1999-08-03 | Lsi Logic Corporation | Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing |
-
1998
- 1998-09-08 US US09/149,166 patent/US6093085A/en not_active Expired - Lifetime
-
1999
- 1999-03-12 KR KR1020017002551A patent/KR20010073048A/ko not_active Application Discontinuation
- 1999-03-12 DE DE69904074T patent/DE69904074T2/de not_active Expired - Fee Related
- 1999-03-12 JP JP2000568641A patent/JP2002524863A/ja not_active Withdrawn
- 1999-03-12 WO PCT/US1999/005353 patent/WO2000013852A1/en not_active Application Discontinuation
- 1999-03-12 EP EP99911324A patent/EP1126950B1/de not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109719616A (zh) * | 2017-10-30 | 2019-05-07 | 台湾积体电路制造股份有限公司 | 平坦化机台及其平坦化方法 |
US10879077B2 (en) | 2017-10-30 | 2020-12-29 | Taiwan Semiconductor Manufacturing Company Ltd. | Planarization apparatus and planarization method thereof |
CN109719616B (zh) * | 2017-10-30 | 2023-10-13 | 台湾积体电路制造股份有限公司 | 平坦化机台及其平坦化方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2000013852A8 (en) | 2001-08-16 |
WO2000013852A1 (en) | 2000-03-16 |
US6093085A (en) | 2000-07-25 |
EP1126950B1 (de) | 2002-11-20 |
KR20010073048A (ko) | 2001-07-31 |
EP1126950A1 (de) | 2001-08-29 |
DE69904074D1 (de) | 2003-01-02 |
JP2002524863A (ja) | 2002-08-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |