DE69214477T2 - Epoxydharzzusammensetzungen für elektrische Schichtstoffe - Google Patents

Epoxydharzzusammensetzungen für elektrische Schichtstoffe

Info

Publication number
DE69214477T2
DE69214477T2 DE69214477T DE69214477T DE69214477T2 DE 69214477 T2 DE69214477 T2 DE 69214477T2 DE 69214477 T DE69214477 T DE 69214477T DE 69214477 T DE69214477 T DE 69214477T DE 69214477 T2 DE69214477 T2 DE 69214477T2
Authority
DE
Germany
Prior art keywords
epoxy resin
resin compositions
electrical laminates
laminates
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69214477T
Other languages
English (en)
Other versions
DE69214477D1 (de
Inventor
Kazuo Maeda
Takamasa Watanabe
Takao Fukuzawa
Masayuki Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shell Internationale Research Maatschappij BV
Original Assignee
Shell Internationale Research Maatschappij BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14278228&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69214477(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shell Internationale Research Maatschappij BV filed Critical Shell Internationale Research Maatschappij BV
Publication of DE69214477D1 publication Critical patent/DE69214477D1/de
Application granted granted Critical
Publication of DE69214477T2 publication Critical patent/DE69214477T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
DE69214477T 1991-02-06 1992-02-03 Epoxydharzzusammensetzungen für elektrische Schichtstoffe Expired - Fee Related DE69214477T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03100595A JP3106407B2 (ja) 1991-02-06 1991-02-06 電気積層板用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
DE69214477D1 DE69214477D1 (de) 1996-11-21
DE69214477T2 true DE69214477T2 (de) 1997-03-27

Family

ID=14278228

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69214477T Expired - Fee Related DE69214477T2 (de) 1991-02-06 1992-02-03 Epoxydharzzusammensetzungen für elektrische Schichtstoffe

Country Status (5)

Country Link
EP (1) EP0498505B1 (de)
JP (1) JP3106407B2 (de)
KR (1) KR100225739B1 (de)
DE (1) DE69214477T2 (de)
ES (1) ES2093173T3 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0590463B1 (de) * 1992-09-22 2002-07-10 Sumitomo Chemical Company Limited Halogen enthaltende Epoxidharzzusammensetzung und kupferkaschiertes Laminat
JPH11209456A (ja) * 1998-01-29 1999-08-03 Hitachi Chem Co Ltd 印刷配線板用難燃性エポキシ樹脂組成物及びこれを用いたプリプレグ、金属箔張り積層板
ATE272662T1 (de) 2000-07-03 2004-08-15 Vantico Gmbh & Co Kg Härtbare zusammensetzungen aus glycidylverbindungen, aminischen härtern und niedrigviskosen härtungsbeschleunigern
KR100398315B1 (ko) * 2001-02-12 2003-09-19 한국과학기술원 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법
WO2009031250A1 (ja) * 2007-09-05 2009-03-12 Hitachi Chemical Company, Ltd. 液晶表示装置用スペーサの製造方法、スペーサ形成用インク、並びに液晶表示装置及びその製造方法
JP2011063804A (ja) * 2010-10-15 2011-03-31 Hitachi Chem Co Ltd プリント配線板用プリプレグおよびそれを用いた積層板
KR102114856B1 (ko) * 2018-08-17 2020-06-05 신권식 위생 장갑 또는 위생백을 수납하기 위한 패키지

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4550128A (en) * 1984-04-16 1985-10-29 International Business Machines Corporation Epoxy composition
JPH0717736B2 (ja) * 1987-02-17 1995-03-01 油化シエルエポキシ株式会社 エポキシ樹脂組成物
JPH0671129B2 (ja) * 1988-04-07 1994-09-07 帝人株式会社 プリプレグおよび銅張積層板

Also Published As

Publication number Publication date
KR920016541A (ko) 1992-09-25
DE69214477D1 (de) 1996-11-21
ES2093173T3 (es) 1996-12-16
EP0498505A2 (de) 1992-08-12
EP0498505A3 (en) 1992-10-21
JPH04288318A (ja) 1992-10-13
KR100225739B1 (ko) 1999-10-15
JP3106407B2 (ja) 2000-11-06
EP0498505B1 (de) 1996-10-16

Similar Documents

Publication Publication Date Title
DE69229383D1 (de) Epoxydharzzusammensetzungen
DE3850373D1 (de) Flexibilisierte Epoxidharzzusammensetzungen.
DE69205763D1 (de) Verbinder für elektrische Komponenten.
DE69209169D1 (de) Verbindungstechnik für integrierte Schaltung
DE68923305D1 (de) Elektrische Leitungen für elektronische Bauelemente.
EP0501734A3 (en) Semiconductor device-encapsulating epoxy resin composition
DE69318329D1 (de) Wärmehärtbare Harzzusammensetzungen
DE69119662T2 (de) Epoxydharzzusammensetzung
DE69416706D1 (de) Epoxydharzzusammensetzung
DE69211604T2 (de) Tragschiene für Gehäuse elektrischer Bauteile
DE3481064D1 (de) Epoxydharzzusammensetzung.
FI961596A0 (fi) Järjestely sähköisen kytkennän muodostamiseksi
EP0507271A3 (en) Epoxy resin compositions for use in electrical laminates
DE69214477D1 (de) Epoxydharzzusammensetzungen für elektrische Schichtstoffe
DE69200661D1 (de) Verbinder für elektrische Komponenten.
DE69129146D1 (de) Epoxydharzzusammensetzung
DE69025017D1 (de) Thermohärtende Harzzusammensetzung
DE69126633D1 (de) Leitfähige Harzzusammensetzung
DE3468112D1 (en) Photopolymerizable epoxy resin composition
DE69208940D1 (de) Schaltung zur Hochspannungserzeugung
KR900013007A (ko) 반도체-캡슐화 에폭시 수지 조성물
DE69229932D1 (de) Epoxydharzzusammensetzung für elektrische Schichtstoffe
DE69224326D1 (de) Wärmehärtbare Harzzusammensetzung
DK0601668T3 (da) Epoxyharpikssammensætning
DE69121780D1 (de) Epoxydharzzusammensetzung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee