DE69402221D1 - Bipolartransistoren und deren Herstellungsverfahren - Google Patents
Bipolartransistoren und deren HerstellungsverfahrenInfo
- Publication number
- DE69402221D1 DE69402221D1 DE69402221T DE69402221T DE69402221D1 DE 69402221 D1 DE69402221 D1 DE 69402221D1 DE 69402221 T DE69402221 T DE 69402221T DE 69402221 T DE69402221 T DE 69402221T DE 69402221 D1 DE69402221 D1 DE 69402221D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing processes
- bipolar transistors
- bipolar
- transistors
- processes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/01—Bipolar transistors-ion implantation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/011—Bipolar transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1101993A | 1993-01-29 | 1993-01-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69402221D1 true DE69402221D1 (de) | 1997-04-30 |
DE69402221T2 DE69402221T2 (de) | 1997-08-14 |
Family
ID=21748506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69402221T Expired - Fee Related DE69402221T2 (de) | 1993-01-29 | 1994-01-17 | Bipolartransistoren und deren Herstellungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (3) | US5675175A (de) |
EP (1) | EP0608999B1 (de) |
JP (2) | JP3564161B2 (de) |
KR (1) | KR100320393B1 (de) |
CN (1) | CN1092559A (de) |
DE (1) | DE69402221T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5389552A (en) * | 1993-01-29 | 1995-02-14 | National Semiconductor Corporation | Transistors having bases with different shape top surfaces |
EP0608999B1 (de) * | 1993-01-29 | 1997-03-26 | National Semiconductor Corporation | Bipolartransistoren und deren Herstellungsverfahren |
KR0151011B1 (ko) * | 1994-11-30 | 1998-10-01 | 김광호 | 바이폴라 트랜지스터 및 그 제조방법 |
US5858828A (en) * | 1997-02-18 | 1999-01-12 | Symbios, Inc. | Use of MEV implantation to form vertically modulated N+ buried layer in an NPN bipolar transistor |
US6586782B1 (en) * | 1998-07-30 | 2003-07-01 | Skyworks Solutions, Inc. | Transistor layout having a heat dissipative emitter |
JP2000100826A (ja) * | 1998-09-28 | 2000-04-07 | Rohm Co Ltd | パワートランジスタ及びそれを用いた半導体集積回路装置 |
DE69942273D1 (de) | 1999-07-21 | 2010-06-02 | St Microelectronics Srl | Verfahren zum Herstellen von CMOS Transistoren nichtflüchtiger Speicher und von vertikalen Bipolartransistoren mit hohem Verstärkungsfaktor |
JP3681942B2 (ja) | 1999-12-28 | 2005-08-10 | 松下電器産業株式会社 | バイポーラトランジスタの製造方法 |
DE10004111A1 (de) * | 2000-01-31 | 2001-08-09 | Infineon Technologies Ag | Bipolartransistor |
US6657280B1 (en) * | 2000-11-13 | 2003-12-02 | International Business Machines Corporation | Redundant interconnect high current bipolar device |
JP2002319590A (ja) * | 2001-04-20 | 2002-10-31 | Denso Corp | 半導体装置 |
KR100415379B1 (ko) * | 2002-01-08 | 2004-01-16 | 주식회사 케이이씨 | 3차원 홀 소자 및 그 제조 방법 |
US6724050B2 (en) * | 2002-01-18 | 2004-04-20 | Texas Instruments Incorporated | ESD improvement by a vertical bipolar transistor with low breakdown voltage and high beta |
DE10240404A1 (de) * | 2002-09-02 | 2004-03-18 | Austriamicrosystems Ag | Hall-Sensor und Verfahren zu dessen Betrieb |
DE10318422B4 (de) * | 2003-04-23 | 2006-08-10 | Infineon Technologies Ag | Hochfrequenz-Bipolartransistor mit Silizidregion und Verfahren zur Herstellung desselben |
US7238565B2 (en) * | 2004-12-08 | 2007-07-03 | International Business Machines Corporation | Methodology for recovery of hot carrier induced degradation in bipolar devices |
US20070093814A1 (en) * | 2005-10-11 | 2007-04-26 | Callahan Ronald Ii | Dynamic spinal stabilization systems |
DE102006035121B4 (de) * | 2006-07-28 | 2011-05-19 | Infineon Technologies Ag | Bipolartransistor mit reduziertem Substratstrom |
JP2008044300A (ja) * | 2006-08-21 | 2008-02-28 | Brother Ind Ltd | 記録装置及びパルス生成制御装置 |
KR100798453B1 (ko) * | 2006-12-16 | 2008-01-28 | (주)삼우교역 | 가구용 오토클로져 |
KR100971212B1 (ko) | 2007-12-28 | 2010-07-20 | 주식회사 동부하이텍 | 반도체 소자 및 그 제조 방법 |
US8669640B2 (en) | 2009-07-14 | 2014-03-11 | Freescale Semiconductor, Inc. | Bipolar transistor |
CN105261639B (zh) * | 2014-07-18 | 2019-02-26 | 稳懋半导体股份有限公司 | 异质接面双极性电晶体 |
MA44821A (fr) | 2016-02-27 | 2019-01-02 | Kinzinger Automation Gmbh | Procédé d'allocation d'une pile de registres virtuels dans une machine à pile |
CN108520896B (zh) * | 2018-05-03 | 2021-01-01 | 西安建筑科技大学 | 一种耐压双极晶体管及其制作方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3988766A (en) * | 1974-04-29 | 1976-10-26 | General Electric Company | Multiple P-N junction formation with an alloy droplet |
US4042947A (en) * | 1976-01-06 | 1977-08-16 | Westinghouse Electric Corporation | High voltage transistor with high gain |
US4804634A (en) * | 1981-04-24 | 1989-02-14 | National Semiconductor Corporation | Integrated circuit lateral transistor structure |
JPS61220465A (ja) * | 1985-03-27 | 1986-09-30 | Toshiba Corp | 半導体装置 |
US5077227A (en) * | 1986-06-03 | 1991-12-31 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for fabricating the same |
JP2565317B2 (ja) * | 1986-12-03 | 1996-12-18 | 富士通株式会社 | 半導体装置の製造方法 |
US5059546A (en) * | 1987-05-01 | 1991-10-22 | Texas Instruments Incorporated | BICMOS process for forming shallow NPN emitters and mosfet source/drains |
US4916083A (en) * | 1987-05-11 | 1990-04-10 | International Business Machines Corporation | High performance sidewall emitter transistor |
US5055418A (en) * | 1987-07-29 | 1991-10-08 | National Semiconductor Corporation | Process for fabricating complementary contactless vertical bipolar transistors |
JPH01220465A (ja) * | 1988-02-29 | 1989-09-04 | Seiko Epson Corp | 半導体装置 |
DE68928787T2 (de) * | 1988-04-11 | 1998-12-24 | Synergy Semiconductor Corp., Santa Clara, Calif. | Verfahren zur Herstellung eines Bipolartransistors |
JPH01274470A (ja) * | 1988-04-26 | 1989-11-02 | Nec Corp | バイポーラ・トランジスタ装置及びその製造方法 |
JP2748420B2 (ja) * | 1988-08-12 | 1998-05-06 | ソニー株式会社 | バイポーラトランジスタ及びその製造方法 |
US5109263A (en) * | 1989-07-28 | 1992-04-28 | Hitachi, Ltd. | Semiconductor device with optimal distance between emitter and trench isolation |
US5237200A (en) * | 1989-07-28 | 1993-08-17 | Hitachi, Ltd. | Semiconductor bipolar transistor with concentric regions |
US5185276A (en) * | 1990-01-31 | 1993-02-09 | International Business Machines Corporation | Method for improving low temperature current gain of bipolar transistors |
JPH0736419B2 (ja) * | 1990-02-09 | 1995-04-19 | 株式会社東芝 | 半導体装置及びその製造方法 |
US5139961A (en) * | 1990-04-02 | 1992-08-18 | National Semiconductor Corporation | Reducing base resistance of a bjt by forming a self aligned silicide in the single crystal region of the extrinsic base |
US5024971A (en) * | 1990-08-20 | 1991-06-18 | Motorola, Inc. | Method for patterning submicron openings using an image reversal layer of material |
US5200347A (en) * | 1991-02-14 | 1993-04-06 | Linear Technology Corporation | Method for improving the radiation hardness of an integrated circuit bipolar transistor |
JP2672199B2 (ja) * | 1991-05-21 | 1997-11-05 | シャープ株式会社 | 半導体装置の製造方法 |
US5208169A (en) * | 1991-06-28 | 1993-05-04 | Texas Instruments Incorporated | Method of forming high voltage bipolar transistor for a BICMOS integrated circuit |
US5204277A (en) * | 1992-02-03 | 1993-04-20 | Motorola, Inc. | Method of forming bipolar transistor having substrate to polysilicon extrinsic base contact |
EP0608999B1 (de) * | 1993-01-29 | 1997-03-26 | National Semiconductor Corporation | Bipolartransistoren und deren Herstellungsverfahren |
US5389552A (en) * | 1993-01-29 | 1995-02-14 | National Semiconductor Corporation | Transistors having bases with different shape top surfaces |
-
1994
- 1994-01-17 EP EP94300327A patent/EP0608999B1/de not_active Expired - Lifetime
- 1994-01-17 DE DE69402221T patent/DE69402221T2/de not_active Expired - Fee Related
- 1994-01-28 CN CN94101094A patent/CN1092559A/zh active Pending
- 1994-01-28 KR KR1019940001542A patent/KR100320393B1/ko not_active IP Right Cessation
- 1994-01-31 JP JP00945794A patent/JP3564161B2/ja not_active Expired - Fee Related
-
1995
- 1995-02-02 US US08/383,139 patent/US5675175A/en not_active Expired - Lifetime
-
1996
- 1996-06-13 US US08/662,956 patent/US5733791A/en not_active Expired - Lifetime
-
1997
- 1997-02-11 US US08/799,670 patent/US5850101A/en not_active Expired - Lifetime
-
2003
- 2003-06-11 JP JP2003166280A patent/JP2004006915A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0608999B1 (de) | 1997-03-26 |
US5850101A (en) | 1998-12-15 |
JP2004006915A (ja) | 2004-01-08 |
US5733791A (en) | 1998-03-31 |
EP0608999A1 (de) | 1994-08-03 |
CN1092559A (zh) | 1994-09-21 |
DE69402221T2 (de) | 1997-08-14 |
JP3564161B2 (ja) | 2004-09-08 |
KR100320393B1 (ko) | 2002-06-20 |
US5675175A (en) | 1997-10-07 |
JPH077011A (ja) | 1995-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |