DE69429978T2 - Verfahren zur Herstellung von Halbleiteranordnungen mit Isolationszonen - Google Patents
Verfahren zur Herstellung von Halbleiteranordnungen mit IsolationszonenInfo
- Publication number
- DE69429978T2 DE69429978T2 DE69429978T DE69429978T DE69429978T2 DE 69429978 T2 DE69429978 T2 DE 69429978T2 DE 69429978 T DE69429978 T DE 69429978T DE 69429978 T DE69429978 T DE 69429978T DE 69429978 T2 DE69429978 T2 DE 69429978T2
- Authority
- DE
- Germany
- Prior art keywords
- production
- semiconductor devices
- isolation zones
- zones
- isolation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5333195A JPH07193121A (ja) | 1993-12-27 | 1993-12-27 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69429978D1 DE69429978D1 (de) | 2002-04-04 |
DE69429978T2 true DE69429978T2 (de) | 2002-10-02 |
Family
ID=18263378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69429978T Expired - Lifetime DE69429978T2 (de) | 1993-12-27 | 1994-12-27 | Verfahren zur Herstellung von Halbleiteranordnungen mit Isolationszonen |
Country Status (5)
Country | Link |
---|---|
US (1) | US5766823A (de) |
EP (1) | EP0660389B1 (de) |
JP (1) | JPH07193121A (de) |
KR (1) | KR0179681B1 (de) |
DE (1) | DE69429978T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3688816B2 (ja) * | 1996-07-16 | 2005-08-31 | 株式会社東芝 | 半導体装置の製造方法 |
US6114741A (en) * | 1996-12-13 | 2000-09-05 | Texas Instruments Incorporated | Trench isolation of a CMOS structure |
KR19980051524A (ko) * | 1996-12-23 | 1998-09-15 | 김영환 | 반도체소자의 소자분리막 제조방법 |
KR19980060506A (ko) * | 1996-12-31 | 1998-10-07 | 김영환 | 반도체 소자의 소자 분리막 형성방법 |
JP3614267B2 (ja) * | 1997-02-05 | 2005-01-26 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
JPH10223747A (ja) * | 1997-02-06 | 1998-08-21 | Nec Corp | 半導体装置の製造方法 |
JP3904676B2 (ja) | 1997-04-11 | 2007-04-11 | 株式会社ルネサステクノロジ | トレンチ型素子分離構造の製造方法およびトレンチ型素子分離構造 |
US5960297A (en) * | 1997-07-02 | 1999-09-28 | Kabushiki Kaisha Toshiba | Shallow trench isolation structure and method of forming the same |
US5981356A (en) * | 1997-07-28 | 1999-11-09 | Integrated Device Technology, Inc. | Isolation trenches with protected corners |
US5837612A (en) * | 1997-08-01 | 1998-11-17 | Motorola, Inc. | Silicon chemical mechanical polish etch (CMP) stop for reduced trench fill erosion and method for formation |
US6103635A (en) * | 1997-10-28 | 2000-08-15 | Fairchild Semiconductor Corp. | Trench forming process and integrated circuit device including a trench |
US6054343A (en) * | 1998-01-26 | 2000-04-25 | Texas Instruments Incorporated | Nitride trench fill process for increasing shallow trench isolation (STI) robustness |
US5976948A (en) * | 1998-02-19 | 1999-11-02 | Advanced Micro Devices | Process for forming an isolation region with trench cap |
US6214699B1 (en) * | 1998-04-01 | 2001-04-10 | Texas Instruments Incorporated | Method for forming an isolation structure in a substrate |
KR19990079343A (ko) * | 1998-04-03 | 1999-11-05 | 윤종용 | 반도체장치의 트렌치 소자분리 방법 |
US6265282B1 (en) * | 1998-08-17 | 2001-07-24 | Micron Technology, Inc. | Process for making an isolation structure |
JP3540633B2 (ja) * | 1998-11-11 | 2004-07-07 | 株式会社東芝 | 半導体装置の製造方法 |
FR2792113B1 (fr) * | 1999-04-06 | 2002-08-09 | St Microelectronics Sa | Procede de realisation d'un circuit integre comportant une tranchee d'isolation laterale accolee a une zone active d'un transistor, et circuit integre correspondant |
KR20000066999A (ko) * | 1999-04-22 | 2000-11-15 | 김영환 | 반도체 장치의 분리구조 제조방법 |
JP2001118920A (ja) * | 1999-10-15 | 2001-04-27 | Seiko Epson Corp | 半導体装置およびその製造方法 |
US6406982B2 (en) * | 2000-06-05 | 2002-06-18 | Denso Corporation | Method of improving epitaxially-filled trench by smoothing trench prior to filling |
JP2002203894A (ja) * | 2001-01-04 | 2002-07-19 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
KR100546852B1 (ko) * | 2002-12-28 | 2006-01-25 | 동부아남반도체 주식회사 | 반도체 소자의 제조 방법 |
US7119403B2 (en) * | 2003-10-16 | 2006-10-10 | International Business Machines Corporation | High performance strained CMOS devices |
US6905943B2 (en) * | 2003-11-06 | 2005-06-14 | Texas Instruments Incorporated | Forming a trench to define one or more isolation regions in a semiconductor structure |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0048175B1 (de) * | 1980-09-17 | 1986-04-23 | Hitachi, Ltd. | Halbleiterbauelement und Verfahren zu dessen Herstellung |
CA1204525A (en) * | 1982-11-29 | 1986-05-13 | Tetsu Fukano | Method for forming an isolation region for electrically isolating elements |
US4666556A (en) * | 1986-05-12 | 1987-05-19 | International Business Machines Corporation | Trench sidewall isolation by polysilicon oxidation |
JP2666384B2 (ja) * | 1988-06-30 | 1997-10-22 | ソニー株式会社 | 半導体装置の製造方法 |
US5290664A (en) * | 1990-03-29 | 1994-03-01 | Sharp Kabushiki Kaisha | Method for preparing electrode for semiconductor device |
US5413966A (en) * | 1990-12-20 | 1995-05-09 | Lsi Logic Corporation | Shallow trench etch |
JPH0629239A (ja) * | 1992-02-27 | 1994-02-04 | Eastman Kodak Co | リフト−オフプロセスを利用した半導体素子におけるセルフアライン拡散バリアの製造方法及び拡散バリアを有する半導体素子 |
-
1993
- 1993-12-27 JP JP5333195A patent/JPH07193121A/ja active Pending
-
1994
- 1994-12-26 KR KR1019940036760A patent/KR0179681B1/ko not_active IP Right Cessation
- 1994-12-27 DE DE69429978T patent/DE69429978T2/de not_active Expired - Lifetime
- 1994-12-27 EP EP94120685A patent/EP0660389B1/de not_active Expired - Lifetime
-
1997
- 1997-09-22 US US08/935,058 patent/US5766823A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0660389B1 (de) | 2002-02-27 |
JPH07193121A (ja) | 1995-07-28 |
KR0179681B1 (ko) | 1999-04-15 |
US5766823A (en) | 1998-06-16 |
DE69429978D1 (de) | 2002-04-04 |
EP0660389A2 (de) | 1995-06-28 |
EP0660389A3 (de) | 1997-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |