DE69214477D1 - Epoxydharzzusammensetzungen für elektrische Schichtstoffe - Google Patents
Epoxydharzzusammensetzungen für elektrische SchichtstoffeInfo
- Publication number
- DE69214477D1 DE69214477D1 DE69214477T DE69214477T DE69214477D1 DE 69214477 D1 DE69214477 D1 DE 69214477D1 DE 69214477 T DE69214477 T DE 69214477T DE 69214477 T DE69214477 T DE 69214477T DE 69214477 D1 DE69214477 D1 DE 69214477D1
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resin
- resin compositions
- electrical laminates
- laminates
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03100595A JP3106407B2 (ja) | 1991-02-06 | 1991-02-06 | 電気積層板用エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69214477D1 true DE69214477D1 (de) | 1996-11-21 |
DE69214477T2 DE69214477T2 (de) | 1997-03-27 |
Family
ID=14278228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69214477T Expired - Fee Related DE69214477T2 (de) | 1991-02-06 | 1992-02-03 | Epoxydharzzusammensetzungen für elektrische Schichtstoffe |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0498505B1 (de) |
JP (1) | JP3106407B2 (de) |
KR (1) | KR100225739B1 (de) |
DE (1) | DE69214477T2 (de) |
ES (1) | ES2093173T3 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG45134A1 (en) * | 1992-09-22 | 1998-01-16 | Sumitomo Chemical Co | Epoxy resin composition and copper-clad laminate |
JPH11209456A (ja) * | 1998-01-29 | 1999-08-03 | Hitachi Chem Co Ltd | 印刷配線板用難燃性エポキシ樹脂組成物及びこれを用いたプリプレグ、金属箔張り積層板 |
ES2225455T3 (es) | 2000-07-03 | 2005-03-16 | Huntsman Advanced Materials (Switerland) Gmbh | Composiciones endurecibles formadas por compuestos de glicidilo, endurecedores aminicos y nuevos acelerantes del endurecimiento de baja viscosidad. |
KR100398315B1 (ko) * | 2001-02-12 | 2003-09-19 | 한국과학기술원 | 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법 |
WO2009031250A1 (ja) * | 2007-09-05 | 2009-03-12 | Hitachi Chemical Company, Ltd. | 液晶表示装置用スペーサの製造方法、スペーサ形成用インク、並びに液晶表示装置及びその製造方法 |
JP2011063804A (ja) * | 2010-10-15 | 2011-03-31 | Hitachi Chem Co Ltd | プリント配線板用プリプレグおよびそれを用いた積層板 |
KR102114856B1 (ko) * | 2018-08-17 | 2020-06-05 | 신권식 | 위생 장갑 또는 위생백을 수납하기 위한 패키지 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4550128A (en) * | 1984-04-16 | 1985-10-29 | International Business Machines Corporation | Epoxy composition |
JPH0717736B2 (ja) * | 1987-02-17 | 1995-03-01 | 油化シエルエポキシ株式会社 | エポキシ樹脂組成物 |
JPH0671129B2 (ja) * | 1988-04-07 | 1994-09-07 | 帝人株式会社 | プリプレグおよび銅張積層板 |
-
1991
- 1991-02-06 JP JP03100595A patent/JP3106407B2/ja not_active Expired - Lifetime
-
1992
- 1992-01-31 KR KR1019920001528A patent/KR100225739B1/ko not_active IP Right Cessation
- 1992-02-03 DE DE69214477T patent/DE69214477T2/de not_active Expired - Fee Related
- 1992-02-03 EP EP92200299A patent/EP0498505B1/de not_active Expired - Lifetime
- 1992-02-03 ES ES92200299T patent/ES2093173T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100225739B1 (ko) | 1999-10-15 |
KR920016541A (ko) | 1992-09-25 |
EP0498505B1 (de) | 1996-10-16 |
EP0498505A3 (en) | 1992-10-21 |
JP3106407B2 (ja) | 2000-11-06 |
EP0498505A2 (de) | 1992-08-12 |
DE69214477T2 (de) | 1997-03-27 |
JPH04288318A (ja) | 1992-10-13 |
ES2093173T3 (es) | 1996-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |