JPS5798830A - Semiconductor pressure sensor - Google Patents

Semiconductor pressure sensor

Info

Publication number
JPS5798830A
JPS5798830A JP17451180A JP17451180A JPS5798830A JP S5798830 A JPS5798830 A JP S5798830A JP 17451180 A JP17451180 A JP 17451180A JP 17451180 A JP17451180 A JP 17451180A JP S5798830 A JPS5798830 A JP S5798830A
Authority
JP
Japan
Prior art keywords
hole
case
communicated
bonded
gage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17451180A
Other languages
Japanese (ja)
Inventor
Terumi Nakazawa
Kenji Tabuchi
Hitoshi Minorikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17451180A priority Critical patent/JPS5798830A/en
Publication of JPS5798830A publication Critical patent/JPS5798830A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061Electrical connection means
    • G01L19/0084Electrical connection means to the outside of the housing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007Fluidic connecting means
    • G01L19/0038Fluidic connecting means being part of the housing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

PURPOSE:To enhance reliability of bonding and to implement mass production, by forming the bottom and the side of a case as a unitary body by molding so that the upper surface of a semicoductor gage which is arranged on the upper surface of a glass table and a lead frame and located on the same plane. CONSTITUTION:Cocave and convex parts 20A-20C of the case 20 are coupled and bonded to concave and convex parts 10A-10C of the upper surface of a housing 10 to which a control circuit part is mounted. A hole 22 which is communicated to a pressure introducing hole 12 is formed at the bottom of the case 20. A metal stand 26 having a through hole 24 which is communicated with the hole 22 is placed thereon. The glass table 11 having a through hole 9 which is communicated with the through hole 24 is bonded to the metal stand 26. A semiconductor gage is bonded to the upper surface of the glass table 11. The lead frame 17 is arranged at the side 20, which is molded to form the unitary body together with the bottom of the case 20, on the same plane as the top of the semiconductor gage. Thus, the reliability of the bonding is enhanced and the mass production is implemented.
JP17451180A 1980-12-12 1980-12-12 Semiconductor pressure sensor Pending JPS5798830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17451180A JPS5798830A (en) 1980-12-12 1980-12-12 Semiconductor pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17451180A JPS5798830A (en) 1980-12-12 1980-12-12 Semiconductor pressure sensor

Publications (1)

Publication Number Publication Date
JPS5798830A true JPS5798830A (en) 1982-06-19

Family

ID=15979781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17451180A Pending JPS5798830A (en) 1980-12-12 1980-12-12 Semiconductor pressure sensor

Country Status (1)

Country Link
JP (1) JPS5798830A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02268228A (en) * 1989-04-11 1990-11-01 Toray Ind Inc Pressure sensor and gas flowmeter using it
EP0552017A2 (en) * 1992-01-13 1993-07-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor and method of manufacturing same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02268228A (en) * 1989-04-11 1990-11-01 Toray Ind Inc Pressure sensor and gas flowmeter using it
EP0552017A2 (en) * 1992-01-13 1993-07-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor and method of manufacturing same
EP0552017A3 (en) * 1992-01-13 1994-02-09 Mitsubishi Electric Corp

Similar Documents

Publication Publication Date Title
JPS57147260A (en) Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS58500880A (en) optoelectronic components
JPS55163868A (en) Lead frame and semiconductor device using the same
JPS5798830A (en) Semiconductor pressure sensor
JPS57176751A (en) Semiconductor device
USD266820S (en) Spaghetti measuring device
JPS57128930A (en) Resin sealing
JPS5782730A (en) Pressure sensor
JPS63200550A (en) Lead frame
JPS5768088A (en) Photosemiconductor device
GB1468873A (en)
JPS56115550A (en) Manufacture of semiconductor device
JPS5742138A (en) Semiconductor device
JPS56114574A (en) Jet type soldering device
JPS5745264A (en) Manufacture of electronic part molded with resin
JPS5743435A (en) Electronic part
JPS56101749A (en) Manufacture of circuit substrate for watch
JPS57190341A (en) Circuit borad composition
JPS57154863A (en) Manufacture of resin sealing type electronic parts
FR2482837B1 (en)
JPS55163867A (en) Lead frame for semiconductor device
JPS55165653A (en) Semiconductor device
USD256696S (en) Electronic calculating machine
JPS57201034A (en) Wiring method for circuit element
JPS56155556A (en) Semiconductor device