ES2104843T3 - Procedimiento de fabricacion de laminados termostables de poli(oxido de fenileno)/resina epoxidica. - Google Patents

Procedimiento de fabricacion de laminados termostables de poli(oxido de fenileno)/resina epoxidica.

Info

Publication number
ES2104843T3
ES2104843T3 ES92309181T ES92309181T ES2104843T3 ES 2104843 T3 ES2104843 T3 ES 2104843T3 ES 92309181 T ES92309181 T ES 92309181T ES 92309181 T ES92309181 T ES 92309181T ES 2104843 T3 ES2104843 T3 ES 2104843T3
Authority
ES
Spain
Prior art keywords
epoxy resin
manufacturing procedure
phenylene oxide
optionally
laminates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92309181T
Other languages
English (en)
Inventor
Michael Gerald Minnick
Rakesh Jain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of ES2104843T3 publication Critical patent/ES2104843T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Abstract

LA INVENCION SE REFIERE A UN PROCESO QUE NO HACE USO DE SOLVENTES EN EL QUE PUEDE PROCESARSE OXIDO Y EPOXIDO DE POLIETILENO TERMOENDURECIBLE PARA FORMAR LAMINADOS REFORZADOS CON FIBRA Y ESPECIALMENTE LAMINADOS PREPARADOS MEDIANTE EL PROCESO "WIGGINS TEAPE". UN ASPECTO DE LA INVENCION COMPRENDE LA MEZCLA DEL POLVO DE POLIETILENO CON UN MATERIAL EPOXIDO LIQUIDO, OPCIONALMENTE CON PIRORRETARDANTES Y CATALIZADORES, PREFERIBLEMENTE EN UNA MEZCLADORA DE ALTA VELOCIDAD A UNA ELEVADA TEMPERATURA, POR EJEMPLO EN LA BANDA DE ENTRE 100 Y 130 (GRADOS) C. LA MEZCLA RESULTANTE PARCIALMENTE CURADA SE SOLIDIFICA LO SUFICIENTE PARA SER GRANULADA EN FORMA DE POLVO PARA EFECTUAR UN PROCESAMIENTO "WIGGINS TEAPE" O, OPCIONALMENTE, UN PROCESAMIENTO DE PRENSADO CONVENCIONAL PARA FORMAR LAMINADOS REFORZADOS CON FIBRA. LOS SISTEMAS DE RESINA ASI PREPARADOS EXHIBEN TANTO UNA RESISTENCIA MEJORADA EN LOS PROCESOS DE SOLDADURA COMO UNA RESISTENCIA MEJORADA A LOS SOLVENTES ORGANICOS CUANDO SE COMPARAN CON LOS SISTEMAS TERMOPLASTICOS EXISTENTES.
ES92309181T 1991-10-09 1992-10-08 Procedimiento de fabricacion de laminados termostables de poli(oxido de fenileno)/resina epoxidica. Expired - Lifetime ES2104843T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77347691A 1991-10-09 1991-10-09

Publications (1)

Publication Number Publication Date
ES2104843T3 true ES2104843T3 (es) 1997-10-16

Family

ID=25098412

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92309181T Expired - Lifetime ES2104843T3 (es) 1991-10-09 1992-10-08 Procedimiento de fabricacion de laminados termostables de poli(oxido de fenileno)/resina epoxidica.

Country Status (7)

Country Link
EP (1) EP0537005B1 (es)
JP (1) JP3300426B2 (es)
KR (1) KR100240570B1 (es)
BR (1) BR9203920A (es)
DE (1) DE69221250T2 (es)
ES (1) ES2104843T3 (es)
TW (1) TW203081B (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308565A (en) * 1993-02-05 1994-05-03 General Electric Company Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance
US6079866A (en) * 1998-02-19 2000-06-27 General Electric Company Mixing apparatus for mixing thermosetting and thermoplastic resin blends prior to molding
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
KR100595771B1 (ko) 2001-09-20 2006-06-30 아사히 가세이 케미칼즈 가부시키가이샤 관능화 폴리페닐렌에테르
US7429800B2 (en) 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US7858726B2 (en) 2006-02-21 2010-12-28 Asahi Kasei Chemichals Corporation Process for producing low-molecular polyphenylene ether
AU2012300600B2 (en) 2011-09-02 2014-09-11 Bae Systems Plc Curable monomers
US9296916B2 (en) 2013-08-09 2016-03-29 Sabic Global Technologies B.V. Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same
AU2016350780B2 (en) 2015-11-03 2020-09-10 Kimberly-Clark Worldwide, Inc. Paper tissue with high bulk and low lint
US11255051B2 (en) 2017-11-29 2022-02-22 Kimberly-Clark Worldwide, Inc. Fibrous sheet with improved properties
GB201809830D0 (en) * 2018-06-15 2018-08-01 Hexcel Composties Ltd Epoxy resin formulations
AU2018433810A1 (en) 2018-07-25 2021-02-04 Kimberly-Clark Worldwide, Inc. Process for making three-dimensional foam-laid nonwovens

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1129757A (en) * 1966-05-31 1968-10-09 Wiggins Teape Res Dev Method of producing a thixotropic liquid suspending medium particularly for the forming of non-woven fibrous webs
DE3789054T2 (de) * 1986-12-25 1994-07-07 Toray Industries Zähe Verbundmaterialien.
JPS6424825A (en) * 1987-07-20 1989-01-26 Mitsubishi Gas Chemical Co Epoxy resin composition
EP0436212A3 (en) * 1990-01-02 1992-07-29 General Electric Company Polyphenylene ether-polyepoxide compositions rapidly curable to flame retardant, solderable materials

Also Published As

Publication number Publication date
KR930008034A (ko) 1993-05-20
JP3300426B2 (ja) 2002-07-08
EP0537005A1 (en) 1993-04-14
TW203081B (es) 1993-04-01
EP0537005B1 (en) 1997-07-30
DE69221250T2 (de) 1998-02-19
DE69221250D1 (de) 1997-09-04
KR100240570B1 (ko) 2000-01-15
BR9203920A (pt) 1993-04-27
JPH05214129A (ja) 1993-08-24

Similar Documents

Publication Publication Date Title
ES2104843T3 (es) Procedimiento de fabricacion de laminados termostables de poli(oxido de fenileno)/resina epoxidica.
ES2066758T3 (es) Uso de un poliester termoplastico como un aditivo para resinas epoxidicas.
ES2085100T3 (es) Metodos para incorporar por mezcla fluidos comprimidos con composiciones portadas en disolvente que comprenden polimeros solidos.
FI902943A0 (fi) I hetta haerdbara reaktionshartsblandningar.
ES2183802T3 (es) Materiales preimpregnados de matrices de resina termofraguada, reforzados con fibra y endurecidos, y los compuestos de los mismos.
ES2048140T1 (es) Mezcla de agentes aglutinantes.
ES2069227T3 (es) Compuestos de oxiestirilo y polimeros del mismo.
ES2165061T3 (es) Derivados de 4-aralquilaminopirimidina biciclicos utilizados como inhibidores de la tirosina kinasa.
EP0350232A3 (en) Penetrable, epoxy resin composition
GB1141030A (en) Resin mixtures
DE59106087D1 (de) In Wasser dispergierbare, elektrolytstabile Polyetherester-modifizierte Polyurethanionomere.
MY129026A (en) Phenolic resin molding material
JPS57105476A (en) Bonding and adhesive composition
GB1124428A (en) Sealed structures and process therefor
ES2074249T3 (es) Compuesto tetra-n-glicidilo y mezclas reticulables del mismo.
ES2123266T3 (es) Procedimiento y dispositivo para producir espumas mediante dioxido de carbono disuelto bajo presion.
ES2093173T3 (es) Composicion de resina epoxi para uso en estratificados electricos.
GB916547A (en) Improvements in and relating to thermoset resins
JPS51129498A (en) Thermosetting resin composition
EP0373402A3 (en) Expandable polyetherimide resins
IT1246769B (it) Films multistrato termoretraibili perfezionati a base di resine olefiniche contenenti anche resine non olefiniche.
Bauer Application of epoxy resins in advanced composites
ES2081277T3 (es) Agente aglutinante liquido.
KR960010196A (ko) 폐품을 이용한 방수, 방부, 영구적 인공 대용 목재의 제조 방법
JPS57128763A (en) Adhesive for resin-rich wood

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 537005

Country of ref document: ES