DE69221250T2 - Verfahren zur Herstellung von Laminaten aus hitzehärtbarem Polyphenyloxid/-epoxid - Google Patents
Verfahren zur Herstellung von Laminaten aus hitzehärtbarem Polyphenyloxid/-epoxidInfo
- Publication number
- DE69221250T2 DE69221250T2 DE69221250T DE69221250T DE69221250T2 DE 69221250 T2 DE69221250 T2 DE 69221250T2 DE 69221250 T DE69221250 T DE 69221250T DE 69221250 T DE69221250 T DE 69221250T DE 69221250 T2 DE69221250 T2 DE 69221250T2
- Authority
- DE
- Germany
- Prior art keywords
- production
- epoxy laminates
- polyphenyl oxide
- thermosetting polyphenyl
- thermosetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77347691A | 1991-10-09 | 1991-10-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69221250D1 DE69221250D1 (de) | 1997-09-04 |
DE69221250T2 true DE69221250T2 (de) | 1998-02-19 |
Family
ID=25098412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69221250T Expired - Fee Related DE69221250T2 (de) | 1991-10-09 | 1992-10-08 | Verfahren zur Herstellung von Laminaten aus hitzehärtbarem Polyphenyloxid/-epoxid |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0537005B1 (de) |
JP (1) | JP3300426B2 (de) |
KR (1) | KR100240570B1 (de) |
BR (1) | BR9203920A (de) |
DE (1) | DE69221250T2 (de) |
ES (1) | ES2104843T3 (de) |
TW (1) | TW203081B (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308565A (en) * | 1993-02-05 | 1994-05-03 | General Electric Company | Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance |
US6079866A (en) * | 1998-02-19 | 2000-06-27 | General Electric Company | Mixing apparatus for mixing thermosetting and thermoplastic resin blends prior to molding |
US7022777B2 (en) * | 2001-06-28 | 2006-04-04 | General Electric | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
WO2003027167A1 (fr) | 2001-09-20 | 2003-04-03 | Asahi Kasei Chemicals Corporation | Ether de polyphenylene fonctionnalise |
US20070004871A1 (en) * | 2005-06-30 | 2007-01-04 | Qiwei Lu | Curable composition and method |
US7429800B2 (en) | 2005-06-30 | 2008-09-30 | Sabic Innovative Plastics Ip B.V. | Molding composition and method, and molded article |
US7858726B2 (en) | 2006-02-21 | 2010-12-28 | Asahi Kasei Chemichals Corporation | Process for producing low-molecular polyphenylene ether |
AU2012300600B2 (en) | 2011-09-02 | 2014-09-11 | Bae Systems Plc | Curable monomers |
US9296916B2 (en) | 2013-08-09 | 2016-03-29 | Sabic Global Technologies B.V. | Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same |
BR112018007748B1 (pt) | 2015-11-03 | 2022-07-26 | Kimberly-Clark Worldwide, Inc. | Produto de tecido de papel, produto de limpeza, e, artigo absorvente de cuidado pessoal |
KR102165232B1 (ko) | 2017-11-29 | 2020-10-13 | 킴벌리-클라크 월드와이드, 인크. | 개선된 특성을 갖는 섬유 시트 |
GB201809830D0 (en) * | 2018-06-15 | 2018-08-01 | Hexcel Composties Ltd | Epoxy resin formulations |
KR102299453B1 (ko) | 2018-07-25 | 2021-09-08 | 킴벌리-클라크 월드와이드, 인크. | 3차원 폼-레이드 부직포 제조 공정 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1129757A (en) * | 1966-05-31 | 1968-10-09 | Wiggins Teape Res Dev | Method of producing a thixotropic liquid suspending medium particularly for the forming of non-woven fibrous webs |
ES2051274T3 (es) * | 1986-12-25 | 1994-06-16 | Toray Industries | Materiales compuestos altamente resistentes. |
JPS6424825A (en) * | 1987-07-20 | 1989-01-26 | Mitsubishi Gas Chemical Co | Epoxy resin composition |
EP0436212A3 (en) * | 1990-01-02 | 1992-07-29 | General Electric Company | Polyphenylene ether-polyepoxide compositions rapidly curable to flame retardant, solderable materials |
-
1992
- 1992-04-18 TW TW081103047A patent/TW203081B/zh active
- 1992-10-08 JP JP26901992A patent/JP3300426B2/ja not_active Expired - Fee Related
- 1992-10-08 KR KR1019920018480A patent/KR100240570B1/ko not_active IP Right Cessation
- 1992-10-08 DE DE69221250T patent/DE69221250T2/de not_active Expired - Fee Related
- 1992-10-08 BR BR929203920A patent/BR9203920A/pt not_active IP Right Cessation
- 1992-10-08 ES ES92309181T patent/ES2104843T3/es not_active Expired - Lifetime
- 1992-10-08 EP EP92309181A patent/EP0537005B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH05214129A (ja) | 1993-08-24 |
EP0537005A1 (de) | 1993-04-14 |
DE69221250D1 (de) | 1997-09-04 |
ES2104843T3 (es) | 1997-10-16 |
BR9203920A (pt) | 1993-04-27 |
TW203081B (de) | 1993-04-01 |
EP0537005B1 (de) | 1997-07-30 |
JP3300426B2 (ja) | 2002-07-08 |
KR930008034A (ko) | 1993-05-20 |
KR100240570B1 (ko) | 2000-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |