DE69526813D1 - Vorrichtung zur Messung des Durchmessers und der Form des Querschnitts eines Wafers - Google Patents
Vorrichtung zur Messung des Durchmessers und der Form des Querschnitts eines WafersInfo
- Publication number
- DE69526813D1 DE69526813D1 DE69526813T DE69526813T DE69526813D1 DE 69526813 D1 DE69526813 D1 DE 69526813D1 DE 69526813 T DE69526813 T DE 69526813T DE 69526813 T DE69526813 T DE 69526813T DE 69526813 D1 DE69526813 D1 DE 69526813D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- measuring
- diameter
- cross
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6023582A JP3035690B2 (ja) | 1994-01-27 | 1994-01-27 | ウェーハ直径・断面形状測定装置及びそれを組み込んだウェーハ面取り機 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69526813D1 true DE69526813D1 (de) | 2002-07-04 |
DE69526813T2 DE69526813T2 (de) | 2002-09-12 |
Family
ID=12114576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69526813T Expired - Fee Related DE69526813T2 (de) | 1994-01-27 | 1995-01-25 | Vorrichtung zur Messung des Durchmessers und der Form des Querschnitts eines Wafers |
Country Status (5)
Country | Link |
---|---|
US (1) | US5555091A (de) |
EP (1) | EP0665576B1 (de) |
JP (1) | JP3035690B2 (de) |
KR (1) | KR0185782B1 (de) |
DE (1) | DE69526813T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69709924D1 (de) * | 1996-06-15 | 2002-02-28 | Unova Uk Ltd | Flexible verbindung einer schleifmaschinenspindel zu einer plattform |
GB2337111B (en) * | 1996-06-15 | 2000-03-15 | Unova Uk Ltd | Workpiece inspection |
AU1594899A (en) * | 1997-11-21 | 1999-06-15 | Timothy Cosentino | Automatic modular wafer substrate handling device |
JP4911810B2 (ja) * | 2000-06-23 | 2012-04-04 | コマツNtc株式会社 | ワークの研削装置および研削方法 |
DE10045203C2 (de) | 2000-09-13 | 2002-08-01 | Infineon Technologies Ag | Prüfvorrichtung und Verfahren zum Feststellen einer Kerben- beziehungsweise Nockenposition bei Scheiben |
US7092584B2 (en) * | 2002-01-04 | 2006-08-15 | Time Warner Entertainment Company Lp | Registration of separations |
JP4916890B2 (ja) * | 2005-04-19 | 2012-04-18 | 株式会社荏原製作所 | 基板処理装置及び基板処理方法 |
KR100675558B1 (ko) * | 2005-06-02 | 2007-02-02 | 세메스 주식회사 | 웨이퍼의 직경을 측정할 수 있는 장치 및 방법 |
JP2007073761A (ja) | 2005-09-07 | 2007-03-22 | Sumitomo Electric Ind Ltd | 窒化物半導体基板及び窒化物半導体基板の加工方法 |
JP4877938B2 (ja) * | 2006-05-26 | 2012-02-15 | 株式会社神戸製鋼所 | 直径測定装置 |
DE102006037267B4 (de) * | 2006-08-09 | 2010-12-09 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben mit hochpräzisem Kantenprofil |
JP4809744B2 (ja) * | 2006-09-19 | 2011-11-09 | 東京エレクトロン株式会社 | ウエハの中心検出方法及びその方法を記録した記録媒体 |
JP4262285B2 (ja) | 2007-07-18 | 2009-05-13 | 株式会社コベルコ科研 | 形状測定装置,形状測定方法 |
JP4388576B2 (ja) | 2007-12-03 | 2009-12-24 | 株式会社コベルコ科研 | 形状測定装置 |
JP4316643B2 (ja) * | 2007-12-26 | 2009-08-19 | 株式会社コベルコ科研 | 形状測定装置,形状測定方法 |
JP4734398B2 (ja) * | 2008-12-04 | 2011-07-27 | 株式会社コベルコ科研 | 形状測定装置,形状測定方法 |
JP5836223B2 (ja) | 2011-12-02 | 2015-12-24 | 株式会社神戸製鋼所 | 貼合基板の回転ズレ量計測装置、貼合基板の回転ズレ量計測方法、及び貼合基板の製造方法 |
JP6007889B2 (ja) | 2013-12-03 | 2016-10-19 | 信越半導体株式会社 | 面取り加工装置及びノッチレスウェーハの製造方法 |
CN115876106A (zh) * | 2022-12-15 | 2023-03-31 | 西安奕斯伟材料科技有限公司 | 一种硅片直径的测量方法、装置及计算机存储介质 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59214554A (ja) * | 1983-05-17 | 1984-12-04 | Daiichi Seiki Kk | ウエハ−の面取り研削装置 |
JPS60104644A (ja) * | 1983-11-08 | 1985-06-10 | Mitsubishi Metal Corp | ウエハ−の外周研削・面取装置 |
US5350899A (en) * | 1992-04-15 | 1994-09-27 | Hiroichi Ishikawa | Semiconductor wafer temperature determination by optical measurement of wafer expansion in processing apparatus chamber |
JPH0613962B2 (ja) * | 1985-08-14 | 1994-02-23 | 日立電子株式会社 | Icウエハの自動位置決め装置 |
US4853880A (en) * | 1985-08-23 | 1989-08-01 | Canon Kabushiki Kaisha | Device for positioning a semi-conductor wafer |
US4638601A (en) * | 1985-11-04 | 1987-01-27 | Silicon Technology Corporation | Automatic edge grinder |
JPS62214310A (ja) * | 1986-03-17 | 1987-09-21 | Toshiba Seiki Kk | ウエハ外径の検出方法 |
JPS6316959A (ja) * | 1986-07-03 | 1988-01-23 | Sumikura Kogyo Kk | ウエハ−の面取り研摩装置 |
JPS6381940A (ja) * | 1986-09-26 | 1988-04-12 | Hitachi Ltd | ウエハの厚さ測定方法 |
FR2615343A1 (fr) * | 1987-05-15 | 1988-11-18 | Telsa Inf | Procede et appareil de videogrammetrie |
US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
JPH04105006A (ja) * | 1990-08-24 | 1992-04-07 | Tokyo Seimitsu Co Ltd | 非接触測定装置 |
JP2874795B2 (ja) * | 1990-09-19 | 1999-03-24 | 株式会社ニデック | オリエンテーションフラット検出装置 |
JP2939665B2 (ja) * | 1991-03-04 | 1999-08-25 | 東京エレクトロン株式会社 | 半導体ウエハの測定方法 |
JPH0637170A (ja) * | 1992-07-15 | 1994-02-10 | Fujitsu Ltd | ウェーハアライメント方法及び装置 |
JP2554432B2 (ja) * | 1992-11-20 | 1996-11-13 | 住友シチックス株式会社 | 半導体ウエーハの外周面加工装置 |
-
1994
- 1994-01-27 JP JP6023582A patent/JP3035690B2/ja not_active Expired - Fee Related
-
1995
- 1995-01-17 US US08/373,036 patent/US5555091A/en not_active Expired - Fee Related
- 1995-01-19 KR KR1019950000866A patent/KR0185782B1/ko not_active IP Right Cessation
- 1995-01-25 EP EP95100988A patent/EP0665576B1/de not_active Expired - Lifetime
- 1995-01-25 DE DE69526813T patent/DE69526813T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3035690B2 (ja) | 2000-04-24 |
KR0185782B1 (ko) | 1999-05-15 |
JPH07218228A (ja) | 1995-08-18 |
EP0665576B1 (de) | 2002-05-29 |
KR950034318A (ko) | 1995-12-28 |
EP0665576A3 (de) | 1997-05-28 |
DE69526813T2 (de) | 2002-09-12 |
US5555091A (en) | 1996-09-10 |
EP0665576A2 (de) | 1995-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |