JPS5798830A - Semiconductor pressure sensor - Google Patents
Semiconductor pressure sensorInfo
- Publication number
- JPS5798830A JPS5798830A JP17451180A JP17451180A JPS5798830A JP S5798830 A JPS5798830 A JP S5798830A JP 17451180 A JP17451180 A JP 17451180A JP 17451180 A JP17451180 A JP 17451180A JP S5798830 A JPS5798830 A JP S5798830A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- case
- communicated
- bonded
- gage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
PURPOSE:To enhance reliability of bonding and to implement mass production, by forming the bottom and the side of a case as a unitary body by molding so that the upper surface of a semicoductor gage which is arranged on the upper surface of a glass table and a lead frame and located on the same plane. CONSTITUTION:Cocave and convex parts 20A-20C of the case 20 are coupled and bonded to concave and convex parts 10A-10C of the upper surface of a housing 10 to which a control circuit part is mounted. A hole 22 which is communicated to a pressure introducing hole 12 is formed at the bottom of the case 20. A metal stand 26 having a through hole 24 which is communicated with the hole 22 is placed thereon. The glass table 11 having a through hole 9 which is communicated with the through hole 24 is bonded to the metal stand 26. A semiconductor gage is bonded to the upper surface of the glass table 11. The lead frame 17 is arranged at the side 20, which is molded to form the unitary body together with the bottom of the case 20, on the same plane as the top of the semiconductor gage. Thus, the reliability of the bonding is enhanced and the mass production is implemented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17451180A JPS5798830A (en) | 1980-12-12 | 1980-12-12 | Semiconductor pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17451180A JPS5798830A (en) | 1980-12-12 | 1980-12-12 | Semiconductor pressure sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5798830A true JPS5798830A (en) | 1982-06-19 |
Family
ID=15979781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17451180A Pending JPS5798830A (en) | 1980-12-12 | 1980-12-12 | Semiconductor pressure sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5798830A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02268228A (en) * | 1989-04-11 | 1990-11-01 | Toray Ind Inc | Pressure sensor and gas flowmeter using it |
EP0552017A2 (en) * | 1992-01-13 | 1993-07-21 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor and method of manufacturing same |
-
1980
- 1980-12-12 JP JP17451180A patent/JPS5798830A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02268228A (en) * | 1989-04-11 | 1990-11-01 | Toray Ind Inc | Pressure sensor and gas flowmeter using it |
EP0552017A2 (en) * | 1992-01-13 | 1993-07-21 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor and method of manufacturing same |
EP0552017A3 (en) * | 1992-01-13 | 1994-02-09 | Mitsubishi Electric Corp |
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