DE69521519T2 - Laminatzubereitung mit niedrigem gehalt an flüchtigen organischen verbindungen - Google Patents

Laminatzubereitung mit niedrigem gehalt an flüchtigen organischen verbindungen

Info

Publication number
DE69521519T2
DE69521519T2 DE69521519T DE69521519T DE69521519T2 DE 69521519 T2 DE69521519 T2 DE 69521519T2 DE 69521519 T DE69521519 T DE 69521519T DE 69521519 T DE69521519 T DE 69521519T DE 69521519 T2 DE69521519 T2 DE 69521519T2
Authority
DE
Germany
Prior art keywords
volatile organic
low
staging
organic solvent
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69521519T
Other languages
English (en)
Other versions
DE69521519D1 (de
DE69521519T3 (de
Inventor
Joseph Gan
R Goodson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10763296&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69521519(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of DE69521519D1 publication Critical patent/DE69521519D1/de
Publication of DE69521519T2 publication Critical patent/DE69521519T2/de
Application granted granted Critical
Publication of DE69521519T3 publication Critical patent/DE69521519T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
DE69521519T 1994-10-21 1995-10-13 Laminatzubereitung mit niedrigem gehalt an flüchtigen organischen verbindungen Expired - Lifetime DE69521519T3 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9421405A GB9421405D0 (en) 1994-10-21 1994-10-21 Low voc laminating formulations
GB9421405 1994-10-21
PCT/US1995/013358 WO1996012751A2 (en) 1994-10-21 1995-10-13 Low voc laminating formulations

Publications (3)

Publication Number Publication Date
DE69521519D1 DE69521519D1 (de) 2001-08-02
DE69521519T2 true DE69521519T2 (de) 2002-03-28
DE69521519T3 DE69521519T3 (de) 2009-07-09

Family

ID=10763296

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69521519T Expired - Lifetime DE69521519T3 (de) 1994-10-21 1995-10-13 Laminatzubereitung mit niedrigem gehalt an flüchtigen organischen verbindungen

Country Status (12)

Country Link
US (1) US7579392B2 (de)
EP (1) EP0787161B2 (de)
JP (1) JP3742104B2 (de)
KR (1) KR100424208B1 (de)
CN (1) CN1075823C (de)
AT (1) ATE202579T1 (de)
BR (1) BR9509514A (de)
DE (1) DE69521519T3 (de)
GB (1) GB9421405D0 (de)
RU (1) RU2159255C2 (de)
TW (1) TW322506B (de)
WO (1) WO1996012751A2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
JP4080546B2 (ja) † 1997-01-21 2008-04-23 ダウ グローバル テクノロジーズ インコーポレイティド エポキシ硬化系のための潜触媒
GB9817799D0 (en) 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
GB9827367D0 (en) 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
KR100721697B1 (ko) * 1999-12-13 2007-05-28 다우 글로벌 테크놀로지스 인크. 난연성 인 원소 함유 에폭시 수지 조성물
WO2001042253A2 (en) 1999-12-13 2001-06-14 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
KR100419063B1 (ko) 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판
TWI335347B (en) 2003-05-27 2011-01-01 Ajinomoto Kk Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
CN1960997B (zh) 2004-05-28 2014-05-07 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
CA2655504A1 (en) * 2006-06-15 2007-12-21 Fibron Ltd. Antibodies blocking fibroblast growth factor receptor activation and methods of use thereof
KR101436657B1 (ko) * 2006-10-19 2014-09-01 다우 글로벌 테크놀로지스 엘엘씨 금속 기재에 대한 접착성이 개선된 경화성 에폭시 수지 조성물 및 코팅 및 섬유-강화 복합 물품의 제조 방법
CN103059267A (zh) * 2007-05-09 2013-04-24 陶氏环球技术公司 含有过量环氧树脂的环氧热固性组合物及其制备方法
CN105713182A (zh) * 2009-01-06 2016-06-29 陶氏环球技术有限责任公司 环氧树脂的金属稳定剂和增长方法
JP5136573B2 (ja) * 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
FR2967296B1 (fr) 2010-11-05 2018-05-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Elements de connexion pour l'hybridation de circuits electroniques
WO2013054320A1 (en) 2011-10-11 2013-04-18 Tel Hashomer Medical Research Infrastructure And Services Ltd. Antibodies to carcinoembryonic antigen-related cell adhesion molecule (ceacam)
CN104136482B (zh) 2011-12-29 2016-08-17 陶氏环球技术有限责任公司 使用多环多胺作为环氧硬化剂的环氧涂料体系
EP3492095A1 (de) 2012-04-01 2019-06-05 Technion Research & Development Foundation Limited Extrazelluläre matrix-metalloproteasen-induktor (emmprin)-peptide und bindende antikörper
US9243294B2 (en) 2013-09-30 2016-01-26 Hadasit Medical Research Services And Development Ltd. Modulation of NLGn4 expression, NK cell activity in non-alcoholic fatty liver disease (NAFLD)
US11427647B2 (en) 2014-04-27 2022-08-30 Famewave Ltd. Polynucleotides encoding humanized antibodies against CEACAM1
AU2015254886A1 (en) 2014-04-27 2016-11-03 Ccam Biotherapeutics Ltd. Humanized antibodies against CEACAM1
WO2016157195A1 (en) 2015-04-01 2016-10-06 Hadasit Medical Research Services And Development Ltd. Inhibitors of neuroligin 4 - neurexin 1-beta protein-protein interaction for treatment of liver disorders
ES2924071T3 (es) 2015-09-02 2022-10-04 Yissum Res Dev Co Of Hebrew Univ Jerusalem Ltd Anticuerpos específicos para inmunoglobulina de células T humanas y dominio ITIM (TIGIT)
CN111978513A (zh) * 2019-06-14 2020-11-24 上海雄润树脂有限公司 一种高压电开关浇注用环氧树脂及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3738862A (en) 1971-11-08 1973-06-12 Shell Oil Co Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates
US3842037A (en) * 1972-06-08 1974-10-15 Shell Oil Co Process for preparing higher molecular weight polyepoxide products by condensing lower molecular weight polyepoxide with polyhydric phenols
US4251594A (en) * 1979-09-27 1981-02-17 The Dow Chemical Company Process for preparing resin impregnated substrates for use in preparing electrical laminates
US4501787A (en) 1983-04-29 1985-02-26 Westinghouse Electric Corp. Flame retardant B-staged epoxy resin prepregs and laminates made therefrom
IL75806A (en) * 1984-07-17 1988-10-31 Dow Chemical Co Partially advanced epoxy resin compositions and products resulting from reacting and curing said compositions
GB8622654D0 (en) 1986-09-19 1986-10-22 Shell Int Research Casting of epoxy resins
US4868059A (en) 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US4820784A (en) * 1988-01-13 1989-04-11 The Dow Chemical Company Modified advanced epoxy resins
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
US5310854A (en) * 1989-08-23 1994-05-10 The Dow Chemical Company Epoxy resin composition and process therefor
ZA913801B (en) 1990-05-21 1993-01-27 Dow Chemical Co Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom
SG43193A1 (en) * 1990-05-21 1997-10-17 Dow Chemical Co Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom
US5169473A (en) * 1990-05-21 1992-12-08 The Dow Chemical Company Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions
US5721323A (en) 1990-05-21 1998-02-24 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
GB9208955D0 (en) * 1992-04-24 1992-06-10 Dow Europ Sa Dicyandiamide solution
CA2147361A1 (en) 1992-11-12 1994-05-26 Michael L. Gould Curable composition containing anhydride resins
CA2151834A1 (en) * 1992-12-21 1994-07-07 Alliedsignal Inc. Solvent free epoxy resin compositions
WO1995012627A1 (en) † 1993-11-02 1995-05-11 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
GB9421407D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Curable epoxy resin accelerated by boric acid and its analogs
KR970700068A (ko) 1994-10-25 1997-01-08 미노루 다나까 슬래브 공급 야드(slab feed yard)

Also Published As

Publication number Publication date
US7579392B2 (en) 2009-08-25
DE69521519D1 (de) 2001-08-02
US20030044521A1 (en) 2003-03-06
EP0787161A2 (de) 1997-08-06
KR970707198A (ko) 1997-12-01
CN1164244A (zh) 1997-11-05
GB9421405D0 (en) 1994-12-07
TW322506B (de) 1997-12-11
EP0787161B1 (de) 2001-06-27
JPH10507787A (ja) 1998-07-28
BR9509514A (pt) 1997-12-30
RU2159255C2 (ru) 2000-11-20
DE69521519T3 (de) 2009-07-09
JP3742104B2 (ja) 2006-02-01
CN1075823C (zh) 2001-12-05
ATE202579T1 (de) 2001-07-15
EP0787161B2 (de) 2008-12-17
WO1996012751A2 (en) 1996-05-02
KR100424208B1 (ko) 2004-09-18
WO1996012751A3 (en) 1996-07-11

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings