DE69232459T2 - Drahtsäge und Abschneideverfahren dafür - Google Patents

Drahtsäge und Abschneideverfahren dafür

Info

Publication number
DE69232459T2
DE69232459T2 DE69232459T DE69232459T DE69232459T2 DE 69232459 T2 DE69232459 T2 DE 69232459T2 DE 69232459 T DE69232459 T DE 69232459T DE 69232459 T DE69232459 T DE 69232459T DE 69232459 T2 DE69232459 T2 DE 69232459T2
Authority
DE
Germany
Prior art keywords
cutting process
wire saw
process therefor
therefor
saw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69232459T
Other languages
English (en)
Other versions
DE69232459D1 (de
Inventor
Kohei Toyama
Etsuo Kiuchi
Kazuo Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Application granted granted Critical
Publication of DE69232459D1 publication Critical patent/DE69232459D1/de
Publication of DE69232459T2 publication Critical patent/DE69232459T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69232459T 1991-11-29 1992-11-26 Drahtsäge und Abschneideverfahren dafür Expired - Lifetime DE69232459T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3316693A JP2516717B2 (ja) 1991-11-29 1991-11-29 ワイヤソ―及びその切断方法

Publications (2)

Publication Number Publication Date
DE69232459D1 DE69232459D1 (de) 2002-04-11
DE69232459T2 true DE69232459T2 (de) 2002-10-10

Family

ID=18079853

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69232459T Expired - Lifetime DE69232459T2 (de) 1991-11-29 1992-11-26 Drahtsäge und Abschneideverfahren dafür

Country Status (4)

Country Link
US (1) US5269285A (de)
EP (1) EP0549893B1 (de)
JP (1) JP2516717B2 (de)
DE (1) DE69232459T2 (de)

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JP2755907B2 (ja) * 1994-06-28 1998-05-25 信越半導体株式会社 ワイヤソー用溝ローラ
DE19510625A1 (de) * 1995-03-23 1996-09-26 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück
US5609148A (en) * 1995-03-31 1997-03-11 Siemens Aktiengesellschaft Method and apparatus for dicing semiconductor wafers
EP0738572B1 (de) * 1995-04-22 2004-01-21 HCT Shaping Systems SA Verfahren zur Orientierung von Einkristallen zum Schneiden in eine Schneidemaschine und Einrichtung zur Durchführung des Verfahrens
JP2885270B2 (ja) * 1995-06-01 1999-04-19 信越半導体株式会社 ワイヤーソー装置及びワークの切断方法
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
JP2891187B2 (ja) * 1995-06-22 1999-05-17 信越半導体株式会社 ワイヤーソー装置及び切断方法
TW355151B (en) * 1995-07-07 1999-04-01 Tokyo Seimitsu Co Ltd A method for cutting single chip material by the steel saw
JP3107143B2 (ja) * 1995-07-14 2000-11-06 株式会社東京精密 ワイヤソーのワイヤトラバース装置
JPH0985737A (ja) * 1995-09-22 1997-03-31 Toray Eng Co Ltd ワイヤ式切断装置
JPH0985736A (ja) * 1995-09-22 1997-03-31 Toray Eng Co Ltd ワイヤ式切断装置
CH691038A5 (fr) * 1996-02-06 2001-04-12 Hct Shaping Systems Sa Dispositif de sciage par fil pour le découpe de tranches fines.
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
MY120514A (en) * 1996-03-26 2005-11-30 Shinetsu Handotai Kk Wire saw and method of slicing a cylindrical workpiece
EP0803336B1 (de) * 1996-04-27 2003-07-02 Nippei Toyama Corporation Drahtsäge und Abschneideverfahren
CH690907A5 (fr) * 1996-05-23 2001-02-28 Hct Shaping Systems Sa Dispositif de sciage par fil
CH691798A5 (fr) * 1996-06-19 2001-10-31 Hct Shaping Systems Sa Centre de découpage destiné à produire des tranches à partir de pièces à trancher.
JPH1052816A (ja) * 1996-08-13 1998-02-24 M Ii M C Kk ワイヤ式切断方法
EP0824055A1 (de) * 1996-08-13 1998-02-18 MEMC Electronic Materials, Inc. Verfahren und Vorrichtung zum Schneiden eines Stabes
US6161533A (en) * 1996-10-01 2000-12-19 Nippei Toyoma Corp. Slurry managing system and slurry managing method
JP3810170B2 (ja) * 1997-01-29 2006-08-16 信越半導体株式会社 ワイヤーソーによるワークの切断方法およびワイヤーソー
JPH10217036A (ja) * 1997-01-29 1998-08-18 Komatsu Electron Metals Co Ltd 半導体結晶棒の切断装置及び切断方法
DE19717379A1 (de) * 1997-04-24 1998-10-29 Wacker Siltronic Halbleitermat Drahtsäge und Montagestation für eine Drahtführungsrolle einer Drahtsäge sowie Verfahren zum Auswechseln einer Drahtführungsrolle
DE19729578B4 (de) * 1997-07-10 2004-12-09 Siltronic Ag Drahtsäge und Verfahren, bei denen die Drahtsäge eingesetzt wird
DE19841492A1 (de) * 1998-09-10 2000-03-23 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Abtrennen einer Vielzahl von Scheiben von einem sprödharten Werkstück
US6652356B1 (en) * 1999-01-20 2003-11-25 Shin-Etsu Handotai Co., Ltd. Wire saw and cutting method
US6112738A (en) * 1999-04-02 2000-09-05 Memc Electronics Materials, Inc. Method of slicing silicon wafers for laser marking
US6352071B1 (en) 2000-06-20 2002-03-05 Seh America, Inc. Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw
CH694182A5 (fr) * 2000-11-20 2004-08-31 Hct Shaping Systems Sa Dispositif de sciage par fil.
DE10122628B4 (de) * 2001-05-10 2007-10-11 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
US20030170948A1 (en) * 2002-03-07 2003-09-11 Memc Electronic Materials, Inc. Method and apparatus for slicing semiconductor wafers
US6889684B2 (en) * 2002-11-06 2005-05-10 Seh America, Inc. Apparatus, system and method for cutting a crystal ingot
JP4083152B2 (ja) * 2004-07-29 2008-04-30 日本碍子株式会社 ワイヤーソー装置
WO2006061043A1 (de) * 2004-12-10 2006-06-15 Freiberger Compound Materials Gmbh Werkstückhalterung und verfahren zum drahtsägen
US7878883B2 (en) * 2006-01-26 2011-02-01 Memc Electronics Materials, Inc. Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
JP4791306B2 (ja) * 2006-09-22 2011-10-12 信越半導体株式会社 切断方法
JP4965949B2 (ja) * 2006-09-22 2012-07-04 信越半導体株式会社 切断方法
DE102007050483A1 (de) * 2007-10-19 2009-09-10 Meyer Burger Ag Mischung aus einem thixotropen Dispersionsmedium sowie abrasiv wirkenden Körnern als Schleifmittel
JP4998241B2 (ja) * 2007-12-11 2012-08-15 信越半導体株式会社 ワイヤソーによるワークの切断方法およびワイヤソー
CN101970193A (zh) * 2008-02-11 2011-02-09 Memc电子材料有限公司 用于将锭线锯切片成晶片中的碳纳米管加强线锯梁
JP2010029955A (ja) * 2008-07-25 2010-02-12 Shin Etsu Handotai Co Ltd ワイヤソーの運転再開方法及びワイヤソー
US20100126488A1 (en) * 2008-11-25 2010-05-27 Abhaya Kumar Bakshi Method and apparatus for cutting wafers by wire sawing
US20110017230A1 (en) * 2009-07-27 2011-01-27 Memc Electronic Materials, Inc. Method and System for Processing Abrasive Slurry
KR20120037576A (ko) * 2010-10-12 2012-04-20 주식회사 엘지실트론 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법
DE102011005949B4 (de) * 2011-03-23 2012-10-31 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
JP5427822B2 (ja) * 2011-04-05 2014-02-26 ジルトロニック アクチエンゲゼルシャフト ワイヤーソーによるワークの切断方法
US20130144421A1 (en) * 2011-12-01 2013-06-06 Memc Electronic Materials, Spa Systems For Controlling Temperature Of Bearings In A Wire Saw
DE102012201938B4 (de) * 2012-02-09 2015-03-05 Siltronic Ag Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück
JP6011031B2 (ja) * 2012-05-31 2016-10-19 キヤノンマーケティングジャパン株式会社 ワイヤ放電加工装置およびワイヤ放電加工方法
DE102012210047A1 (de) * 2012-06-14 2013-12-19 Crystal-N Gmbh Verfahren zum Schneiden eines Einkristalls
DE102015200198B4 (de) * 2014-04-04 2020-01-16 Siltronic Ag Verfahren zum Abtrennen von Halbleiterscheiben von einem Werkstück mit einem Sägedraht
FR3022478B1 (fr) * 2014-06-23 2017-03-10 Commissariat Energie Atomique Dispositif de decoupe par fil comportant un organe rotatif pourvu de moyens de lubrification du fil
JP6455294B2 (ja) * 2015-04-22 2019-01-23 信越半導体株式会社 ワイヤソー装置
EP3466629B1 (de) * 2017-10-05 2021-08-04 Precision Surfacing Solutions GmbH Drahtsäge zum waferschneiden

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US3831576A (en) * 1971-11-22 1974-08-27 Motorola Inc Machine and method for cutting brittle materials using a reciprocating cutting wire
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US4766875A (en) * 1982-11-22 1988-08-30 Stanford University Endless wire saw having material recovery capability
US4574769A (en) * 1984-02-18 1986-03-11 Ishikawa Ken Ichi Multi-wire vibratory cutting method and apparatus
JPS61125768A (ja) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd 脆性材料の切断方法
US4655191A (en) * 1985-03-08 1987-04-07 Motorola, Inc. Wire saw machine
CH665380A5 (en) * 1986-02-28 1988-05-13 Charles Hauser Cutting machine for brittle materials e.g. during electronic component - has cutting wire(s) driven by roller system to engage workpiece in abrasive liquid bath
JPH0616985B2 (ja) * 1986-04-24 1994-03-09 住友金属工業株式会社 ワイヤソ−における切断方法
JP2673544B2 (ja) * 1988-06-14 1997-11-05 株式会社日平トヤマ 脆性材料の切断方法
WO1990005053A1 (fr) * 1988-11-03 1990-05-17 Photec Industrie S.A. Unite de clivage par abrasion
CH677895A5 (en) * 1988-11-08 1991-07-15 Charles Hauser Wire cutting appts. for silicon - has steel wires passing around cylinders and through abrasive liquid mixture to slice silicon for electronic components
CH678610A5 (en) * 1988-11-19 1991-10-15 Charles Hauser Wire sawing device facilitating control of thin slices - uses abrasive liq. spray at controlled low temp. provided by integral refrigerator and liq. conditioning unit

Also Published As

Publication number Publication date
JPH05147023A (ja) 1993-06-15
EP0549893B1 (de) 2002-03-06
US5269285A (en) 1993-12-14
JP2516717B2 (ja) 1996-07-24
DE69232459D1 (de) 2002-04-11
EP0549893A1 (de) 1993-07-07

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