DE69717536D1 - Drahtsäge - Google Patents

Drahtsäge

Info

Publication number
DE69717536D1
DE69717536D1 DE69717536T DE69717536T DE69717536D1 DE 69717536 D1 DE69717536 D1 DE 69717536D1 DE 69717536 T DE69717536 T DE 69717536T DE 69717536 T DE69717536 T DE 69717536T DE 69717536 D1 DE69717536 D1 DE 69717536D1
Authority
DE
Germany
Prior art keywords
wire saw
saw
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69717536T
Other languages
English (en)
Other versions
DE69717536T2 (de
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
HCT Shaping Systems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HCT Shaping Systems SA filed Critical HCT Shaping Systems SA
Application granted granted Critical
Publication of DE69717536D1 publication Critical patent/DE69717536D1/de
Publication of DE69717536T2 publication Critical patent/DE69717536T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Sawing (AREA)
DE69717536T 1996-05-23 1997-05-16 Drahtsäge Expired - Lifetime DE69717536T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01295/96A CH690907A5 (fr) 1996-05-23 1996-05-23 Dispositif de sciage par fil

Publications (2)

Publication Number Publication Date
DE69717536D1 true DE69717536D1 (de) 2003-01-16
DE69717536T2 DE69717536T2 (de) 2003-08-21

Family

ID=4207094

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69717536T Expired - Lifetime DE69717536T2 (de) 1996-05-23 1997-05-16 Drahtsäge

Country Status (5)

Country Link
US (1) US5913305A (de)
EP (1) EP0808701B1 (de)
JP (1) JPH1080854A (de)
CH (1) CH690907A5 (de)
DE (1) DE69717536T2 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3984655B2 (ja) * 1997-05-07 2007-10-03 アシュセテ シェーピング システムズ ソシエテ アノニム 少なくとも２層の糸の角交差を利用した薄片カット用の糸によるスライス装置
US6333377B1 (en) * 1999-03-08 2001-12-25 A&A Material Corporation Ingot support device for slicing silicon
AU2000251024A1 (en) 2000-05-31 2001-12-11 Memc Electronic Materials S.P.A. Wire saw and process for slicing multiple semiconductor ingots
CH697024A5 (fr) * 2000-09-28 2008-03-31 Hct Shaping Systems Sa Dispositif de sciage par fil.
DE10052154A1 (de) * 2000-10-20 2002-05-08 Freiberger Compound Mat Gmbh Verfahren und Vorrichtung zum Trennen von Einkristallen, Justiervorrichtung und Testverfahren zum Ermitteln einer Orientierung eines Einkristalls für ein derartiges Verfahren
JP2003071703A (ja) * 2001-09-05 2003-03-12 Seiko Instruments Inc 多段式微小孔加工方法および装置
JP4874262B2 (ja) * 2004-12-10 2012-02-15 フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング ワイヤーソーイング方法
EP2165805A4 (de) * 2007-06-27 2014-02-12 Mitsubishi Electric Corp Mehrdrahtsäge und verfahren zum schneiden von barren
JP2010023225A (ja) * 2008-06-20 2010-02-04 Komatsu Ntc Ltd ワイヤソー
US20100126488A1 (en) * 2008-11-25 2010-05-27 Abhaya Kumar Bakshi Method and apparatus for cutting wafers by wire sawing
IT1393227B1 (it) * 2009-02-27 2012-04-11 Bidese Dispositivo di protezione per macchine multifilo per il taglio di materiali lapidei, nonche' macchina multiutensile comprendente tale dispositivo.
RU2569254C2 (ru) 2009-08-14 2015-11-20 Сэнт-Гобэн Эбрейзивс, Инк. Абразивное изделие
RU2508968C2 (ru) 2009-08-14 2014-03-10 Сэнт-Гобэн Эбрейзивс, Инк. Абразивное изделие (варианты) и способ его формирования
TW201507812A (zh) 2010-12-30 2015-03-01 Saint Gobain Abrasives Inc 磨料物品及形成方法
US9375826B2 (en) 2011-09-16 2016-06-28 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
CN103842132A (zh) 2011-09-29 2014-06-04 圣戈班磨料磨具有限公司 包括粘结到具有阻挡层的长形基底本体上的磨料颗粒的磨料制品、及其形成方法
CN102626805A (zh) * 2012-02-14 2012-08-08 上海五同机械制造有限公司 一种线切割机工作台
KR101385665B1 (ko) * 2012-04-27 2014-04-21 한국생산기술연구원 잉곳의 스윙 중심축의 정렬이 용이하도록 구조가 개선된 잉곳 스윙방식의 와이어 쏘
EP2664402A1 (de) * 2012-05-18 2013-11-20 Meyer Burger AG Drahtsäge und Verfahren zum Schneiden von Werkstücken, insbesondere von Werkstücken aus hartem und sprödem Material
TWI474889B (zh) 2012-06-29 2015-03-01 Saint Gobain Abrasives Inc 研磨物品及形成方法
TWI477343B (zh) 2012-06-29 2015-03-21 Saint Gobain Abrasives Inc 研磨物品及形成方法
TW201404527A (zh) 2012-06-29 2014-02-01 Saint Gobain Abrasives Inc 研磨物品及形成方法
TW201402274A (zh) 2012-06-29 2014-01-16 Saint Gobain Abrasives Inc 研磨物品及形成方法
TW201441355A (zh) 2013-04-19 2014-11-01 Saint Gobain Abrasives Inc 研磨製品及其形成方法
DE102013219900B3 (de) * 2013-10-01 2015-02-26 Siltronic Ag Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
EP2933049A1 (de) * 2014-04-17 2015-10-21 Applied Materials Switzerland Sàrl Drahtführungsüberwachungsvorrichtung und Verfahren zur Überwachung eines Führungsdrahts
US9205572B1 (en) * 2014-05-28 2015-12-08 National Tsing Hua University Ingot cutting method capable of reducing wafer damage percentage
EP3098008A1 (de) * 2015-05-29 2016-11-30 Meyer Burger AG Verfahren zur anordnung eines schnittdrahts
TWI621505B (zh) 2015-06-29 2018-04-21 聖高拜磨料有限公司 研磨物品及形成方法
CN105235077B (zh) * 2015-09-30 2016-11-23 浙江辉弘光电能源有限公司 一种金刚线切割机用轴辊固定装置
US11276577B2 (en) * 2019-03-21 2022-03-15 Samuel Messinger Longitudinal silicon ingot slicing apparatus
CN111251158A (zh) * 2020-03-26 2020-06-09 义乌工商职业技术学院 一种建筑工程用瓷砖切断装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3831576A (en) * 1971-11-22 1974-08-27 Motorola Inc Machine and method for cutting brittle materials using a reciprocating cutting wire
JPH0626787B2 (ja) * 1987-06-15 1994-04-13 日本鉱業株式会社 切断装置における傾き検出方法
JP2673544B2 (ja) * 1988-06-14 1997-11-05 株式会社日平トヤマ 脆性材料の切断方法
JP2516717B2 (ja) * 1991-11-29 1996-07-24 信越半導体株式会社 ワイヤソ―及びその切断方法
JP2639270B2 (ja) * 1991-12-19 1997-08-06 住友金属工業株式会社 ワイヤソーによる切断方法
CH690845A5 (de) * 1994-05-19 2001-02-15 Tokyo Seimitsu Co Ltd Verfahren zum Positionieren eines Werkstücks und Vorrichtung hierfür.
JP3427956B2 (ja) * 1995-04-14 2003-07-22 信越半導体株式会社 ワイヤーソー装置
JP3187295B2 (ja) * 1995-08-31 2001-07-11 株式会社日平トヤマ ワイヤソー装置

Also Published As

Publication number Publication date
JPH1080854A (ja) 1998-03-31
CH690907A5 (fr) 2001-02-28
DE69717536T2 (de) 2003-08-21
EP0808701A3 (de) 1998-04-08
EP0808701B1 (de) 2002-12-04
EP0808701A2 (de) 1997-11-26
US5913305A (en) 1999-06-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: APPLIED MATERIALS SWITZERLAND SA, CHESEAUX-SUR, CH