DE69313310T2 - Halbleiterdruckwandler und Herstellungsverfahren dazu - Google Patents
Halbleiterdruckwandler und Herstellungsverfahren dazuInfo
- Publication number
- DE69313310T2 DE69313310T2 DE69313310T DE69313310T DE69313310T2 DE 69313310 T2 DE69313310 T2 DE 69313310T2 DE 69313310 T DE69313310 T DE 69313310T DE 69313310 T DE69313310 T DE 69313310T DE 69313310 T2 DE69313310 T2 DE 69313310T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- pressure transducer
- semiconductor pressure
- process therefor
- therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49103—Strain gauge making
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP373092 | 1992-01-13 | ||
JP3200892 | 1992-02-19 | ||
JP4225942A JPH05299671A (ja) | 1992-01-13 | 1992-08-25 | 半導体圧力センサ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69313310D1 DE69313310D1 (de) | 1997-10-02 |
DE69313310T2 true DE69313310T2 (de) | 1998-02-19 |
Family
ID=27275949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69313310T Expired - Fee Related DE69313310T2 (de) | 1992-01-13 | 1993-01-13 | Halbleiterdruckwandler und Herstellungsverfahren dazu |
Country Status (3)
Country | Link |
---|---|
US (1) | US5333505A (de) |
EP (1) | EP0552017B1 (de) |
DE (1) | DE69313310T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005012157B4 (de) * | 2004-03-17 | 2017-08-24 | Denso Corporation | Kompakter Drucksensor mit hoher Korrosionsbeständigkeit und hoher Genauigkeit |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2716834B1 (fr) * | 1994-03-02 | 1996-04-26 | Sagep | Dispositif d'enrobage d'un capteur. |
US5559280A (en) * | 1994-11-14 | 1996-09-24 | Eaton Corporation | Combustion chamber pressure transducer and method of making same |
JP2000356561A (ja) * | 1999-04-14 | 2000-12-26 | Denso Corp | 半導体歪みセンサ |
US6401545B1 (en) | 2000-01-25 | 2002-06-11 | Motorola, Inc. | Micro electro-mechanical system sensor with selective encapsulation and method therefor |
US7225670B2 (en) | 2000-05-18 | 2007-06-05 | Seiko Epson Corporation | Mounting structure, module, and liquid container |
US6769319B2 (en) | 2001-07-09 | 2004-08-03 | Freescale Semiconductor, Inc. | Component having a filter |
JP2003247903A (ja) | 2002-02-21 | 2003-09-05 | Denso Corp | 圧力センサ |
WO2004068096A1 (ja) * | 2003-01-30 | 2004-08-12 | Fujikura Ltd. | 半導体圧力センサ及びその製造方法 |
US7318351B2 (en) * | 2005-10-05 | 2008-01-15 | Honeywell International Inc. | Pressure sensor |
US20080277747A1 (en) * | 2007-05-08 | 2008-11-13 | Nazir Ahmad | MEMS device support structure for sensor packaging |
US8084849B2 (en) * | 2007-12-12 | 2011-12-27 | Stats Chippac Ltd. | Integrated circuit package system with offset stacking |
US8536692B2 (en) * | 2007-12-12 | 2013-09-17 | Stats Chippac Ltd. | Mountable integrated circuit package system with mountable integrated circuit die |
US7781261B2 (en) * | 2007-12-12 | 2010-08-24 | Stats Chippac Ltd. | Integrated circuit package system with offset stacking and anti-flash structure |
US7985628B2 (en) * | 2007-12-12 | 2011-07-26 | Stats Chippac Ltd. | Integrated circuit package system with interconnect lock |
US20090243069A1 (en) * | 2008-03-26 | 2009-10-01 | Zigmund Ramirez Camacho | Integrated circuit package system with redistribution |
US9293385B2 (en) * | 2008-07-30 | 2016-03-22 | Stats Chippac Ltd. | RDL patterning with package on package system |
US8643127B2 (en) * | 2008-08-21 | 2014-02-04 | S3C, Inc. | Sensor device packaging |
EP2224218B1 (de) * | 2009-02-25 | 2018-11-28 | Sensirion Automotive Solutions AG | Sensor in einer geformten Verpackung und Herstellungsverfahren dafür |
US7775119B1 (en) * | 2009-03-03 | 2010-08-17 | S3C, Inc. | Media-compatible electrically isolated pressure sensor for high temperature applications |
JP4968371B2 (ja) * | 2010-06-30 | 2012-07-04 | 大日本印刷株式会社 | センサデバイスの製造方法及びセンサデバイス |
CH703737A1 (de) * | 2010-09-13 | 2012-03-15 | Kistler Holding Ag | Drucksensor mit piezoresistivem sensorchip-element. |
US9487388B2 (en) * | 2012-06-21 | 2016-11-08 | Nextinput, Inc. | Ruggedized MEMS force die |
US9032818B2 (en) | 2012-07-05 | 2015-05-19 | Nextinput, Inc. | Microelectromechanical load sensor and methods of manufacturing the same |
JP5973357B2 (ja) * | 2013-02-05 | 2016-08-23 | 株式会社鷺宮製作所 | 圧力検知ユニット及び圧力検知ユニットの製造方法 |
US9902611B2 (en) | 2014-01-13 | 2018-02-27 | Nextinput, Inc. | Miniaturized and ruggedized wafer level MEMs force sensors |
CN107848788B (zh) | 2015-06-10 | 2023-11-24 | 触控解决方案股份有限公司 | 具有容差沟槽的加固的晶圆级mems力传感器 |
CN116907693A (zh) | 2017-02-09 | 2023-10-20 | 触控解决方案股份有限公司 | 集成数字力传感器和相关制造方法 |
WO2018148510A1 (en) | 2017-02-09 | 2018-08-16 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
CN111448446B (zh) | 2017-07-19 | 2022-08-30 | 触控解决方案股份有限公司 | 在mems力传感器中的应变传递堆叠 |
WO2019023309A1 (en) | 2017-07-25 | 2019-01-31 | Nextinput, Inc. | FORCE SENSOR AND INTEGRATED FINGERPRINTS |
US11243126B2 (en) | 2017-07-27 | 2022-02-08 | Nextinput, Inc. | Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture |
WO2019079420A1 (en) | 2017-10-17 | 2019-04-25 | Nextinput, Inc. | SHIFT TEMPERATURE COEFFICIENT COMPENSATION FOR FORCE SENSOR AND STRAIN GAUGE |
WO2019090057A1 (en) | 2017-11-02 | 2019-05-09 | Nextinput, Inc. | Sealed force sensor with etch stop layer |
US11874185B2 (en) | 2017-11-16 | 2024-01-16 | Nextinput, Inc. | Force attenuator for force sensor |
US10962427B2 (en) | 2019-01-10 | 2021-03-30 | Nextinput, Inc. | Slotted MEMS force sensor |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5798830A (en) * | 1980-12-12 | 1982-06-19 | Hitachi Ltd | Semiconductor pressure sensor |
DE3376760D1 (en) * | 1983-11-10 | 1988-06-30 | Kristal Instr Ag | Transducer element, method for its manufacture and its use in a pressure pick-up device |
JPS61171173A (ja) * | 1985-01-25 | 1986-08-01 | Hitachi Ltd | 真空基準圧形半導体圧力変換器 |
US4656454A (en) * | 1985-04-24 | 1987-04-07 | Honeywell Inc. | Piezoresistive pressure transducer with elastomeric seals |
JPS62144368A (ja) * | 1985-12-19 | 1987-06-27 | Nec Corp | 半導体式圧力センサの保護膜 |
JPH061226B2 (ja) * | 1986-05-07 | 1994-01-05 | 日本電装株式会社 | 半導体圧力センサ |
JPS6318231A (ja) * | 1986-07-10 | 1988-01-26 | Shimon Kk | 半導体圧力センサ |
JPS6375537A (ja) * | 1986-09-18 | 1988-04-05 | Toshiba Corp | 自動化学分析装置 |
US4823605A (en) * | 1987-03-18 | 1989-04-25 | Siemens Aktiengesellschaft | Semiconductor pressure sensor with casing and method for its manufacture |
JPH01217231A (ja) * | 1988-02-26 | 1989-08-30 | Fujikura Ltd | 半導体圧力センサ |
US4930929A (en) * | 1989-09-26 | 1990-06-05 | Honeywell Inc. | Glass tube/stainless steel header interface for pressure sensor |
JP2719448B2 (ja) * | 1991-01-24 | 1998-02-25 | 三菱電機株式会社 | 半導体圧力検出装置 |
JPH04258176A (ja) * | 1991-02-12 | 1992-09-14 | Mitsubishi Electric Corp | 半導体圧力センサ |
-
1993
- 1993-01-12 US US08/003,437 patent/US5333505A/en not_active Expired - Fee Related
- 1993-01-13 EP EP93300185A patent/EP0552017B1/de not_active Expired - Lifetime
- 1993-01-13 DE DE69313310T patent/DE69313310T2/de not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005012157B4 (de) * | 2004-03-17 | 2017-08-24 | Denso Corporation | Kompakter Drucksensor mit hoher Korrosionsbeständigkeit und hoher Genauigkeit |
Also Published As
Publication number | Publication date |
---|---|
EP0552017A2 (de) | 1993-07-21 |
EP0552017B1 (de) | 1997-08-27 |
EP0552017A3 (de) | 1994-02-09 |
DE69313310D1 (de) | 1997-10-02 |
US5333505A (en) | 1994-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |