DE69221430D1 - Verfahren zur Bildung eines Metalleiters für ein Halbleiterbauelement - Google Patents

Verfahren zur Bildung eines Metalleiters für ein Halbleiterbauelement

Info

Publication number
DE69221430D1
DE69221430D1 DE69221430T DE69221430T DE69221430D1 DE 69221430 D1 DE69221430 D1 DE 69221430D1 DE 69221430 T DE69221430 T DE 69221430T DE 69221430 T DE69221430 T DE 69221430T DE 69221430 D1 DE69221430 D1 DE 69221430D1
Authority
DE
Germany
Prior art keywords
forming
semiconductor device
metal conductor
conductor
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69221430T
Other languages
English (en)
Other versions
DE69221430T2 (de
Inventor
Yasuhiko Iwamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69221430D1 publication Critical patent/DE69221430D1/de
Application granted granted Critical
Publication of DE69221430T2 publication Critical patent/DE69221430T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76888—By rendering at least a portion of the conductor non conductive, e.g. oxidation
DE69221430T 1991-11-12 1992-11-12 Verfahren zur Bildung eines Metalleiters für ein Halbleiterbauelement Expired - Fee Related DE69221430T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29532091A JP3271272B2 (ja) 1991-11-12 1991-11-12 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE69221430D1 true DE69221430D1 (de) 1997-09-11
DE69221430T2 DE69221430T2 (de) 1998-03-12

Family

ID=17819092

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69221430T Expired - Fee Related DE69221430T2 (de) 1991-11-12 1992-11-12 Verfahren zur Bildung eines Metalleiters für ein Halbleiterbauelement

Country Status (4)

Country Link
US (1) US5266519A (de)
EP (1) EP0542262B1 (de)
JP (1) JP3271272B2 (de)
DE (1) DE69221430T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5665639A (en) * 1994-02-23 1997-09-09 Cypress Semiconductor Corp. Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal
US5629235A (en) * 1995-07-05 1997-05-13 Winbond Electronics Corporation Method for forming damage-free buried contact
US5693568A (en) * 1995-12-14 1997-12-02 Advanced Micro Devices, Inc. Reverse damascene via structures
JPH10223624A (ja) * 1997-02-06 1998-08-21 Nec Yamagata Ltd 半導体装置の製造方法
US6030877A (en) * 1997-10-06 2000-02-29 Industrial Technology Research Institute Electroless gold plating method for forming inductor structures
US6333556B1 (en) 1997-10-09 2001-12-25 Micron Technology, Inc. Insulating materials
US6251470B1 (en) 1997-10-09 2001-06-26 Micron Technology, Inc. Methods of forming insulating materials, and methods of forming insulating materials around a conductive component
US6858526B2 (en) * 1998-07-14 2005-02-22 Micron Technology, Inc. Methods of forming materials between conductive electrical components, and insulating materials
KR100493008B1 (ko) * 1998-06-30 2006-04-21 삼성전자주식회사 전도성 산화물 전극을 구비하는 반도체 메모리장치
US6350679B1 (en) * 1999-08-03 2002-02-26 Micron Technology, Inc. Methods of providing an interlevel dielectric layer intermediate different elevation conductive metal layers in the fabrication of integrated circuitry
US6635496B2 (en) * 2001-10-12 2003-10-21 Infineon Technologies, Ag Plate-through hard mask for MRAM devices
US6458695B1 (en) 2001-10-18 2002-10-01 Chartered Semiconductor Manufacturing Ltd. Methods to form dual metal gates by incorporating metals and their conductive oxides
JP3714466B2 (ja) * 2002-01-21 2005-11-09 ユーディナデバイス株式会社 半導体装置及びその製造方法
US6891233B2 (en) * 2002-08-26 2005-05-10 Chartered Semiconductor Manufacturing Ltd. Methods to form dual metal gates by incorporating metals and their conductive oxides
US7601566B2 (en) 2005-10-18 2009-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN101297398A (zh) * 2005-10-28 2008-10-29 皇家飞利浦电子股份有限公司 制造结构的方法
WO2012071107A1 (en) * 2010-11-23 2012-05-31 Qd Vision, Inc. Device including semiconductor nanocrystals & method
GB201310837D0 (en) 2013-06-18 2013-07-31 Dupont Teijin Films Us Ltd Polyester film -IV
GB201317705D0 (en) 2013-10-07 2013-11-20 Dupont Teijin Films Us Ltd Copolyesters
GB201411044D0 (en) 2014-06-20 2014-08-06 Dupont Teijin Films Us Ltd Copolyestermides and films made therefrom

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4293637A (en) * 1977-05-31 1981-10-06 Matsushita Electric Industrial Co., Ltd. Method of making metal electrode of semiconductor device
US4182781A (en) * 1977-09-21 1980-01-08 Texas Instruments Incorporated Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating
JPS54161285A (en) * 1978-06-12 1979-12-20 Toshiba Corp Manufacture of semiconductor device
JPS5637636A (en) * 1979-09-05 1981-04-11 Toshiba Corp Semiconductor device with bump
FR2476913B1 (fr) * 1980-02-25 1985-09-13 Nippon Electric Co Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuit
JPS56146246A (en) * 1980-04-14 1981-11-13 Toshiba Corp Manufacture of semiconductor integrated circuit
US4628149A (en) * 1981-11-30 1986-12-09 Nippon Electric Co., Ltd. Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
JPS58202555A (ja) * 1982-05-21 1983-11-25 Nec Corp 半導体装置の製造方法
US4652336A (en) * 1984-09-20 1987-03-24 Siemens Aktiengesellschaft Method of producing copper platforms for integrated circuits
JPS6329940A (ja) * 1986-07-23 1988-02-08 Nec Corp 半導体装置の製造方法
JPS63122248A (ja) * 1986-11-12 1988-05-26 Nec Corp 半導体装置の製造方法
JPH01302842A (ja) * 1988-05-31 1989-12-06 Nec Corp 多層配線構造の半導体装置
EP0383610B1 (de) * 1989-02-17 1997-10-08 Matsushita Electronics Corporation Verfahren zum Herstellen einer Halbleitervorrichtung
US5021867A (en) * 1989-05-30 1991-06-04 Westinghouse Electric Corp. Refractory resistors with etch stop for superconductor integrated circuits
US5130275A (en) * 1990-07-02 1992-07-14 Digital Equipment Corp. Post fabrication processing of semiconductor chips
US5164332A (en) * 1991-03-15 1992-11-17 Microelectronics And Computer Technology Corporation Diffusion barrier for copper features
US5116463A (en) * 1991-06-19 1992-05-26 Microelectroncs And Computer Technology Corporation Detecting completion of electroless via fill

Also Published As

Publication number Publication date
EP0542262A1 (de) 1993-05-19
US5266519A (en) 1993-11-30
JP3271272B2 (ja) 2002-04-02
JPH05206135A (ja) 1993-08-13
EP0542262B1 (de) 1997-08-06
DE69221430T2 (de) 1998-03-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee