DE69402139D1 - Plasma Reaktor für Abscheidung- oder Ätz-Prozess - Google Patents

Plasma Reaktor für Abscheidung- oder Ätz-Prozess

Info

Publication number
DE69402139D1
DE69402139D1 DE69402139T DE69402139T DE69402139D1 DE 69402139 D1 DE69402139 D1 DE 69402139D1 DE 69402139 T DE69402139 T DE 69402139T DE 69402139 T DE69402139 T DE 69402139T DE 69402139 D1 DE69402139 D1 DE 69402139D1
Authority
DE
Germany
Prior art keywords
deposition
etching process
plasma reactor
reactor
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69402139T
Other languages
English (en)
Other versions
DE69402139T2 (de
Inventor
David Pearson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel CIT SA
Original Assignee
Alcatel CIT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel CIT SA filed Critical Alcatel CIT SA
Publication of DE69402139D1 publication Critical patent/DE69402139D1/de
Application granted granted Critical
Publication of DE69402139T2 publication Critical patent/DE69402139T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
DE69402139T 1993-08-27 1994-08-23 Plasma Reaktor für Abscheidung- oder Ätz-Prozess Expired - Lifetime DE69402139T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9310301A FR2709397B1 (fr) 1993-08-27 1993-08-27 Réacteur à plasma pour un procédé de dépôt ou de gravure.

Publications (2)

Publication Number Publication Date
DE69402139D1 true DE69402139D1 (de) 1997-04-24
DE69402139T2 DE69402139T2 (de) 1997-07-03

Family

ID=9450413

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69402139T Expired - Lifetime DE69402139T2 (de) 1993-08-27 1994-08-23 Plasma Reaktor für Abscheidung- oder Ätz-Prozess

Country Status (7)

Country Link
US (1) US5401318A (de)
EP (1) EP0641014B1 (de)
JP (1) JP3519790B2 (de)
DE (1) DE69402139T2 (de)
FI (1) FI117368B (de)
FR (1) FR2709397B1 (de)
NO (1) NO308636B1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475333B1 (en) * 1993-07-26 2002-11-05 Nihon Shinku Gijutsu Kabushiki Kaisha Discharge plasma processing device
DE4403125A1 (de) * 1994-02-02 1995-08-03 Fraunhofer Ges Forschung Vorrichtung zur Plasmaerzeugung
US6353206B1 (en) * 1996-05-30 2002-03-05 Applied Materials, Inc. Plasma system with a balanced source
JP2002008996A (ja) * 2000-06-23 2002-01-11 Mitsubishi Heavy Ind Ltd 給電アンテナ及び給電方法
US6402301B1 (en) 2000-10-27 2002-06-11 Lexmark International, Inc Ink jet printheads and methods therefor
WO2002056649A1 (fr) 2000-12-27 2002-07-18 Japan Science And Technology Corporation Generateur plasma
JP5487302B2 (ja) * 2010-11-30 2014-05-07 キヤノンアネルバ株式会社 プラズマ処理装置
CN103855459A (zh) * 2012-11-29 2014-06-11 细美事有限公司 等离子体天线以及具有该天线的用于产生等离子体的装置
KR101468657B1 (ko) * 2012-12-28 2014-12-03 엘아이지에이디피 주식회사 유도 결합 플라즈마 처리 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4810935A (en) * 1985-05-03 1989-03-07 The Australian National University Method and apparatus for producing large volume magnetoplasmas
US5122251A (en) * 1989-06-13 1992-06-16 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5091049A (en) * 1989-06-13 1992-02-25 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US4990229A (en) * 1989-06-13 1991-02-05 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
JPH0711047B2 (ja) * 1990-02-08 1995-02-08 住友軽金属工業株式会社 真空ろう付け用Ａｌ材料
JP2519364B2 (ja) * 1990-12-03 1996-07-31 アプライド マテリアルズ インコーポレイテッド Ｕｈｆ／ｖｈｆ共振アンテナ供給源を用いたプラズマリアクタ
US5280154A (en) * 1992-01-30 1994-01-18 International Business Machines Corporation Radio frequency induction plasma processing system utilizing a uniform field coil

Also Published As

Publication number Publication date
JPH0786191A (ja) 1995-03-31
FR2709397B1 (fr) 1995-09-22
FI943894A (fi) 1995-02-28
US5401318A (en) 1995-03-28
FI117368B (fi) 2006-09-15
DE69402139T2 (de) 1997-07-03
FR2709397A1 (fr) 1995-03-03
JP3519790B2 (ja) 2004-04-19
NO308636B1 (no) 2000-10-02
NO943139L (no) 1995-02-28
FI943894A0 (fi) 1994-08-24
NO943139D0 (no) 1994-08-25
EP0641014A1 (de) 1995-03-01
EP0641014B1 (de) 1997-03-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition