JPS56114574A - Jet type soldering device - Google Patents

Jet type soldering device

Info

Publication number
JPS56114574A
JPS56114574A JP1747280A JP1747280A JPS56114574A JP S56114574 A JPS56114574 A JP S56114574A JP 1747280 A JP1747280 A JP 1747280A JP 1747280 A JP1747280 A JP 1747280A JP S56114574 A JPS56114574 A JP S56114574A
Authority
JP
Japan
Prior art keywords
printed substrate
soldering
jet flow
solder
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1747280A
Other languages
Japanese (ja)
Other versions
JPS6343193B2 (en
Inventor
Hironobu Egashira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1747280A priority Critical patent/JPS56114574A/en
Publication of JPS56114574A publication Critical patent/JPS56114574A/en
Publication of JPS6343193B2 publication Critical patent/JPS6343193B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To increase the amount of solder and to improve the soldering strength, by constituting the output of pump so that it is changed, and by making arrangement so that the height of jet flow is changed within the limit of soldering condition. CONSTITUTION:When printed substrate 18 is brought to a prescribed location, the output of pump 13 is increased and plane of jet flow 15 of solder 14 is brought up and moves so that it contacts with the lower surface of printed substrate 18. When the whole area of lower surface of printed substrate 18 contacts with plane of jet flow 15, the output of pump 13 is reduced by the signal which has detected the location of hanger 16, and plane of jet flow 15 is lowered and separated from the lower surface of printed substrate 18. Under this condition, printed substrate 18 is sent along the direction of arrow A by hanger 16 and soldering is completed. When soldering is made in this manner, solder 20 is adhered spheroidally to lead terminal 19 of electronic parts 17 mounted on printed substrate 18 and the rand section of substrate 18, and the reliability of soldering strength is considerably high.
JP1747280A 1980-02-14 1980-02-14 Jet type soldering device Granted JPS56114574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1747280A JPS56114574A (en) 1980-02-14 1980-02-14 Jet type soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1747280A JPS56114574A (en) 1980-02-14 1980-02-14 Jet type soldering device

Publications (2)

Publication Number Publication Date
JPS56114574A true JPS56114574A (en) 1981-09-09
JPS6343193B2 JPS6343193B2 (en) 1988-08-29

Family

ID=11944947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1747280A Granted JPS56114574A (en) 1980-02-14 1980-02-14 Jet type soldering device

Country Status (1)

Country Link
JP (1) JPS56114574A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61289965A (en) * 1985-06-17 1986-12-19 Meisho Kk Jet type solder tank
JPS63163265U (en) * 1987-08-21 1988-10-25
US5927302A (en) * 1992-04-07 1999-07-27 Fujitsu Limited Method for rinsing plate-shaped articles and cleaning bath and cleaning equipment used in the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61289965A (en) * 1985-06-17 1986-12-19 Meisho Kk Jet type solder tank
JPH0327301B2 (en) * 1985-06-17 1991-04-15 Meisho Kk
JPS63163265U (en) * 1987-08-21 1988-10-25
US5927302A (en) * 1992-04-07 1999-07-27 Fujitsu Limited Method for rinsing plate-shaped articles and cleaning bath and cleaning equipment used in the same

Also Published As

Publication number Publication date
JPS6343193B2 (en) 1988-08-29

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