CN111361030B - 多线切割装置及多线切割方法 - Google Patents
多线切割装置及多线切割方法 Download PDFInfo
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- CN111361030B CN111361030B CN202010332487.9A CN202010332487A CN111361030B CN 111361030 B CN111361030 B CN 111361030B CN 202010332487 A CN202010332487 A CN 202010332487A CN 111361030 B CN111361030 B CN 111361030B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
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Priority Applications (1)
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CN202010332487.9A CN111361030B (zh) | 2020-04-24 | 2020-04-24 | 多线切割装置及多线切割方法 |
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CN202010332487.9A CN111361030B (zh) | 2020-04-24 | 2020-04-24 | 多线切割装置及多线切割方法 |
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CN111361030A CN111361030A (zh) | 2020-07-03 |
CN111361030B true CN111361030B (zh) | 2021-11-23 |
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CN202010332487.9A Active CN111361030B (zh) | 2020-04-24 | 2020-04-24 | 多线切割装置及多线切割方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111906953B (zh) * | 2020-08-04 | 2022-03-25 | 西安奕斯伟材料科技有限公司 | 一种切割装置 |
CN112590032B (zh) * | 2020-12-03 | 2022-12-02 | 天津市环智新能源技术有限公司 | 一种太阳能硅片及其粗糙度控制方法 |
CN113119327B (zh) * | 2021-04-25 | 2023-04-14 | 宁夏中欣晶圆半导体科技有限公司 | 能够改善<111>晶向晶棒切割warp值的定向多线切割方法 |
CN114953229A (zh) * | 2022-06-30 | 2022-08-30 | 青岛高测科技股份有限公司 | 一种线切割机的复合加工方法 |
CN116118021B (zh) * | 2023-01-17 | 2023-10-17 | 丹东新东方晶体仪器有限公司 | 一种晶棒自动粘接设备 |
CN116587451B (zh) * | 2023-06-21 | 2024-01-26 | 苏州博宏源机械制造有限公司 | 一种半导体晶圆材料加工装置及方法 |
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JPH04337635A (ja) * | 1991-05-14 | 1992-11-25 | Yuuha Mikakutou Seimitsu Kogaku Kenkyusho:Kk | 切断及び溝切り用電極構造体 |
DE69526038T2 (de) * | 1994-12-15 | 2002-10-31 | Sharp Kk | Drahtgittersäge und Sägeverfahren |
CN103240805A (zh) * | 2012-02-09 | 2013-08-14 | 硅电子股份公司 | 从工件同时切割多个切片的设备和方法 |
CN204249125U (zh) * | 2014-11-27 | 2015-04-08 | 乐山新天源太阳能科技有限公司 | 硅棒切割装置 |
CN106042202A (zh) * | 2016-06-22 | 2016-10-26 | 广州市昊志机电股份有限公司 | 一种晶片切割机 |
CN205915538U (zh) * | 2015-10-08 | 2017-02-01 | 环球晶圆股份有限公司 | 用于晶棒角度定向的治具 |
CN106553276A (zh) * | 2016-10-21 | 2017-04-05 | 北京鼎泰芯源科技发展有限公司 | 一种碳化硅晶体偏角度加工的定向夹具 |
CN106738402A (zh) * | 2017-01-22 | 2017-05-31 | 浙江理工大学 | 一种将薄硅片等厚度分切的夹具及其应用方法 |
CN107427986A (zh) * | 2015-05-01 | 2017-12-01 | 信越半导体株式会社 | 线锯装置 |
CN109501017A (zh) * | 2017-09-15 | 2019-03-22 | 浙江集英精密机器有限公司 | 晶体硅卸料装置、晶体硅截断机及晶体硅截断方法 |
CN109571788A (zh) * | 2018-02-28 | 2019-04-05 | 福州大学 | 一种带有随动升降过滤溶液箱的金刚石线锯切割设备 |
CN109702912A (zh) * | 2019-01-17 | 2019-05-03 | 安徽华顺半导体发展有限公司 | 一种多晶硅锭加工用匀速切片装置 |
CN110065171A (zh) * | 2019-04-25 | 2019-07-30 | 西安奕斯伟硅片技术有限公司 | 一种切割装置和晶棒的切割方法 |
CN209381170U (zh) * | 2018-11-16 | 2019-09-13 | 福州天瑞线锯科技有限公司 | 一种单晶硅棒开方机 |
CN209580131U (zh) * | 2018-12-26 | 2019-11-05 | 福州天瑞线锯科技有限公司 | 一种单晶硅棒加工装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7735685B2 (en) * | 2003-05-09 | 2010-06-15 | Intellipack | Dispensing system with in line chemical pump system |
CN102172997B (zh) * | 2011-02-14 | 2014-09-24 | 上海日进机床有限公司 | 硅晶体线切割设备 |
CN103489752A (zh) * | 2013-09-26 | 2014-01-01 | 中国科学院半导体研究所 | 截面为多边形的晶棒及衬底片表面取向的标识方法 |
ES2542729B1 (es) * | 2014-12-10 | 2016-03-16 | Materials Brecor, S.L. | Mesa de trabajo |
TWI632039B (zh) * | 2016-02-19 | 2018-08-11 | 友達晶材股份有限公司 | Wafer slicer and its wheel structure and wafer slicing method |
CN108724495B (zh) * | 2017-04-24 | 2020-04-10 | 上海新昇半导体科技有限公司 | 硅片切割装置 |
-
2020
- 2020-04-24 CN CN202010332487.9A patent/CN111361030B/zh active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04337635A (ja) * | 1991-05-14 | 1992-11-25 | Yuuha Mikakutou Seimitsu Kogaku Kenkyusho:Kk | 切断及び溝切り用電極構造体 |
DE69526038T2 (de) * | 1994-12-15 | 2002-10-31 | Sharp Kk | Drahtgittersäge und Sägeverfahren |
CN103240805A (zh) * | 2012-02-09 | 2013-08-14 | 硅电子股份公司 | 从工件同时切割多个切片的设备和方法 |
CN204249125U (zh) * | 2014-11-27 | 2015-04-08 | 乐山新天源太阳能科技有限公司 | 硅棒切割装置 |
CN107427986A (zh) * | 2015-05-01 | 2017-12-01 | 信越半导体株式会社 | 线锯装置 |
CN205915538U (zh) * | 2015-10-08 | 2017-02-01 | 环球晶圆股份有限公司 | 用于晶棒角度定向的治具 |
CN106042202A (zh) * | 2016-06-22 | 2016-10-26 | 广州市昊志机电股份有限公司 | 一种晶片切割机 |
CN106553276A (zh) * | 2016-10-21 | 2017-04-05 | 北京鼎泰芯源科技发展有限公司 | 一种碳化硅晶体偏角度加工的定向夹具 |
CN106738402A (zh) * | 2017-01-22 | 2017-05-31 | 浙江理工大学 | 一种将薄硅片等厚度分切的夹具及其应用方法 |
CN109501017A (zh) * | 2017-09-15 | 2019-03-22 | 浙江集英精密机器有限公司 | 晶体硅卸料装置、晶体硅截断机及晶体硅截断方法 |
CN109571788A (zh) * | 2018-02-28 | 2019-04-05 | 福州大学 | 一种带有随动升降过滤溶液箱的金刚石线锯切割设备 |
CN209381170U (zh) * | 2018-11-16 | 2019-09-13 | 福州天瑞线锯科技有限公司 | 一种单晶硅棒开方机 |
CN209580131U (zh) * | 2018-12-26 | 2019-11-05 | 福州天瑞线锯科技有限公司 | 一种单晶硅棒加工装置 |
CN109702912A (zh) * | 2019-01-17 | 2019-05-03 | 安徽华顺半导体发展有限公司 | 一种多晶硅锭加工用匀速切片装置 |
CN110065171A (zh) * | 2019-04-25 | 2019-07-30 | 西安奕斯伟硅片技术有限公司 | 一种切割装置和晶棒的切割方法 |
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Effective date of registration: 20211027 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |