DE69401622D1 - Automatische Bestückungseintichtung für elektronische Teile - Google Patents

Automatische Bestückungseintichtung für elektronische Teile

Info

Publication number
DE69401622D1
DE69401622D1 DE69401622T DE69401622T DE69401622D1 DE 69401622 D1 DE69401622 D1 DE 69401622D1 DE 69401622 T DE69401622 T DE 69401622T DE 69401622 T DE69401622 T DE 69401622T DE 69401622 D1 DE69401622 D1 DE 69401622D1
Authority
DE
Germany
Prior art keywords
electronic parts
automatic assembly
assembly seal
seal
automatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69401622T
Other languages
English (en)
Other versions
DE69401622T2 (de
Inventor
Yoshinori Kano
Masayuki Mohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Application granted granted Critical
Publication of DE69401622D1 publication Critical patent/DE69401622D1/de
Publication of DE69401622T2 publication Critical patent/DE69401622T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
DE69401622T 1993-05-26 1994-05-20 Automatische Bestückungseintichtung für elektronische Teile Expired - Lifetime DE69401622T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5124320A JP2823481B2 (ja) 1993-05-26 1993-05-26 電子部品自動装着装置

Publications (2)

Publication Number Publication Date
DE69401622D1 true DE69401622D1 (de) 1997-03-13
DE69401622T2 DE69401622T2 (de) 1997-09-11

Family

ID=14882423

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401622T Expired - Lifetime DE69401622T2 (de) 1993-05-26 1994-05-20 Automatische Bestückungseintichtung für elektronische Teile

Country Status (5)

Country Link
US (1) US5544411A (de)
EP (1) EP0637199B1 (de)
JP (1) JP2823481B2 (de)
KR (1) KR100502595B1 (de)
DE (1) DE69401622T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3282938B2 (ja) * 1995-01-17 2002-05-20 松下電器産業株式会社 部品装着装置
JP2708016B2 (ja) * 1995-06-14 1998-02-04 松下電器産業株式会社 電子部品自動実装装置
JPH0936592A (ja) * 1995-07-24 1997-02-07 Matsushita Electric Ind Co Ltd 電子部品装着装置
US5767598A (en) 1995-11-30 1998-06-16 Sanyo Electric Co., Ltd. Motor and electronic parts-mounting apparatus incorporating the motor
JP3477321B2 (ja) * 1996-07-25 2003-12-10 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP3745849B2 (ja) * 1996-11-27 2006-02-15 富士機械製造株式会社 回路部品搬送装置
JP3402988B2 (ja) * 1997-01-31 2003-05-06 三洋電機株式会社 電子部品装着装置の上下動カム機構
JP3245081B2 (ja) * 1997-02-04 2002-01-07 松下電器産業株式会社 電子部品実装機
US5953812A (en) * 1997-07-03 1999-09-21 Schlumberger Technologies, Inc. Misinsert sensing in pick and place tooling
US6101707A (en) * 1998-03-03 2000-08-15 Sanyo Electric Co., Ltd. Mounting head for electronic component-mounting apparatus
JPH11251792A (ja) * 1998-03-03 1999-09-17 Matsushita Electric Ind Co Ltd 電子部品装着機
JP4255162B2 (ja) * 1999-04-01 2009-04-15 富士機械製造株式会社 電気部品の装着方法および電気部品装着システム
US6364387B1 (en) * 1999-11-10 2002-04-02 Data I/O Corporation Pick and place system and unit therefor
JP3398109B2 (ja) * 2000-01-27 2003-04-21 三洋電機株式会社 電子部品装着装置
US6732003B1 (en) * 2000-08-07 2004-05-04 Data I/O Corporation Feeder/programming/loader system
US20020041481A1 (en) * 2000-09-28 2002-04-11 Yoshinori Kano Linear motor and electronic component feeding apparatus
US6467824B2 (en) * 2001-03-13 2002-10-22 Data I/O Corporation Floating seal pick and place system and unit therefor
US6625878B2 (en) * 2001-09-05 2003-09-30 Delaware Capital Formation Method and apparatus for improving component placement in a component pick up and place machine
US6651866B2 (en) * 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
US7472737B1 (en) 2003-01-15 2009-01-06 Leannoux Properties Ag L.L.C. Adjustable micro device feeder
JP4974118B2 (ja) * 2005-02-12 2012-07-11 アプライド マテリアルズ インコーポレイテッド 多軸真空モータアセンブリ
JP2012501538A (ja) * 2008-09-01 2012-01-19 ネーデルランツ オルガニサティー フォール トゥーゲパストナトゥールヴェテンシャッペリーク オンデルズーク テーエンオー ピックアンドプレース機
WO2013108390A1 (ja) * 2012-01-19 2013-07-25 富士機械製造株式会社 吸着ノズル及びその異常検出装置
US10440868B2 (en) * 2014-03-20 2019-10-08 Fuji Corporation Rotary head for component mounting device
WO2017009932A1 (ja) * 2015-07-13 2017-01-19 富士機械製造株式会社 部品実装機のヘッドユニット
JP6531721B2 (ja) * 2015-07-29 2019-06-19 株式会社村田製作所 電子部品搬送用テーブル、特性測定装置、選別装置およびテーピング装置
JP6773879B2 (ja) * 2017-02-23 2020-10-21 株式会社Ｆｕｊｉ 部品実装装置
KR101783993B1 (ko) * 2017-03-30 2017-10-10 한화테크윈 주식회사 부품 유지 헤드
JP7348041B2 (ja) * 2019-11-21 2023-09-20 ファナック株式会社 ワーク取出装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
SU1010736A1 (ru) * 1981-01-26 1983-04-07 Предприятие П/Я Х-5618 Устройство дл сортировки радиодеталей по электрическим параметрам
JPH0797019B2 (ja) * 1986-06-12 1995-10-18 松下電器産業株式会社 部品認識用照明方法及びその装置
EP0293175A3 (de) * 1987-05-28 1990-08-22 Sanyo Electric Co., Ltd. Bauteilemontagegerät
JPH07109957B2 (ja) * 1988-06-21 1995-11-22 松下電器産業株式会社 電子部品装着方法
JP2620646B2 (ja) * 1989-06-07 1997-06-18 三洋電機株式会社 電子部品自動装着装置
JP2752174B2 (ja) * 1989-07-20 1998-05-18 三洋電機株式会社 電子部品自動装着装置
JPH0378295A (ja) * 1989-08-21 1991-04-03 Sanyo Electric Co Ltd 部品装着装置
JPH07109959B2 (ja) * 1990-01-18 1995-11-22 シーケーディ株式会社 部品実装装置
JP2802133B2 (ja) * 1990-01-23 1998-09-24 松下電器産業株式会社 部品装着機
JPH07105637B2 (ja) * 1990-05-31 1995-11-13 三洋電機株式会社 部品装着装置
JPH0834359B2 (ja) * 1990-08-09 1996-03-29 松下電器産業株式会社 電子部品実装装置
JP3064404B2 (ja) * 1990-11-22 2000-07-12 松下電器産業株式会社 部品実装機および部品実装方法
JPH0582998A (ja) * 1991-05-17 1993-04-02 Tokico Ltd 部品取付装置
JPH0513993A (ja) * 1991-07-05 1993-01-22 Matsushita Electric Ind Co Ltd 電子部品装着ヘツド
JP3328651B2 (ja) * 1991-08-20 2002-09-30 松下電器産業株式会社 電子部品の実装方法

Also Published As

Publication number Publication date
KR100502595B1 (ko) 2005-11-25
DE69401622T2 (de) 1997-09-11
EP0637199B1 (de) 1997-01-29
KR940027656A (ko) 1994-12-10
JPH06334391A (ja) 1994-12-02
JP2823481B2 (ja) 1998-11-11
EP0637199A1 (de) 1995-02-01
US5544411A (en) 1996-08-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI HIGH-TECH INSTRUMENTS CO., LTD., GUNMA, JP