DE69214581T2 - Leiterplatte für gedruckte Schaltungen - Google Patents

Leiterplatte für gedruckte Schaltungen

Info

Publication number
DE69214581T2
DE69214581T2 DE69214581T DE69214581T DE69214581T2 DE 69214581 T2 DE69214581 T2 DE 69214581T2 DE 69214581 T DE69214581 T DE 69214581T DE 69214581 T DE69214581 T DE 69214581T DE 69214581 T2 DE69214581 T2 DE 69214581T2
Authority
DE
Germany
Prior art keywords
optionally substituted
base plate
fluorescence
compound
plate according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69214581T
Other languages
German (de)
English (en)
Other versions
DE69214581D1 (de
Inventor
Kenji Ishii
Yoshinori Kondo
Hiroyuki Matsumoto
Norio Sayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Application granted granted Critical
Publication of DE69214581D1 publication Critical patent/DE69214581D1/de
Publication of DE69214581T2 publication Critical patent/DE69214581T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/06—Luminescent materials, e.g. electroluminescent or chemiluminescent containing organic luminescent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69214581T 1991-08-28 1992-08-28 Leiterplatte für gedruckte Schaltungen Expired - Fee Related DE69214581T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP24277991 1991-08-28
JP24278191 1991-08-28
JP24278091 1991-08-28

Publications (2)

Publication Number Publication Date
DE69214581D1 DE69214581D1 (de) 1996-11-21
DE69214581T2 true DE69214581T2 (de) 1997-02-27

Family

ID=27333076

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69214581T Expired - Fee Related DE69214581T2 (de) 1991-08-28 1992-08-28 Leiterplatte für gedruckte Schaltungen

Country Status (5)

Country Link
US (1) US5314740A (https=)
EP (1) EP0530036B1 (https=)
KR (1) KR100240373B1 (https=)
DE (1) DE69214581T2 (https=)
TW (1) TW203675B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW350194B (en) * 1994-11-30 1999-01-11 Mitsubishi Gas Chemical Co Metal-foil-clad composite ceramic board and process for the production thereof the invention relates to the metal-foil-clad composite ceramic board and process for the production
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
US5837356A (en) * 1995-09-22 1998-11-17 Kyocera Corporation Wiring board and method for manufacturing the same
EP0989172A1 (en) * 1998-09-24 2000-03-29 Hitachi Chemical Co., Ltd. Adhesive composition for metal foil, adhesive-coated metal foil, metal clad laminate and related materials using the same
KR100353397B1 (ko) * 2000-02-01 2002-09-18 박용선 음이온 접착제 및 그의 제조방법
US20060019102A1 (en) * 2004-07-26 2006-01-26 Kuppsuamy Kanakarajan Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto
KR100594299B1 (ko) * 2004-10-29 2006-06-30 삼성전자주식회사 유연성 인쇄 회로 및 이것이 구비된 하드 디스크 드라이브
KR20060045208A (ko) * 2004-11-12 2006-05-17 삼성테크윈 주식회사 반도체 팩키지용 회로기판 및 이의 제조방법
FR2927077B1 (fr) * 2008-01-31 2012-05-25 Commissariat Energie Atomique Derives du 1,8-naphtalimide en tant qu'agents de scintillation notamment pour la discrimination entre les neutrons rapides et les rayons gamma
US9201015B2 (en) 2011-07-14 2015-12-01 International Business Machines Corporation Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774188A (en) * 1983-07-29 1988-09-27 American Telephone And Telegraph Company, At&T Bell Laboratories Control of circuit board quality
US4965208A (en) * 1983-07-29 1990-10-23 At&T Bell Laboratories Inspection of multipattern circuit boards
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US5160787A (en) * 1989-01-12 1992-11-03 Mitsubishi Gas Chemical Company, Inc. Electrical laminate having ability to absorb ultraviolet rays

Also Published As

Publication number Publication date
KR100240373B1 (ko) 2000-01-15
EP0530036B1 (en) 1996-10-16
KR930005521A (ko) 1993-03-23
DE69214581D1 (de) 1996-11-21
EP0530036A1 (en) 1993-03-03
US5314740A (en) 1994-05-24
TW203675B (https=) 1993-04-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee