ES2093173T3 - Composicion de resina epoxi para uso en estratificados electricos. - Google Patents
Composicion de resina epoxi para uso en estratificados electricos.Info
- Publication number
- ES2093173T3 ES2093173T3 ES92200299T ES92200299T ES2093173T3 ES 2093173 T3 ES2093173 T3 ES 2093173T3 ES 92200299 T ES92200299 T ES 92200299T ES 92200299 T ES92200299 T ES 92200299T ES 2093173 T3 ES2093173 T3 ES 2093173T3
- Authority
- ES
- Spain
- Prior art keywords
- epoxy resin
- resin composition
- eterified
- weight
- electric layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
COMPOSICIONES DE RESINA EPOXI PARA SU USO EN LAMINADOS ELECTRICOS QUE COMPRENDEN UNA RESINA EPOXI, UN AGENTE DE CURACION, UN ACELERADOR DE CURACION Y UN SOLVENTE, DICHA RESINA EPOXI CONTIENE, COMO COMPONENTE PRINCIPAL, UNA RESINA EPOXI ESPECIAL "A" CON UN CONTENIDO DE HALOGENO HIDROLIZABLE DE 0.03% EN PESO Y OBTENIDA POR REACCION, (I) UNA RESINA EPOXI DEL TIPO BISFENOL A, (II) UN PRODUCTO DE POLICONDENSACION GLICIDIL-ETERIFICADO DE BISFENOL A Y FORMALDEHIDO, CON UN PUNTO DE ABLANDAMIENTO NO SUPERIOR A 50 C, Y (III) TETRABROMOBISFENOL A, DONDE LA CANTIDAD DE DICHO COMPUESTO DE GLICIDIL-ETERIFICADO (II) PERMANECE EN UN MARGEN ENTRE EL 30 Y EL 1% EN PESO SEGUN EL PESO TOTAL DE LA RESINA "A".
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03100595A JP3106407B2 (ja) | 1991-02-06 | 1991-02-06 | 電気積層板用エポキシ樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2093173T3 true ES2093173T3 (es) | 1996-12-16 |
Family
ID=14278228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92200299T Expired - Lifetime ES2093173T3 (es) | 1991-02-06 | 1992-02-03 | Composicion de resina epoxi para uso en estratificados electricos. |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0498505B1 (es) |
JP (1) | JP3106407B2 (es) |
KR (1) | KR100225739B1 (es) |
DE (1) | DE69214477T2 (es) |
ES (1) | ES2093173T3 (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69332098T2 (de) * | 1992-09-22 | 2003-03-13 | Sumitomo Chemical Co | Halogen enthaltende Epoxidharzzusammensetzung und kupferkaschiertes Laminat |
JPH11209456A (ja) * | 1998-01-29 | 1999-08-03 | Hitachi Chem Co Ltd | 印刷配線板用難燃性エポキシ樹脂組成物及びこれを用いたプリプレグ、金属箔張り積層板 |
ATE272662T1 (de) | 2000-07-03 | 2004-08-15 | Vantico Gmbh & Co Kg | Härtbare zusammensetzungen aus glycidylverbindungen, aminischen härtern und niedrigviskosen härtungsbeschleunigern |
KR100398315B1 (ko) * | 2001-02-12 | 2003-09-19 | 한국과학기술원 | 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법 |
JP5273049B2 (ja) * | 2007-09-05 | 2013-08-28 | 日立化成株式会社 | 液晶表示装置用スペーサの製造方法、並びに液晶表示装置及びその製造方法 |
JP2011063804A (ja) * | 2010-10-15 | 2011-03-31 | Hitachi Chem Co Ltd | プリント配線板用プリプレグおよびそれを用いた積層板 |
KR102114856B1 (ko) * | 2018-08-17 | 2020-06-05 | 신권식 | 위생 장갑 또는 위생백을 수납하기 위한 패키지 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4550128A (en) * | 1984-04-16 | 1985-10-29 | International Business Machines Corporation | Epoxy composition |
JPH0717736B2 (ja) * | 1987-02-17 | 1995-03-01 | 油化シエルエポキシ株式会社 | エポキシ樹脂組成物 |
JPH0671129B2 (ja) * | 1988-04-07 | 1994-09-07 | 帝人株式会社 | プリプレグおよび銅張積層板 |
-
1991
- 1991-02-06 JP JP03100595A patent/JP3106407B2/ja not_active Expired - Lifetime
-
1992
- 1992-01-31 KR KR1019920001528A patent/KR100225739B1/ko not_active IP Right Cessation
- 1992-02-03 ES ES92200299T patent/ES2093173T3/es not_active Expired - Lifetime
- 1992-02-03 EP EP92200299A patent/EP0498505B1/en not_active Expired - Lifetime
- 1992-02-03 DE DE69214477T patent/DE69214477T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH04288318A (ja) | 1992-10-13 |
DE69214477T2 (de) | 1997-03-27 |
KR100225739B1 (ko) | 1999-10-15 |
EP0498505A3 (en) | 1992-10-21 |
KR920016541A (ko) | 1992-09-25 |
EP0498505A2 (en) | 1992-08-12 |
JP3106407B2 (ja) | 2000-11-06 |
EP0498505B1 (en) | 1996-10-16 |
DE69214477D1 (de) | 1996-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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