TWI284073B - Wire saw - Google Patents

Abstract

To provide a wire saw capable of preventing adverse influence on semiconductor ingot cutting in a vibration transmission large part of a wire. A semiconductor ingot 22 formed in a columnar shape is adhered to a slice table 44. A side protector 22a composed of a material cuttable by the wire of a wire saw, is also adhered to an end surface of the semiconductor ingot 22. The wire traveling in an ingot cutting part is stabilized by absorbing vibration of the wire in an end part of the semiconductor ingot by the side protector 22a.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the use of steel wire for cutting a workpiece, silver, and more particularly to a semiconductor ingot (for example, a single crystal stone ^ Wire saws for thin sectioning of workpieces such as single crystals and compound semiconductors such as gallium arsenide, and protectors for preventing vibration of steel wires. [Prior Art] In recent years, wire sawing of semiconductor ingot slicing or production of S〇lar cell for solar cells has been carried out from the viewpoint of productivity improvement, and further productivity is required (for example, refer to Patent Document 1) . Fig. 1 is a conceptual diagram showing the path of a steel wire which is a general wire saw which is formed into a crystal circular shape as a semiconductor ingot of a workpiece. As shown in Fig. 12, the jigsaw 51 is provided with the following components, the take-up reel 52, the steel wire 53, which is taken out from the take-up reel 52, and the side steel wire travel path 55 is taken out, and is formed by a plurality of guide wheels 54; The tension mechanism 56 is disposed at the middle of the extraction side steel wire walking Lulu 55, and is given the tension of the steel wire 53; the three processing rollers π, 58 and 59 form a plurality of grooves at a fixed pitch (not shown); The steel wire array 60 is formed by sequentially winding the steel wire 53 in a spiral shape along the processing rollers 57, 58, 59; the winding side steel wire travel path 62 is formed by a plurality of guide rollers ;; the tension mechanism 63 is provided The tension of the steel wire 53 is applied to the middle of the winding side steel wire travel path 62, and the winding reel 64 is wound to wind the steel wire 53. Further, each of the reels 52 and 64 is connected to a motor (not shown) that is rotated in the forward and reverse directions, and the motor is driven in synchronization with each other. The steel wire 53 is on each reel 7054-6943-PF 5 1284073 52, 64. High-speed reciprocating walk. Then, the "舳φ Ώ ^ i ^ extraction" and "winding" operations of the respective reels 52, 64 are functionally switched by the reciprocating travel of the steel wire. In addition, since the steel wire 53 is worn out with the use of the steel wire, the white wire is supplied to the new wire in accordance with the predetermined ratio, and the worn steel corresponding to the length of the new wire to be supplied and twisted is added. The wire 53 is wound around the winding reel 64. On the other hand, above the steel wire array 60, the semiconductor ingot 65 as a workpiece to be sliced is placed so as to be movable up and down. In the state where the wire saw 5 is supplied with the slurry, the steel wire 53 is moved forward and backward in the line direction, and the semiconductor key is pressed against the steel wire 53 to make contact, and the semiconductor ingot 65 is cut. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. 022238. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION However, in the line 1 configured as described above, the steel wires 53 are retracted and retracted by the respective reels 52, 64. The vibration is transmitted to the steel wire 53, and particularly the vibration of the steel wire 53 wound around the both ends of the processing rollers 57, 58, 59 is large. Due to the vibration of the steel wire 53, it occurs near the two ends of the semiconductor coil 65: the sliced wafer has a problem that the cutting thickness is uneven or the cutting surface is not well cut. In particular, the dicing failure is remarkable at the end of the semiconductor 35 52 side. In order to shorten the processing time of the semiconductor ingot 65, as shown in Fig. ^: No, there is a line ore in which a plurality of semiconductor ingots 65 are simultaneously processed (Example Patent Document 2). Fig. 13(A) is the main line saw of the conventional wire saw. Fig. (8) shows the front view of the state of the ingot.

7054-6943-PF J284073 A plurality of semiconductor ingots 65 are arranged side by side in a suitable wire saw, and are attached to the intermediate plate 71 via a workpiece plate 72 and a slicing holder 3 extending in the axial direction of the semiconductor ingot 65. The slicing base 73 is made of a material having a substantially rectangular parallelepiped shape of carbon, glass, or plastic, and has a flat upper surface, and the lower surface of the semiconductor ingot 65 of the 1M main shape is curved and formed into a concave shape. The semi-V ingots 6 5 are fixed by the outer peripheral surface and the concave curved bottom of the slicing base 7 3 (4) by means of an adhesive or the like. Further, the upper surface of the slice holder 73 is adhered and fixed to the lower surface of the workpiece plate 72 by means of an adhesive or the like. The dicing block 73 is detached from the workpiece plate after the machining is completed by using the wire row to be n-added by the steel wire 5 and the semiconductor key μ. After the iron, the next new wafer holder 73 and the semiconductor coil 65 are adhered to the workpiece plate 72 together. However, in the case where the plurality of semiconductor ingots 65 are simultaneously sliced into a crystal-shaped moon/brother, due to the influence of the vibration of the above-mentioned steel wire, the wafers occurring near the semiconductor ingot occur in the sliced wafer. The problem of uneven cutting thickness or poor cutting of the cutting surface warpage. 65 bis: Fig. 14 does not 'saw a plurality of semiconductor ingots simultaneously, and may also have a length phase of each semiconductor ingot 65. ―妒, / ^ The end of the conductor ingot 65 is subjected to minute interrogation processing or the like. In this case, the steel wire which contacts the chamfered portion of the short semiconductor key 65 affects the other long semiconductor ingot 65. Cutting. Result I: (4) Arrangement of the average sentence of 6〇, which occurs if the target thickness is thicker: the wafer of the eve of the day... or the thin slice of the stomach 65b is not uniform thickness = the problem of poor warpage. ' ^ Surface, the above-mentioned steel wire vibration in the semiconductor block single processing or multi-machine

7054-6943-PF 7 1284073: In either case, the problem occurs in that the wafer after processing in the vicinity of both ends of the semiconductor ingot is detached from the slicing holder 73 (see Fig. 13). ...therefore, the inventors used the wire ore to slice the semiconductor ingots and round them, and the amount; the white | i $ hawthorn, the self-conducted two-faceted cutting position of the wafer In the graph of Fig. 15, when six semiconductor spins are sliced, the difference between the target thicknesses at the time of slicing is indicated, and the horizontal axis represents the position of the end face of the semiconductor spin. Τι〜τς主- From the position Τ"5 table is not from the semiconductor ingot winding volume a 64 side end face first piece (Τ1), first D1 month, U brother one piece (T2), ..., fifth piece (Τ5), 戸 and β5 represent the end face sheet (Β1), the second sheet (Β2), ..., the fifth sheet (Β5) from the side of the take-up reel 52 of the semiconductor ingot. As shown in the graph of the experimental results, as shown in the graph of the experimental results, it is known that the influence of the vibration transmission on the steel wire 53 is likely to occur at both end portions of the semiconductor ingot, in particular, the end portion of the reeling side of the reel. Further, although not shown in the graph of Fig. 15, the vibration of the steel wire is subsided near the center of the semiconductor key, and there is almost no influence on the cutting. In order to solve the above problems, a first object of the present invention is to provide a wire saw which can prevent the wafer from falling off from the slicing seat due to the vibration of the steel wire. Further, it is a first object of the present invention to provide a wire saw which can eliminate the poor cutting of the product during the cutting process. [Patent Document 2] JP-A No. 20 01-0 01 248 SUMMARY OF THE INVENTION In order to achieve the above object, a first invention of the present invention is a wire saw, which allows a jig to hold a workpiece to be close to a plurality of parallel steels. a wire, by which the workpiece is brought into contact with the steel wire, and the workpiece is cut, characterized in that at least one end surface of the workpiece is provided with a material configurable by the steel wire

7054-6943-PF 1284073 is a protector. According to the first invention, the damage caused by the large vibration of the steel wire is prevented from being adversely affected by the sacrificial protector. The wire ore according to the invention, the end face of the workpiece or the jig of the second invention of the present invention is characterized in that the protector is fixed to one of the added ones. According to the second invention, especially in the case where the protector is fixed to the end surface of the workpiece, since the sliced protector is naturally cut after being cut, it does not contact other cut wafers, thereby preventing the crystal from being cut. Cracks or gaps in the wafer caused by round contact. Further, the third invention of the present invention is the wire saw according to the second invention, characterized in that: (4) the adhesive fixes the protector; the hardening temperature of the adhesive is higher than that of the workpiece and the jig Sticky when used for bonding: low.

The hardening temperature of the adhesive on the mounting side protector is higher than the hardening temperature of the adhesive used when the workpiece is stuck to the jig, and is specifically aligned, The workpiece of the jig may be offset by the softening of the adhesive, but according to the third invention, since the hardening temperature of the adhesive to which the protector is attached is relatively low, the workpiece can be prevented from shifting. According to a fourth aspect of the present invention, in the wire saw of the first to third invention, the protector has a thickness of 3 to 20 mm, as shown in the fourth invention. Based on material, hardness and cutting

7054-6943-PF 9 •1284073 The length of the workpiece is set to a thickness of 3 to 2 〇 _, and the thickness of the protector can be used to compensate for the adverse effect on the workpiece by the required minimum thickness of the protector. Further, a fifth invention of the present invention is a protector for causing a jig holding a workpiece to approach a plurality of parallel steel wires and by causing the workpiece to contact the steel wire to cut the wire of the workpiece. In order to prevent the steel wire from vibrating, it is characterized in that it is composed of a material that can be cut by the steel wire, and is provided on at least one end surface of the workpiece.

According to the fifth invention, the adverse effect caused by the large vibration of the steel wire is prevented from being adversely affected by the workpiece itself by the sacrificial protector. According to a sixth aspect of the present invention, in the protector of the fifth aspect of the present invention, the shape of the adhesive portion of the end surface of the workpiece and the end surface or the cut of the workpiece are The same shape as the face. According to the sixth invention, the workpiece and the protector can make the contact timing of the steel wire substantially uniform, and the vibration from the steel wire can be more difficult to be transmitted to the workpiece side. Further, the seventh invention of the present invention is a spinning material which is subjected to a cutting process by contacting a plurality of parallel steel wires, and is characterized by a force: a material which can be cut by the steel wire is provided at at least an end surface of the mirror material. The protector that constitutes it. According to the seventh invention, the adverse effect caused by the large vibration of the steel wire is prevented from being adversely affected by the workpiece due to the sacrificial protector. Further, the eighth invention of the present invention is the ingot described in the seventh invention,

7054-6943-PF 10 1284073 • It is characterized in that the pair of the protector and the shape of the joint of the ingot and the surface of the bamboo are the same as the shape of the face or the cut surface. In the touch period, the younger eight inventions 'in the processed object and the protector can make the steel wire object - causing 'the vibration from the steel wire is more difficult to pass to the effect of the processed invention, right according to the invention' The vibration from the reel to the steel wire conveys the good object of the object itself. A more precise cutting is processed. [Embodiment] - Hereinafter, an embodiment of the wire saw of the present invention will be described with reference to Figs. [Embodiment 1] (Overall structure of the wire) First, the overall structure of the wire saw will be described using Figs. 1 to 4 . Figure 2 shows a perspective view of the wire saw, Figure 2 shows a front view of the wire saw, Figure 3 shows a right side view of the wire saw, and Figure 4 shows a plan view of the wire saw. As shown in Fig. 1, a crucible 12 is erected on the apparatus base U. In front of the column 12, the cutting mechanism 丄3 is mounted between the opposite pair of brackets 14. Further, a plurality of processing rollers 1 5, 1 β, and 17 are supported to be freely rotatable between the pair of brackets 14. The respective processing rollers ι 5, 16, 17 are spaced apart at a predetermined interval. Further, as shown in Fig. 2, a plurality of rings are formed on the outer circumferences of the processing rollers 15, 16, and 17 in accordance with a predetermined interval.

7054-6943-PF 11 J284073, slot..., old, 17a. Further, in Fig. 2, for the sake of easy understanding, the illustration of the steel wire 18 to be described later is omitted, and the number of the annular grooves 15a, 16a, and 17a is reduced as compared with the actual number. In each of the annular grooves i5a, 16a, and 17a of the processing rollers 15, 16, and π, the steel wire 18 composed of one wire is continuously spirally wound across the three processing rollers i5, i6, and π. Further, as shown in FIG. 4, the processing rollers 15, 16, and 17 are used by the steel wire running motor 19 disposed on the outer wall of the bracket 14 on the side of the bracket, and the +========================== The drive rotates. Then, by the rotation of the processing rollers 15, 16, and 17, the steel wire 18 travels at a predetermined speed to travel the steel wire 18 to repeat the quantitative advancement and the quantitative retreat, and by the whole, the feed is more than the retraction amount. Step forward. Further, on the steel wire 18, not only general steel wire materials (e.g., piano wires) but also fixed abrasive steel wires to which abrasive grains (e.g., diamond abrasive grains) are attached to the surface of the steel wire 18 may be used. A substantially cylindrical slurry supply nozzle 2A disposed in alignment with the upper processing rollers 15, 16 is disposed above the bracket 14. From the slurry supply nozzle 20, the steel wire 8 between the processing rollers i5 and j6 is supplied with an aqueous or oily slurry 16. In the present slurry, a slurry containing cerium free abrasive grains may be used, or a slurry containing oil or water containing no free abrasive grains may be used in the processing using a fixed abrasive steel wire. As shown in Fig. 1, above the processing rollers 15, 16, 17, the workpiece support mechanism 21 is freely moved up and down on the column 12, and the diameter of the two pieces made of hard and brittle material is about the lower part of the roller 12; The semiconductor key 22 of 5 mm is set to be parallel. On the front wall of the column 12, two guide rails 12a are arranged in the vertical direction.

7054-6943-PF 12 '1284073 : OK, in the present guide 9 12a, the workpiece branch mechanism 2 is combined and freely moved up and down, and the workpiece lifting motor 23 is arranged on the column 12, by controlling the rotation of the motor 23 'The ball mechanism 21 is not shown, and the structure 21 is moved up and down. The workpiece support mechanism 21 follows the up and down movement of the guide rail with the correct flatness.

On the other hand, during the operation of the wire saw, the steel wire 18 is reciprocated between the processing rollers 15, 16, and 17, and the workpiece branch mechanism a is lowered toward the steel wire u. ::: The slurry is supplied from the slurry supply nozzle 20 to the steel wire 18, and the hunter presses the semiconductor ingot 22 against the contact wire 18 to process the semiconductor wafer into a wafer. 4, a pair of reel mechanisms are installed behind the apparatus base 本. The reel mechanism 24 is provided with a take-up reel 25, and the steel wire 18 is taken out; and the winding reel 26 is wound, and the steel wire 18 is wound. . The reel-revolving motor 28', which is composed of a reel-revolving motor 28, which is constituted by a variable-steering and rotating-feeding motor, is attached to the apparatus base u, and the winding reel 25 and the winding reel 26 are connected to each of these motor shafts. The reel turning motors 27 and 28 are rotatable in the forward/reverse direction, and the reel turning motors 27 and 28 are rotated forward, and the winding wire 26 is wound around the winding reel 25 from the winding reel 25. Then, the reel turning motor 27 is reversed, the winding reel 26 is switched to the steel wire drawing side on the power reel, and the reel reel 25 is switched to the steel wire winding side. The steel wire j 8 is reciprocatingly worn and worn, and the new wire is appropriately supplied from the take-up reel 25, and the worn steel wire 18 corresponding to the length of the supplied new wire is wound around the winding reel 26. The traverse mechanism 29 is mounted on the apparatus base 11 adjacent to the reel mechanism 24, and is taken out from the steel wire 18 of the take-up reel 25 and reeled to the reel.

When the steel wire of the 7054-6943-PF 13 1284073 26 is wound, the edge is on the upper and lower sides. However, the two reels of the fine reel mechanism 24, the reel, the rotation of the 〇26, the self-extracting reel, the steel wire 18 is drawn to the cutting mechanism 13, the steel wire is processed and the steel wire is processed. 18 rolls, & in the winding reel 26.

As shown in FIG. 3, the tension maintaining mechanism 3 and the guiding mechanism structure 31 are disposed between the traverse machine, the broadcast 9 Q float, the transfer mechanism 29, and the cutting mechanism 13, and the cutting mechanism 13 is used for processing. Both sides of the steel wire 18 of the winding table 1 5, 16 6 and 17 are wound by the respective guide wheels 32 of the weir mechanism 31 so as to be able to be hung on the tension holding mechanism 30. In this case, "the tension is applied to the processing roller 15 and the steel wire U by the tension holding mechanism 30. The tension is maintained by the tension holding mechanism 30. 25, 26. Winding on the reel (workpiece mounting structure to the workpiece support mechanism) 2 = A = Fig. 6 and Fig. 6 illustrates the semiconductor ingot 22 processing the workpiece supporting machine piece into Fig. 5 (A) is to be processed The semiconductor ingot is cut into a front view of the main part of the linear defect of the B-shaped circle. 3 5 (8) The table firstly 'installs the semiconductor ingot 22 in the coil 22 via ... on the piece 38. When the semiconductor is mounted on the workpiece plate (10), the wafer holder 44 is covered with a glass, a plastic, and the like, and the semiconductor ingots such as a circular shape are embedded in the ship. Also less is the face ^ ritual ^ Gan Ren curved into a concave shape. In the cut and ice 2 workers, the magnetic conductor ingot 22, η, the outer surface and the slice i 〇 bend into a concave shape under the sticky Fixtures, etc. are fixed. Jude, Shanren "and profit..., after, hold the slice holder of the semiconductor ingot 22

7054-6943-PF 14 1284073 44 is fixed to the underside of the workpiece plate 38 by adhesion using an adhesive or the like. Further, when the slicing holder 44 performs the slicing of the semiconductor ingot 22 by the wire saw, it is partially cut by the steel wire 18 together with the semiconductor ingot 22, and is removed from the workpiece plate 38 after the processing. Then, the next new slicing holder and the semiconductor ingot 22 are adhered to the workpiece plate 38 together. And, as shown in FIG. 6, on both end faces of the semiconductor ingot 22, the adhesive side piece is attached to the solid side protector 22a, the side protector 22& and the slice holder 44 are γ-like, and carbon or glass, plastic, and enamel are used. Single crystal, ruthenium polycrystal, ceramics, emulsified boat, resin, etc. The steel wire 18 can be cut into a material (including a composite material which is composed of one or a main component thereof), which is slightly softer than the semiconductor ingot 22 Materials (including material density, etc.) constitute better. The material of the side protector 22a can be considered in consideration of the hardness of the material to be processed such as the semiconductor ingot 22, and the vibration of the steel wire 18 can be transmitted, and the deterioration prevention effect of the steel wire 18 is also considered to be good: The side protectors 22a >τ; ji / u have a substantially uniform shape and a wide shape and a U shape and a circular shape at the end of the semiconductor money 22, and the thick line 18 turns the semiconductor 22 into The steel sheet is processed into about 3::: degrees of the wafer in the day 0 shape. The thickness of the protector 22a is determined by the material, hardness, and the semiconductor key 22 of the cut. In order to prevent the influence of the vibration in the half: 18, as long as there is a thickness of about two, and two or more semiconductors (four) are cut at the same time, I:. The long-term production of a relatively long semiconductor ingot ° is also associated with 3, followed by thickness. ...the length of the longer semiconductor ingot plus the side protector ^ after the semiconductor coil 22 is stuck to the slice holder 44,

7054-6943-PF 15 1284073 is fixed to the peripheral end surface of the at least one end side protector 22a of the semiconductor ingot 22 by an adhesive or the like and is ν 乂 a cake surface. In addition, one part of the door's % face is also below 44. From the viewpoint of the slicing process = the interface is in the view of the slicing seat, it is better to point the side protector 22a to prevent the wafer from falling off after the it is processed, and the end face of the β ^ body coil 22 and the slicing seat are fixed 1 - In order to achieve the purpose of preventing the vibration of the steel wire, it is also possible to "attach the semiconductor ingot 22 to the semiconductor ingot 22." One of the kneading or slicing seats 44 is only bonded and fixed to the semiconductor ingot or the main surface or the slicing block. In the case of the Chinese side, it is better to fix it on the end face of the semiconductor ingot 22 of the semiconductor. The side protector 22a, which is fixed to the #έ, ΰ. month slice, is naturally dropped from the slicing seat 44 after the cutting, and shakes the Japanese priest in the squeaking brake; it is not swayed by the hanging block 44 and R and others The contact of the cut wafer can cause cracks or gaps in the wafer. The contact side protector 22a of the 曰曰® is also shown in Fig. 5 (8). Or, as shown in Fig. 6 (8), the sequel to the syllabus. In addition, as shown in Fig. 15 of the foregoing, the door 22 is not easily generated by the vibration of the steel wire at the end of the take-up reel side, and is provided in the semiconductor ingot 22 卯a only. ^The end face on the reel side is also available. When the semiconductor ingot 22 is adhered to the slicing holder 44, the device 22a is one of the main contacts and the side protection "a is adhered to the abundance conductor ingot 22 and the slicing holder ^, and the adhesive of π can be used as the material.枓 constitutes the adhesive. Specifically, the bismuth-type diepoxypropyl (five) is _, in the heart of the oxygen tree (double age, Zhuo. Bonding Weng in the steel wire 18 to cut the semi-conductive agent of the adhesive does not Will adhere to the steel wire 1δ ^JJ flat wild hardening type of bonding

7054-6943-PF 16 .1284073 Good: It is better to be hardened at room temperature as shown by the above resin. The semiconductor spinner 22 is adhered to the slicing holder 44, and it is confirmed that the semiconductor suspect 22 is on the crystallizing side, and the side protector 22a is attached after being mounted on the slicing holder 44 without deviation. In the half, the crystal orientation of the hinge 22 is measured after the laser beam is irradiated to the mirror material. Since the crystal orientation is difficult to measure after the side protector 22a is mounted, the side protector 22a is mounted after the semiconductor ingot is adhered to the slicing holder 44. better. In other words, the adhesive curing temperature of the dressing side protector 22a is preferably lower than that of the adhesive used when the ingot 22 is adhered to the cut seat 44. Because the curing temperature of the adhesive in the female side protection state 22a is higher than the hardening degree of the adhesive used when the semiconductor ingot 22 is stuck to the cutting seat 44, the adhesion is specifically aligned with the crystal orientation. The semiconductor ingots in the slicing holder 44 may be offset by softening of the adhesive. The side protector 22a is preferably dried faster than the adhesive of the adhesive semiconductor ingot 22 by the adhesive which adheres to the adhesive side protective benefit 22a after the semiconductor ingot 22 is adhered to the slicing holder 44. g, since the time until the adhesion to the side protector is short is fixed, the work time can be shortened even when the adhesive side semiconductor protector 22 is bonded to the side protector 2 2 a. Further, the workpiece plate 38 is fixed to the interlining plate via a fixing means such as a bolt. The intermediate plate 41 is fixed to the mounting plate 经由 via a washer 37 as shown in Fig. 3 . As shown in Fig. 1 and Fig. 2, the intrinsically safe skirt 42 has an approximately τ-shaped engagement wrist 42a' which protrudes to the left and right when viewed from the front. Further, the workpiece branching mechanism 21 is provided with two left and right locking portions 43ae, and the left and right locking portions are formed in a horizontal column shape extending horizontally from the rear surface plate 43b toward the front of the wire saw, and the lower surface of the engaging wrist is placed on the locking jaw 43a. Above. And, by the back panel

7054-6943-PF 17 , 1284073 The mounting plate 42 of the fixed semiconductor ingot 22 is pressed and mounted, and the fixing screw 45 is screwed into the mounting plate 2 position. This hole is fixed to the back plate 43b, and the mounting plate 42 is fixed to the teeth 21 formed by the jin. In other fixing methods, there is also a mechanism for using a pneumatic brake (the operation of the wire saw). ^ ^ Next, the operation of the wire saw constructed as described above is first described. First, the two-piece slicing holder for holding the semiconductor ingot 22 is prepared. So, standing under the workpiece plate 38. Then, if the axis of the two semiconductor coils 22 which are attached after the correction of the 日, ,, α, and the day-to-day orientation are parallel, the workpiece plate μ is mounted on the intermediate plate 4, and the side protector 22a is adhered and fixed. At both ends of the half body 22 and below the slice holder 44. At this stage, the fixed side protector 22a is bonded to correct the crystal orientation of the semiconductor ingot 22 with respect to the slicing holder and the workpiece plate 38. Then, the engaging arm 42a of the mounting plate 42 is placed on the locking portion 43a. Next, the mounting plate 42 is positioned at a predetermined position by pressing the mounting plate 42 against the back plate 43b. As shown in Fig. 2, the fixing screw 45 is screwed into the through hole formed in the mounting plate 42 and fixed to the back plate 43b, and the mounting plate 42 is fixed to the workpiece supporting mechanism 21. In this state, the slurry of the steel wire 18 between the processing rollers 15 and 16 is supplied from the slurry supply nozzle 2, and the processing rollers 15, 16 and 17 are rotated. And let the steel wire 18 move forward and backward in the line direction, and slice the semiconductor ingot into a crystal circle. In the case where a plurality of semiconductor coils 22 are sliced at the same time, the number of rotations of the processing rollers 15, 5, and 17 is set to be the same as that in the case of slicing one semiconductor ingot 22. However, while slicing

7054-6943-PF 18 1284073 When processing a plurality of semiconductor suspects 22, the steel wire is in the first embodiment, and the loss is fast. Therefore, the speed at which the new line is reached is set to be about 1.5 times that of the case of the ingot 22. In addition, the speed is set to cut Κ ★ τ ^ Under the dry fork grafting mechanism 21 sigh von slice processing i semiconductor ingots & - 〇» 4mm ~ 〇 · 8mm about 70%. Because of the month, the mother of the minute M, in the case of slicing 1 Chromium 7 c 半导体 semiconductor ingot 22, the need for a single β, the length of the 150-length, the month, and the equivalent of 6 hours, for η Α 150_ The semiconductor ingot 22 _ 疋 疋 同 同 同 同 同 同 同 同 同 同 同 同 同 同 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 On the 7th, the production efficiency of Rigu was improved. At this time, the motor from the reel rotation 27, 28 18, ★ the vibration of the steel 7 π - was transmitted to the steel wire. Figure 7 is not because of the semiconductor ingot 22 where 22a ^ , v Two 鳊 3 and side protection 隹彳 焱 焱 焱 焱 22a part of the vibration occurs. When the steel wire 18 reaches the both ends of the semiconductor coil 22, the vibration of the steel wire turns is stabilized, and the material can be unbiased. As a result, the 22-section is processed into a circular portion to prevent the wafer from being detached from the wafer holder 44 or poorly cut. Fig. 8 is a view showing the surface roughness of the cut surface of the cut surface of the case where the side protector is provided and the side surface of the cut surface is replaced with the surface of the cut surface of the case where the side surface of the cut surface is not provided. The horizontal axis represents the surface roughness, and the vertical axis represents the number of wafers sliced. As is apparent from the graph of Fig. 8, in the case where the side protector is provided, there is no wafer having a very poor surface roughness, and the entire pattern is located on the left side, and the surface roughness is improved as a whole. It is also known that, in the case where the side protector is not provided, the pattern is widened in the lateral direction, and the surface roughness is changed between the wafers; and in the case where the side protector is provided, the pattern is

7054-6943-PF 19 •1284073 is narrowed in the lateral direction, and the variation in surface roughness between wafers becomes small. As is apparent from the figure, by providing the side protector 22a of the present invention, the influence of vibration transmission is efficiently prevented. Next, after the semiconductor ingot is sliced into a wafer shape using the wire saw of the present invention, the cutting thickness of the wafer at the cutting position from both end faces of the semiconductor key is measured. The graph of Fig. 9 corresponds to Fig. 15 shown in the prior art. When the blade is machined with six semiconductor ingots, the vertical axis represents the difference in target thickness for the slicing process, and the horizontal axis represents the position from the end face of the semiconductor ingot. Τρτ5 indicates the first sheet (τι), the second sheet (Τ2), ..., the fifth sheet (Τ5) from the end surface of the winding reel 26 of the semiconductor ingot, and the horizontal axis δ Β5 indicates the self-extracting reel 25 The end face of the first piece (8)), the second piece (10), ..., the fifth piece (Β5). 2, as shown in the graph of Fig. 9, at both end portions (1) and Β1) of the semiconductor ingot 22, a sliced product located in a range substantially close to the target value can be obtained. From the end face side of the masking pad 25 side, a stable slice processing can also be obtained: □22. The pattern shown in Fig. 15 is compared with the '5 pieces of 附近® near the end face of the ingot; the king of the degree is close to the target value, The slicing process.,, the overall quality of the seat opening is improved. The pair of side protectors 22a are opposite to the semiconductor ingot 22, Weihe Ben >. The shape of the adhesive portion of the kneading surface is preferably the same shape of the end surface or the cutting surface of the body rotation 22. : As shown in the above embodiment, the shape of the bonding portion of the end face of the side protector 2 is set to * or the cutting surface is the same as the opening and closing y. . The contact period is the same, so that it can be from the surface: "Sleep" can make the semiconductor ingot 22 side. The vibration of the steel wire is difficult to pass to [Example 2]

7054-6943-PF 20 1284073 ^ Fig. 1 and Fig. 11 show a second embodiment of the wire saw of the present invention. Fig. 1 〇(A) is a side view of the main part of the wire saw which is processed into a circular shape as a workpiece, and Fig. 1 〇m main - u Cl 1 u U5) is a structure other than the fixed state of the ingot and the structure other than the structure of Fig. 1 and the embodiment i is qualitatively (4). The same configurations as those in Fig. 5 of the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. The shape of the wide protector 22a is substantially the same as that of the end shape of the semiconductor ingot 22 (the shape of the cut surface of the ingot in the case of chamfering) as described above.

From the viewpoint of preventing the wafer from falling off from the slicing seat after slicing, it is not necessary to have the same shape as the end face. In Fig. 10, on both end faces of Fengjianji #99 β τ dry conductor red 22, the solid side protector 2 2 b is adhered by an adhesive or the like. This side 佯 _ % 9 9 k Mountain ♦ w Baokou only state 22b and the same as the slice holder 44, from carbon or glass, plastic, 矽 έ έ 曰 and & ~ ^ early,,, day and day, polycrystalline, Ceramic, alumina, tree, and day-to-day steel wire 18 can be cut into the citrus clearing lane 1. The material is composed of shells (including composite materials with one or one of them as the main component), which is slightly softer than the hardness of the + conductor ingot 22 The material 枓 (including the material density, etc.) is preferably constructed. The material of the side protector 2 2 b σ^ ^ Consider the hardness accompanying the material properties of the workpiece such as the + conductor ingot 22, that is, the force mm, the vibration from the steel wire 18 is difficult to convey to the workpiece, and also The deterioration prevention effect of the steel wire 18 is better. Also, the front side of the side protector 2 2 b; industry JT / ι > up to ... surface shape formed a semi-circular shape, its thick sound is the use of steel wire 18 to process the semiconductor ingot 22 ^ and then into a crystal round shape The crystal η is about 3 to 15 pieces. The thickness of the semiconductor ingot 22 side protector 22b according to the material, the Japanese yen, and the thinner and cut. The τ prevents the wafer from falling off from the slicing seat caused by the vibration of the semi-conductive steel wire 18, as long as there is

7054-6943-PF 21 is like 4073, about 3~20· thickness. Further, in the case of the ingot 22, the length of the semiconductor ingot of two or more semiconductors may be added to the length of the semiconductor ingot, or the length of the thick conductor side of the comparator JUmin, and the pair of the holders 44 of the 22b. The semiconductor ingot 22 " surface has a front surface that is processed to have the same curvature. The front shape of the curved piece 22b is utilized by PT. That is, the end face protector 22b of the side protector is fixed to the opening of the lower surface of the semiconductor ingot 22, and the portion is also bonded and fixed at the same time. . However, in this configuration, the insert holder 44 is also prepared to be adhered to the workpiece plate %; and the two groups of the + conductor keys 22 are held under the bismuth double δ. In the case of the old nL splicer, if the axis of the two semiconductor ingots 22 of the pre-corrected knot becomes parallel, the workpiece plate 38 is mounted on the intermediate plate 41. Ding Xu will ^ ^ ^ This shape will The side protector 22b is bonded and fixed to the end surface of the semiconductor ingot 22 and below the slicing holder 44. Then, as shown in Fig. 2, the engaging wrists of the mounting plate 42 are placed on a stop portion 43a. Then, by attaching the board to the back panel, the women's board 42 is positioned at the predetermined position. As shown in FIG. 2, the fixing screw is inserted into the through hole formed by the women's plate 42 and fixed to the back panel 4, and the mounting plate 42 is fixed to the workpiece supporting mechanism 21. In this state, the slurry is supplied to the steel wire 18 between the processing rollers 15 and 16 by the slurry supply nozzle 2, and the processing rollers 15, 6 I? are rotated, and the steel wire is wound. 18 walking in the line direction, the semiconductor ingot 22 is sliced into a crystal circle. At this time, the side protector 22b is provided at both ends of the semiconductor ingot 22. In the latter half of the cutting process, since the vibration of the steel wire 18 is absorbed by the side protector 22b, the 7054-6943-PF 22.1284073 can be prevented from being near the end of the ingot. The wafer is detached from the slicing seat due to the vibration of the steel wire. > According to the invention described above, the side protector of the minimum required size is compensated for the adverse effect on the semiconductor ingot 22 of the workpiece. Industrial applicability]

Further, in the case of the above-described embodiment 1, a plurality of semiconductor ingots are used, but a case of a semiconductor ingot is processed. Further, it is not limited to a semiconductor ingot, and it may be a (block). And 2, it is explained that the simultaneous slicing process can of course be applied to the same slice, and the semiconductor ingot is taken as an example, but is used for the ingot made of another material. [Illustration of the drawing] FIG. 1 is an embodiment 1 of the present invention. A perspective view of a wire saw. Figure 2 is a front elevational view of a wire saw of an embodiment of the present invention. Figure 3 is an embodiment of the invention! The right side of the line mine: map. Figure 4 is a plan view of a wire saw of an embodiment of the present invention. Fig.: The main part of the wire saw of the coffee embodiment i: the front view of the state in which the ingot is not fixed. ϋ 5(B) Fig. 6(A) is a side protector diagram of the embodiment ,, Fig. 10(10) is a side protector of the embodiment ???==Heart system description FIG. 8 is a comparison of the present invention with a side protector The case and the absence of Fig. 7 show a perspective view of an embodiment of the present invention. Figure. The graph of the roughness of the section of the cattle conductor and the steel wire

7054-6943-PF 23 1284073 Fig. 9 is a graph showing the wafer thickness in the case where the both ends of the bovine conductor ingot are cut in the state in which the side trap, the emirate, and the edifice are set. Fig. 10(A) is a side elevational view of the main portion of the wire saw of the embodiment 2, showing a state in which the ingot is fixed. Fig. 1UA) is a side view of the side protector of the second embodiment, 駚闰^, an exploded view of the bonded state, and Fig. 11(B) is a side protector of the second embodiment. Fig. 13(A) is a schematic view of the main part of the conventional wire saw / a side view of the file, and Fig. 13(B) is not in the form of a steel wire path of the wire saw. In the line (4), the front view of the state of the ingot is fixed. Fig. 14 is an explanatory view showing the conventional wire saw. The relationship between the burdock body and the steel wire Fig. 1 shows the use of the previous child Qiu Ba & The wire thickness of the semiconductor ingot is cut by the wire saw. [Main component symbol description] 11 device base 12 column 1 2a guide 1 3 cutting mechanism 14 bracket 15, 16, 17 processing roller 15a ' 16a ' 17a Annular groove 1 8 Steel wire 1 9 Steel wire running motor 2 Slurry supply nozzle 21 Workpiece support mechanism 22 Semiconductor rotation (worked object) 22a, 22b side protector 2 3 Workpiece lifting motor 2 4 reel mechanism 2 5 reeling reel

7054-6943-PF 24 .1284073 • 2 6 winding reel 27, 28 reel turning motor 29 traverse mechanism 30 tension holding mechanism 31 guiding mechanism 32 guide wheel 37 washer 38 workpiece plate φ 39 middle of support member 41 Plate 42 mounting plate 42a engaging wrist 4 3 a locking portion 43b back plate 44 slicing seat (fixture) 45 fixing screw 瘫 51 wire saw 52 extraction reel 53 steel wire 54 guide wheel 55 extraction side steel wire walking road 56 tension mechanism 57, 58, 59 processing roller 60 steel wire row 61 guide wheel 6 2 winding side steel wire travel path 63 tension mechanism 64 winding reel 65 semiconductor ingot 6 5 a thick wafer 65b thin wafer 71 intermediate plate 7 2 workpiece plate 73 slice holder 7054-6943-PF 25

Claims (1)

.1284073 X. Patent application scope: A wire saw is used to ensure that the jig of the workpiece is close to a plurality of parallel steel wires. The hunting tool causes the workpiece to contact the steel wire to cut the workpiece, and is characterized in that: A protector composed of the steel wire cleavable material is disposed on at least one end surface of the workpiece. " 2. For example, in the line mine of claim 1, wherein the protection is fixed on the end face of the workpiece or one of the fixtures. 3. The wire saw according to claim 2, wherein the protector is fixed by bonding; "the hardening temperature of the drilled joint is higher than the adhesive used when the workpiece and the fixture are bonded. 。 4_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Having a plurality of parallel steel wires and cutting the steel wire by contacting the workpiece to: the wire saw for preventing the steel wire from vibrating, characterized in that: the wire can be cut by using the steel wire The material is configured to be disposed on at least one end surface of the workpiece. The protector of claim 5, wherein the protector has a shape of an adhesive portion of the end surface of the workpiece and The shape of the workpiece is the same as the face or the cut surface. 7· A kind of key material 'by cutting a plurality of parallel steel wires to cut 7054-6943-PF 26 • 1284073 force, which is characterized by: At least one end face of the material is composed of a material that can be cut with the steel wire Protector 8. patent scope ingot, Paragraph 7, the same shape of the bonding portion of the end face of the ingot ', the' plane of the edge protector on i. ~ Frit end surface of the classification or cutting 7054-6943-PF 27