DE69526038D1 - Drahtgittersäge und Sägeverfahren - Google Patents

Drahtgittersäge und Sägeverfahren

Info

Publication number
DE69526038D1
DE69526038D1 DE69526038T DE69526038T DE69526038D1 DE 69526038 D1 DE69526038 D1 DE 69526038D1 DE 69526038 T DE69526038 T DE 69526038T DE 69526038 T DE69526038 T DE 69526038T DE 69526038 D1 DE69526038 D1 DE 69526038D1
Authority
DE
Germany
Prior art keywords
wire mesh
sawing process
saw
mesh saw
sawing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69526038T
Other languages
English (en)
Other versions
DE69526038T2 (de
Inventor
Tadashi Shiki-Gun Tonegawa
Junzo Wakuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31162494A external-priority patent/JP3143570B2/ja
Priority claimed from JP06812595A external-priority patent/JP3163231B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69526038D1 publication Critical patent/DE69526038D1/de
Publication of DE69526038T2 publication Critical patent/DE69526038T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
DE69526038T 1994-12-15 1995-12-14 Drahtgittersäge und Sägeverfahren Expired - Lifetime DE69526038T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31162494A JP3143570B2 (ja) 1994-12-15 1994-12-15 マルチワイヤーソー
JP06812595A JP3163231B2 (ja) 1995-03-27 1995-03-27 マルチワイヤーソー装置及びこれを用いたスライス方法

Publications (2)

Publication Number Publication Date
DE69526038D1 true DE69526038D1 (de) 2002-05-02
DE69526038T2 DE69526038T2 (de) 2002-10-31

Family

ID=26409358

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69526038T Expired - Lifetime DE69526038T2 (de) 1994-12-15 1995-12-14 Drahtgittersäge und Sägeverfahren

Country Status (3)

Country Link
US (1) US5715806A (de)
EP (1) EP0716910B1 (de)
DE (1) DE69526038T2 (de)

Families Citing this family (37)

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CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
JPH09272119A (ja) * 1996-04-04 1997-10-21 Daido Hoxan Inc ウエハの製法およびそれに用いる装置
JPH09286021A (ja) * 1996-04-22 1997-11-04 Komatsu Electron Metals Co Ltd 半導体インゴットの切断方法
JPH1022244A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハの洗浄用バスケット
JP3273163B2 (ja) * 1996-09-06 2002-04-08 シャープ株式会社 マルチワイヤソー
US5878737A (en) * 1997-07-07 1999-03-09 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US6024080A (en) * 1997-07-07 2000-02-15 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
KR20010021539A (ko) * 1997-07-07 2001-03-15 존 비. 호드스덴 다이아몬드 함유 와이어를 이용하여 작업물을 얇게절단하기 위한 장치 및 방법
US6279564B1 (en) 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
JP3625408B2 (ja) * 1999-03-09 2005-03-02 シャープ株式会社 マルチワイヤソーを用いた加工方法
US6112738A (en) * 1999-04-02 2000-09-05 Memc Electronics Materials, Inc. Method of slicing silicon wafers for laser marking
US6915796B2 (en) * 2002-09-24 2005-07-12 Chien-Min Sung Superabrasive wire saw and associated methods of manufacture
CH696807A5 (fr) * 2003-01-13 2007-12-14 Hct Shaping Systems S A Dispositif de sciage par fil.
CH698391B1 (fr) * 2003-12-17 2009-07-31 Applied Materials Switzerland Dispositif de sciage par fil.
CN1938136A (zh) * 2004-03-30 2007-03-28 索拉克斯有限公司 用于切割超薄硅片的方法和装置
KR100667690B1 (ko) * 2004-11-23 2007-01-12 주식회사 실트론 웨이퍼 슬라이싱 방법 및 장치
DE102005028112A1 (de) * 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung
DE102006050330B4 (de) * 2006-10-25 2009-10-22 Siltronic Ag Verfahren zum gleichzeitigen Auftrennen von wenigstens zwei zylindrischen Werkstücken in eine Vielzahl von Scheiben
DE102007028439A1 (de) 2007-06-18 2008-12-24 Schott Ag Verfahren zum Abtrennen einer Mehrzahl von Halbleiterscheiben von einem Halbleitermaterial-Rohblock
US7909678B2 (en) * 2007-08-27 2011-03-22 Schott Ag Method for manufacturing silicone wafers
US20100300259A1 (en) * 2009-05-29 2010-12-02 Applied Materials, Inc. Substrate side marking and identification
EP2477777A1 (de) * 2009-09-18 2012-07-25 Applied Materials, Inc. Werkstückauflagevorrichtung für eine drahtsäge, distanzstück für die auflage und sägeverfahren damit
TW201112317A (en) * 2009-09-22 2011-04-01 Ching Hung Machinery & Electric Ind Co Ltd Serial multi-thread saw crystal slicing device
CN102172996B (zh) * 2011-02-14 2014-09-24 上海日进机床有限公司 浸晶切割方法
JP2013038116A (ja) * 2011-08-04 2013-02-21 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶基板の製造方法
DE102011090053A1 (de) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles
US20130251940A1 (en) * 2012-03-23 2013-09-26 Sheng Sun Method of cutting an ingot for solar cell fabrication
WO2013153691A1 (ja) * 2012-04-12 2013-10-17 三菱電機株式会社 ワイヤ放電加工装置およびこれを用いた半導体ウエハの製造方法
CN102941628B (zh) * 2012-07-31 2014-12-24 南通皋鑫电子股份有限公司 二极管硅叠切割工艺及其专用工装
CN103878891A (zh) * 2012-12-24 2014-06-25 九州方园新能源股份有限公司 一种设有倒角导向条的硅棒
DE102013202028A1 (de) * 2013-02-07 2014-08-07 Robert Bosch Gmbh Verfahren zum Herstellen von Wafern, insbesondere von Wafern für Solarzellen, und Vorrichtung zum Herstellen von Wafern
CN105216127B (zh) * 2015-08-28 2017-07-07 厦门钨业股份有限公司 多线切割方法及多线切割机
JP6249319B1 (ja) * 2017-03-30 2017-12-20 パナソニックＩｐマネジメント株式会社 ソーワイヤー及び切断装置
CN108638353A (zh) * 2017-05-24 2018-10-12 林晓丽 利用金刚线切割的设备
JP6751900B2 (ja) * 2018-01-29 2020-09-09 パナソニックＩｐマネジメント株式会社 金属線及びソーワイヤー
CN111361030B (zh) * 2020-04-24 2021-11-23 西安奕斯伟材料科技有限公司 多线切割装置及多线切割方法
CN113752402B (zh) * 2021-09-16 2022-07-12 广东金湾高景太阳能科技有限公司 一种大尺寸硅片提料划伤亮线的解决方法

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US1619128A (en) * 1923-12-17 1927-03-01 Uline Ice Scoring Machine Comp Ice-scoring machine
US2024715A (en) * 1934-11-21 1935-12-17 William C Bonnett Apparatus for making button blanks from pearl stock
US3032026A (en) * 1959-07-18 1962-05-01 Bosch Gmbh Robert Device for slicing semiconductor crystals and the like
US3540427A (en) * 1968-06-14 1970-11-17 Ibm Electro-optic array and method of making same
US3599623A (en) * 1969-09-02 1971-08-17 Fairchild Camera Instr Co Cutting apparatus for making finely controlled cuts utilizing a tiltable wheel for regulating the cutting blade movement
SU715345A1 (ru) * 1977-11-02 1980-02-15 Всесоюзный Научно-Исследовательский И Проектно-Изыскательский Институт По Проблемам Добычи Транспорта И Переработки Минерального Сырья В Промышленности Строительных Материалов Способ изготовлени бортового камн
US4287869A (en) * 1978-03-13 1981-09-08 Crystal Systems Inc. Charging system for cutting blade
US4625093A (en) * 1984-08-14 1986-11-25 Massachusetts Institute Of Technology Stock removal by laser cutting
JPS61182761A (ja) * 1985-02-07 1986-08-15 Sumitomo Metal Ind Ltd ワイヤソーにおけるウェハ列の一括取出方法
US4655191A (en) * 1985-03-08 1987-04-07 Motorola, Inc. Wire saw machine
JP2673544B2 (ja) * 1988-06-14 1997-11-05 株式会社日平トヤマ 脆性材料の切断方法
US5054626A (en) * 1990-09-13 1991-10-08 George Stempinski Storage rack
JPH0790547B2 (ja) * 1990-11-01 1995-10-04 住友金属工業株式会社 マルチワイヤソーによる切断方法
JP2551229B2 (ja) * 1990-11-01 1996-11-06 住友金属工業株式会社 マルチワイヤソーによる切断方法およびその装置
DE4134110A1 (de) * 1991-10-15 1993-04-22 Wacker Chemitronic Verfahren zum rotationssaegen sproedharter werkstoffe, insbesondere solcher mit durchmessern ueber 200 mm in duenne scheiben vermittels innenlochsaege und vorrichtung zur durchfuehrung des verfahrens
JP3325676B2 (ja) * 1993-11-29 2002-09-17 シャープ株式会社 シリコンインゴットのスライス加工方法

Also Published As

Publication number Publication date
EP0716910A3 (de) 1997-05-02
EP0716910B1 (de) 2002-03-27
US5715806A (en) 1998-02-10
DE69526038T2 (de) 2002-10-31
EP0716910A2 (de) 1996-06-19

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